Cleanliness Requirements - Ruijie RG-MAP852-SF-M Hardware Installation And Reference Manual

Hardware Installation and Reference Guide
2.2.5

Cleanliness Requirements

Dust poses a major threat to the running of the AP. The indoor dust falling on the AP may
be adhered by static electricity, causing poor contact of the metallic joint. Such
electrostatic adherence may occur more easily when the relative humidity is low, not only
affecting the service life of the AP, but also causing communication faults. The following
table describes the requirements for the dust content and granularity in the equipment
room.
Table 2-1 Requirements for Dust
Dust
Dust particles (diameter ≤ 0.5 μm)
Dust particles (0.5 μm < diameter ≤
1 μm)
Dust particles (1 μm < diameter ≤ 3
μm)
Dust particles (3 μm < diameter ≤ 5
μm)
Apart from dust, the salt, acid, and sulfide in the air in the equipment room must also
meet strict requirements. These harmful substances will accelerate metal corrosion and
component aging. Therefore, the equipment room should be properly protected against
the intrusion of harmful gases, such as sulfur dioxide, hydrogen sulfide, nitrogen dioxide,
and chlorine gas. The following table lists limit values for harmful gases.
Table 2-2 Requirements for Gases
Gas
Sulfur dioxide (SO2)
Hydrogen sulfide (H2S)
Nitrogen dioxide (NO2)
Unit
Particles/m3
Particles/m3
Particles/m3
Particles/m3
Average (mg/m3)
0.2
0.006
0.04
17
Preparing for Installation
Content
≤ 1.4 × 10^7
≤ 7 × 10^5
≤ 2.4 × 10^5
≤ 1.3 × 10^5
Maximum (mg/m3)
1.5
0.03
0.15