Gp 6 Electrostatic Discharge Prevention; Gp 7 Machine Specifications - Xerox Phaser 4600 Service Manual

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GP 6 Electrostatic Discharge Prevention

Some semiconductor components, and the respective sub-assemblies that contain them, are
vulnerable to damage by Electrostatic Discharge (ESD). These components include Integrated
Circuits (ICs), Large-Scale Integrated circuits (LSIs), field-effect transistors, and other semi-
conductor chip components. The following techniques will reduce the occurrence of compo-
nent damage caused by static electricity.
Be sure the power is Off to the chassis or the circuit board, and observe all other safety pre-
cautions.
Immediately before handling any semiconductor components assemblies, drain the elec-
trostatic charge from your body. This can be accomplished by touching an earth ground
source or by wearing a wrist strap device connected to an earth ground source. Wearing
a wrist strap will also prevent accumulation of additional bodily static charges. Be sure to
remove the wrist strap before applying power to the unit under test to avoid potential
shock.
After removing a static sensitive assembly from its anti-static bag, replace it on a
grounded conductive surface. If the anti-static bag is conductive, you may ground the bag
and use it as a conductive surface.
Do not use freon-propelled chemicals. These can generate electrical charges sufficient to
damage some devices.
Do not remove a replacement component or electrical sub-assembly from its protective
package until you are ready to install it.
Immediately before removing the protective material from the leads of a replacement
device, touch the protective material to the chassis or circuit assembly into which the
device will be installed.
Minimize body motions when handling unpacked replacement devices. Motion such as
your clothes brushing together, or lifting a foot from a carpeted floor can generate enough
static electricity to damage an electro-statically sensitive device.
Handle IC's and Erasable Programmable Read-Only Memories (EPROM's) carefully to
avoid bending pins.
Pay attention to the direction of parts when mounting or inserting them on the Printed Cir-
cuit Boards (PCB's).
6 General Procedures and Information
GP 6, GP 7

GP 7 Machine Specifications

Functional Specifications
Table 1
lists the functional specifications of the printer.
Table 1 Functional Specifications
Characteristic
Specifications
Printing Process
Laser exposed drum.
Image System
Toner/developer drum and Fuser.
Resolution
600 x 600 dpi (optical)
1200 x 1200 (enhanced)
Maximum Duty Cycle
275,000 sheets/month (A4 size, ISO)
Recommended AMPV
7,000 pgs (A4 size, ISO)
First Page-Out (from Sleep) 50 seconds
Warm-Up Time
Printer Life
5 years or 1,000,000 pages
Operating System
* Assumes a 30 day month of printing.
Electrical Specifications
Table 2
lists the printer's electrical requirements.
Table 2 Electrical Specifications
Characteristic
Primary Line Voltages
Primary Line Voltages Frequency Range 47 - 63 Hz
Power Consumption at Rated Voltage
Input
04/2016
6-10
From Cold Start: Less than 10 minutes
From Energy Star Mode: Less than 4 minutes
Windows 2000/ 2003, 2008 Server/ XP/ Vista/W7
Macintosh: OS 10.5 or higher
Linux
Specifications
90 - 140 VAC
180 - 264 VAC
Printing: 550 W
Idle: 33 W
Power Saver: 11 W
Phaser 4600/4620/4622 Printer Service Manual
Revised

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