Processor And Heatsink Installation - Supermicro X13SWA-TF User Manual

Super X13SWA-TF User's Manual

2.2 Processor and Heatsink Installation

The processor (CPU) and processor carrier should be assembled together first to form
the processor carrier assembly. This will be attached to the heatsink to form the processor
heatsink module (PHM) before being installed into the CPU socket. Before installation, be
sure to perform the following steps below:
•
Please carefully follow the instructions given on the previous page to avoid ESD-related
damages.
•
Shut down the system and then unplug the AC power cord from all power supplies.
•
Check that the plastic protective cover is on the CPU socket and none of the socket pins
are bent. If they are, contact your retailer.
•
When handling the processor, avoid touching or placing direct pressure on the LGA lands
(gold contacts). Improper installation or socket misalignment can cause serious damage
to the processor or CPU socket, which may require manufacturer repairs.
•
Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.
•
Refer to the Supermicro website for updates on processor and memory support.
•
All graphics in this manual are for illustrations only. Your components may look different.
The Intel Xeon W Processor
Intel Xeon W-3400 series CPU
(112L, XCC)
Note: The X13SWA-TF supports two CPU SKUs. Each SKU comes with a specific die
and must use a specific carrier. The Intel Xeon W-3400 series processors come with
Extreme Core Count (XCC) die and must use the CPU carrier E1A; the Intel Xeon
W-2400 series processors come with High/Medium Core Count (MCC) die and must
use the CPU carrier E1B.
Intel Xeon W-2400 series CPU
(64L, MCC)
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