Cleanliness Requirements - Ruijie RG-AP810-I Hardware Installation And Reference Manual

Hardware Installation and Reference Guid
2.2.5

Cleanliness Requirements

Dust poses a major threat to the device. The indoor dust takes on a positive or negative
static electric charge when falling on the device, causing poor contact of the metallic
joint. Such electrostatic adhesion may occur more easily when the relative humidity is
low, not only affecting the service life of the device, but also causing communication
faults. Table 2-1 describes the requirements for the dust content and granularity in the
equipment room.
Table 2-1 Requirements for Dust
Dust
Dust particles (diameter ≤ 0.5 μm)
Dust particles (0.5 μm ≤ diameter
≤ 1 μm)
Dust particles (1 μm ≤ diameter ≤
3 μm)
Dust particles (3 μm ≤ diameter ≤
1 μm)
Apart from dust, the salt, acid, and sulfide in the air in the equipment room must meet
strict requirements. These harmful substances will accelerate metal corrosion and
component aging. Therefore, the equipment room should be properly protected against
the intrusion of harmful gases, such as sulfur dioxide, hydrogen sulfide, nitrogen
dioxide, and chlorine gas. Table 2-2 lists limit values for harmful gases.
Table 2-2 Requirements for Gases
Gas
Sulfur dioxide (SO
Hydrogen sulfide (HS)
Nitrogen dioxide (NO
Ammonia gas (NH
Average (mg/m
) 0.2
2
0.006
) 0.04
2
) 0.05
3
Unit
Particles/m
3
Particles/m
3
Particles/m
3
Particles/m
3
)
3
12
Preparing for Installation
Content
≤1.4×10^7
≤7×10^5
≤2.4×10^5
≤1.3×10^5
Maximum (mg/m
3
1.5
0.03
0.15
0.15
)