Intel Pentium III Processor 512K Design Manual page 4

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LV Intel
Pentium
III Processor 512K Dual Processor Platform
................................................................................................................................... 38
6.1
THERMTRIP# Requirements ............................................................................................. 38
6.2
THERMTRIP# Erratum ....................................................................................................... 38
7.1
Introduction ......................................................................................................................... 40
7.2
Host Interface AGTL Bus and AGTL Signals...................................................................... 40
7.3
CMOS (Non-AGTL) Signals................................................................................................ 41
7.4
TAP/ITP Checklist............................................................................................................... 42
7.5
Miscellaneous Checklist ..................................................................................................... 42
Figures
1
Sample Board Stackup ................................................................................................................. 9
2
Micro-FCBGA Component Keepout ........................................................................................... 10
3
Micro-FCBGA Package - Top and Bottom Isometric Views ...................................................... 12
4
System Bus T-Topology ............................................................................................................. 14
5
Wired-OR Termination Topology ................................................................................................ 16
6
Simple Terminations ................................................................................................................... 20
7
TCK Termination, DP System .................................................................................................... 21
8
PRDYx# Signal Termination ....................................................................................................... 21
9
RESET# Signal Termination....................................................................................................... 22
10 JTAG Signals TDI/TDO for Processor Only ............................................................................... 23
11 Host Bus Clock Connections ...................................................................................................... 24
12 Single Ended Clocking Topology - CPU ..................................................................................... 25
13 Single Ended Clocking Topology................................................................................................ 25
14 CLKREF Filter Implementation ................................................................................................... 27
15 Single-Ended Clock BSEL Circuit (133 MHz) ............................................................................. 28
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17 Power Distribution for a DP System Motherboard ...................................................................... 31
18 Detailed Power Distribution Model ............................................................................................. 32
19 VRM 8.5 Board Power Distribution Model .................................................................................. 32
20 1206 Capacitor Pad and Via Layouts ......................................................................................... 34
21 Processor PLL Filter ................................................................................................................... 36
22 PLL Power Low Pass Filter Response ....................................................................................... 37
4
................................................................................................... 40
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III Processor 512K Power Supply Scheme ........................................ 31
III
Design Guide

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