Related Manuals for Intel 5100 Series
Summary of Contents for Intel 5100 Series
- Page 1 ® ® Dual-Core Intel Xeon Processor 5100 Series Thermal/Mechanical Design Guidelines June 2006 Reference Number: 313357-001...
- Page 2 Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel's website at http://www.intel.com.
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Page 3: Table Of Contents
Thermal/Mechanical Reference Design ..............11 Mechanical Requirements ................... 11 2.1.1 Processor Mechanical Parameters ............. 11 2.1.2 Dual-Core Intel Xeon Processor 5100 Series Processor Package ....11 2.1.3 Dual-Core Intel Xeon Processor 5100 Series Considerations ......14 Processor Thermal Parameters and Features ............15 2.2.1 Thermal Control Circuit and TDP............... - Page 4 Thermal Profile for the Dual-Core Intel Xeon Processor 5148 ........25 2-10 Thermal Profile for the Dual-Core Intel® Xeon® Processor 5110/5120/5130/5140/5150 ......26 2-11 Thermal Profiles A and B for the Dual-Core Intel® Xeon® Processor 5160....27 2-12 TCONTROL and Fan Speed Control ...............30 2-13 Processor Thermal Characterization Parameter Relationships ........32 2-14 Exploded View of CEK Thermal Solution Components ..........36...
- Page 5 Terms and Descriptions..................8 Processor Mechanical Parameters Table ..............11 Input and Output Conditions for the Dual-Core Intel Xeon Processor 5100 Series Thermal Management Features....19 Processor Core Geometric Center Dimensions ............20 Intel Reference Heatsink Performance Targets for the Dual-Core Intel®...
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Page 6: Revision History
Revision History Revision Description Date Number • Initial release of the document. June 2006 § Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 7: Introduction
Scope The thermal/mechanical solutions described in this document pertain only to a solution(s) intended for use with the Dual-Core Intel Xeon Processor 5100 Series in 1U/Volumetric constrained, 2U, 2U+ and workstation form factors systems. This document contains the mechanical and thermal requirements of the processor cooling ®... -
Page 8: Definition Of Terms
Introduction Note: Contact your Intel field sales representative for the latest revision and order number of this document. Definition of Terms Table 1-2. Terms and Descriptions (Sheet 1 of 2) Term Description Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface. - Page 9 The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets. A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, etc. § Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide...
- Page 10 Introduction Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide...
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Page 11: Thermal/Mechanical Reference Design
Refer to drawings in Appendix In the case of a discrepancy, the most recent Dual-Core Intel® Xeon® Processor 5100 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in Table 2-1 above. These socket limits are defined in the LGA771 Socket Mechanical Design Guide. - Page 12 A. The drawing is superseded with the drawing in the processor Datasheet, should there be any conflicts. Integrated package/socket stackup height information is provided in the LGA771 Socket Mechanical Design Guide. Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide...
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Page 13: Dual-Core Intel® Xeon® Processor 5100 Series Mechanical Drawing
Thermal/Mechanical Reference Design Figure 2-1. Dual-Core Intel® Xeon® Processor 5100 Series Mechanical Drawing Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 14: Dual-Core Intel Xeon Processor 5100 Series Considerations
The load applied by the attachment mechanism must comply with the package and socket specifications, along with the dynamic load added by the mechanical shock and vibration requirements, as identified in Section 2.1.1. Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 15: Processor Thermal Parameters And Features
The Intel reference design for Dual-Core Intel Xeon Processor 5100 Series is using such a heatsink attachment scheme. Refer to Section 2.4... -
Page 16: Digital Thermal Sensor
Xeon Processor 5100 Series Datasheet. In addition, on-die thermal management features called THERMTRIP# and FORCEPR# are available on the Dual-Core Intel Xeon Processor 5100 Series. They provide a thermal management approach to support the continued increases in processor ® ®... -
Page 17: Multiple Core Special Considerations
DTS domain for Dual-Core Intel Xeon Processor 5100 Series. The Dual-Core Intel Xeon Processor 5100 Series contains two cores, both cores are in one domain with one Digital Thermal Sensor per core. Some multiple core processors have a single domain, other processors will have multiple domains. -
Page 18: Fan Speed Control For Dual-Core Intel Xeon Processor 5100 Series
There is only one pin (Pin G5) on each LGA771 socket that accesses the single domain of the Dual-Core Intel Xeon Processor 5100 Series. Through this pin, the single domain receives all temperature sensor values and provides the current hottest value to an external PECI device such as a thermal management system. -
Page 19: Input And Output Conditions For The Dual-Core Intel Xeon Processor 5100 Series Thermal Management Features
FORCEPR# Asserted All Cores TCC Activation Notes: X=1,2, represents any one of the core1and core2 in Dual-Core Intel Xeon Processor 5100 Series. For more information on PROCHOT#, THERMTRIP#, and FORCEPR# see the Dual-Core Intel® Xeon® Processor 5100 Series Datasheet. 2.2.4.5... -
Page 20: Thermal Profile
Figure 2-5. The equation of the thermal profile is defined as: Equation 2-1.y = ax + b Where: y = Processor case temperature, T (°C) CASE Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 21: Thermal Profile Diagram
Once these points are determined, they can be joined by a line, which represents the Thermal Profile of the specific solution. If that line stays at or below the Thermal Profile specification, then that particular solution is deemed as a compliant solution. Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 22: Tcontrol Definition
The value for T is calibrated in manufacturing and configured for each processor CONTROL individually. For the Dual-Core Intel Xeon Processor 5100 Series, the T value is CONTROL obtained by reading a processor model specific register (MSR). NOTE: There is no value to sum as previously required on legacy processors. -
Page 23: Thermal Profile Concepts For The Dual-Core Intel Xeon Processor 5100 Series
Dual Thermal Profile Concept for the Processor 5160 The Dual-Core Intel Xeon Processor 5160 are designed to go into various form factors, including the volumetrically constrained 1U and custom blade form factors. Due to certain limitations of such form factors (that is, airflow, thermal solution height), it is very challenging to meet the thermal requirements of the processor. -
Page 24: Dual Thermal Profile Diagram
42.3°C for Dual-Core Intel Xeon Processor 5160 Thermal Profile A. Thermal Profile B supports volumetrically constrained platforms (that is, 1U, blades, and so forth), and is based on Intel’s 1U air cooling solution. Because of the reduced capability represented by such thermal solutions, designing to Thermal Profile B results in an increased probability of TCC activation and an associated measurable performance loss. -
Page 25: Performance Targets
Thermal Profile A and Thermal Profile B specifications. Section 2.4 of this document also provides details on the 2U+ and 1U Intel reference thermal solutions that are designed to meet the Dual-Core Intel Xeon Processor 5160 Thermal Profile A and Thermal Profile B respectively. 2.2.8 Performance Targets The Thermal Profile specifications for these processors are published in the Dual-Core ®... -
Page 26: Thermal Profile For The Dual-Core Intel® Xeon® Processor 5110/5120/5130/5140/5150
Thermal/Mechanical Reference Design Figure 2-10. Thermal Profile for the Dual-Core Intel® Xeon® Processor 5110/5120/5130/ 5140/5150 TCASE_MAX@TDP TCASE_MAX@TDP Y = 0.385*x +40.0 Y = 0.385*x +40.0 Power [W] Power [W] Note: The thermal specifications shown in this graph are for reference only. Refer to the ®... -
Page 27: Thermal Profiles A And B For The Dual-Core Intel® Xeon® Processor 5160
Table 2-4, Table 2-5 Table 2-6 describe thermal performance target for the Dual- Core Intel Xeon Processor 5100 Series cooling solution enabled by Intel. Table 2-4. Intel Reference Heatsink Performance Targets for the Dual-Core Intel® Xeon® Processor 5148 Parameter Maximum... -
Page 28: Intel Reference Heatsink Performance Targets For The Dual-Core Intel Xeon Processor 5110/5120/5130/5140/5150
Thermal/Mechanical Reference Design Table 2-5. Intel Reference Heatsink Performance Targets for the Dual-Core Intel Xeon Processor 5110/5120/5130/5140/5150 Parameter Maximum Unit Notes Altitude Sea-level Heatsink designed at 0 meters ° C ° C CASE_MAX @ P_profile_min ° C P_profile_min= 26 W. -
Page 29: Characterizing Cooling Solution Performance Requirements
Thermal/Mechanical Reference Design Table 2-6. Intel Reference Heatsink Performance Targets for the Dual-Core Intel Xeon Processor 5160 Parameter Maximum Unit Notes Altitude Sea-level Heatsink designed at 0 meters ° C 2U+ Reference Solution, Thermal Profile A ° C CASE_MAX_A @ P_profile_min °... -
Page 30: Tcontrol And Fan Speed Control
Regardless of which scheme is employed, system designers must ensure that the Thermal Profile specification is met when the processor Digital Thermal Sensor temperature exceeds the T value for a given processor. CONTOL Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 31: Processor Thermal Characterization Parameter Relationships
Ψ is dependent on the heatsink material, thermal conductivity, and geometry. It is also strongly dependent on the air velocity through the fins of the heatsink. Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 32: Processor Thermal Characterization Parameter Relationships
The following provides an illustration of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any Intel processor thermal specifications, and are for illustrative purposes only. Assume the datasheet TDP is 85 W and the case temperature specification is 68°C. -
Page 33: Chassis Thermal Design Considerations
• The area of the surface on which the heat transfer takes place - Without any enhancements, this is the surface of the processor package IHS. One method used to improve thermal performance is by attaching a heatsink to the IHS. A heatsink Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 34: Thermal Interface Material
TIM size. When pre-applied material is used, it is recommended to have a protective application tape over it. This tape must be removed prior to heatsink installation. Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 35: Summary
Assembly Overview of the Intel Reference Thermal Mechanical Design The reference design heatsinks that meet the Dual-Core Intel Xeon Processor 5100 Series processors thermal performance targets are called the Common Enabling Kit (CEK) heatsinks, and are available in 1U, 2U, & 2U+ form factors. Each CEK consists of the following components: •... -
Page 36: Exploded View Of Cek Thermal Solution Components
0.6 mm [0.024 in] longer for a 2.31 mm [0.093 in] thick board, compared to a 1.57 mm [0.062 in] thick board. Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 37: Thermal Solution Performance Characteristics
Pro/Engineer*, Icepak* and Flotherm* models are available on Intel Business Link (IBL). Note: Intel reserves the right to make changes and modifications to the design as necessary. Note: The thermal mechanical reference design for the Dual-Core Intel Xeon Processor 5100... -
Page 38: Cek Heatsink Thermal Performance
® documented within this document, and should refer to the Dual-Core Intel Xeon Processor 5100 Series Datasheet and LGA771 Socket Mechanical Design Guide and for specific details on package/socket loading specifications. Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 39: Thermal Profile Adherence
0.10 0.00 0.00 CFM Through Fins CFM Through Fins 2.4.6 Thermal Profile Adherence The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile for ® ® the Dual-Core Intel Xeon Processor 5148. From Table 2-4 the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.299°C/W and... -
Page 40: Cek Thermal Adherence To Dual-Core Intel Xeon Processor 5148 Thermal Profile
PROFILE_MIN Power [W] Power [W] The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile for the Dual-Core Intel Xeon Processor 5110/5120/5130/5140/5150. From Table 2-5 three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.299 °C/W and the processor local ambient temperature (T... -
Page 41: Cek Thermal Adherence To Dual-Core Intel® Xeon® Processor 5110/5120/5130/5140/5150 Thermal Profile
_PROFILE_MIN _PROFILE_MIN Power [W] Power [W] The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile A for the Dual-Core Intel Xeon Processor 5160. From Table 2-6, the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.236°C/W and the processor local ambient temperature (T ) for this thermal solution is 40°C. -
Page 42: Cek Thermal Adherence To Dual-Core Intel Xeon Processor 5160 Thermal Profile A
= 0.236 * x + 40 y = 0.236 * x + 40 _PROFILE_MIN _PROFILE_MIN Power [W] Power [W] The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B ® ® for the Dual-Core Intel Xeon Processor 5160. From... -
Page 43: Components Overview
Thermal/Mechanical Reference Design Figure 2-20. 1U CEK Thermal Adherence to Dual-Core Intel Xeon Processor 5160 Thermal Profile B CASE MAX_B CASE MAX_B Thermal Profile B Thermal Profile B y = 0.282 * x + 42.4 y = 0.282 * x + 42.4... -
Page 44: Isometric View Of The 1U Cek Heatsink
(mm) [in.] (kg) [lbs] (° C/W) (° C/W) (Pa) [in H [CFM] 50.80 [2.00] 1.0 [2.2] 45.9 [27] 0.229 0.0024 45.3 [0.182] 27.00 [1.06] 0.53 [1.2] 25.5 [15] 0.290 0.0028 82.4 [0.331] Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 45: Recommended Thermal Grease Dispense Weight
In order to avoid damage to the contact locations on the baseboard, the tabs are insulated with a 0.127 mm [0.005 in.] thick Kapton* tape (or equivalent). Figure 2-23 shows an isometric view of the CEK spring design. Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 46: Boxed Active Thermal Solution For The Dual-Core Intel Xeon Processor 5100 Series
Boxed Active Thermal Solution for the Dual-Core Intel Xeon Processor 5100 Series Intel will provide a 2U passive and a 1U passive / active heatsink solution for the boxed Dual-Core Intel Xeon Processor 5100 Series. This active heatsink solution is primarily designed to be used in a pedestal chassis where sufficient air inlet space is present and side directional airflow is not an issue. - Page 47 The active heatsink includes a fan, which requires a +12 V power supply. Platforms must provide a matched fan power header to support the boxed processor. Table 2-10 contains specifications for the input and output signals at the heatsink fan connector. Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide...
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Page 48: Boxed Active Cek Heatsink Solutions With Pwm/Dts Control (Representation Only)47 2-26 Fan Cable Connection (Active Cek)
° C depending on the pedestal chassis layout. Also, while the active heatsink solution is designed to mechanically fit into a 2U chassis, it may require additional space at the top of the heatsink to allow sufficient airflow into the heatsink fan. Therefore, additional Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 49: Boxed Processor Contents
They are as follows: • CEK Spring (supplied by baseboard vendors) • Heatsink standoffs (supplied by chassis vendors) § Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... - Page 50 Thermal/Mechanical Reference Design Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide...
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Page 51: A Mechanical Drawings
The mechanical drawings included in this appendix refer to the thermal mechanical enabling components for the Dual-Core Intel Xeon Processor 5100 Series. Note: Intel reserves the right to make changes and modifications to the design as necessary. Table A-1. Mechanical Drawing List... -
Page 52: Cek Heatsink (Sheet 1 Of 4)
Mechanical Drawings Figure A-1. 2U CEK Heatsink (Sheet 1 of 4) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 53: Cek Heatsink (Sheet 2 Of 4)
Mechanical Drawings Figure A-2. 2U CEK Heatsink (Sheet 2 of 4) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 54: Cek Heatsink (Sheet 3 Of 4)
Mechanical Drawings Figure A-3. 2U CEK Heatsink (Sheet 3 of 4) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 55: Cek Heatsink (Sheet 4 Of 4)
Mechanical Drawings Figure A-4. 2U CEK Heatsink (Sheet 4 of 4) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 56: Cek Spring (Sheet 1 Of 3)
Mechanical Drawings Figure A-5. CEK Spring (Sheet 1 of 3) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 57: Cek Spring (Sheet 2 Of 3)
Mechanical Drawings Figure A-6. CEK Spring (Sheet 2 of 3) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 58: Cek Spring (Sheet 3 Of 3)
Mechanical Drawings Figure A-7. CEK Spring (Sheet 3 of 3) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 59: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 1 Of 6)
Mechanical Drawings Figure A-8. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 60: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 2 Of 6)
Mechanical Drawings Figure A-9. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 2 of 6) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 61: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 3 Of 6)
Mechanical Drawings Figure A-10. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 3 of 6) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 62: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 4 Of 6)
Mechanical Drawings Figure A-11. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 4 of 6) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... - Page 63 Mechanical Drawings Figure A-12. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 5 of 6) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide...
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Page 64: A-13 Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 6 Of 6)
Mechanical Drawings Figure A-13. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 6 of 6) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 65: A-14 1U Cek Heatsink (Sheet 1 Of 4)
Mechanical Drawings Figure A-14. 1U CEK Heatsink (Sheet 1 of 4) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 66: A-15 1U Cek Heatsink (Sheet 2 Of 4)
Mechanical Drawings Figure A-15. 1U CEK Heatsink (Sheet 2 of 4) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 67: A-16 1U Cek Heatsink (Sheet 3 Of 4)
Mechanical Drawings Figure A-16. 1U CEK Heatsink (Sheet 3 of 4) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 68: A-17 1U Cek Heatsink (Sheet 4Of 4)
Mechanical Drawings Figure A-17. 1U CEK Heatsink (Sheet 4of 4) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 69: Active Cek Thermal Solution Volumetric (Sheet 1 Of 3)
Mechanical Drawings Figure A-18. Active CEK Thermal Solution Volumetric (Sheet 1 of 3) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 70: Active Cek Thermal Solution Volumetric (Sheet 2 Of 3)
Mechanical Drawings Figure A-19. Active CEK Thermal Solution Volumetric (Sheet 2 of 3) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 71: Active Cek Thermal Solution Volumetric (Sheet 3 Of 3)
Mechanical Drawings Figure A-20. Active CEK Thermal Solution Volumetric (Sheet 3 of 3) § Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... - Page 72 Mechanical Drawings Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide...
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Page 73: B Heatsink Clip Load Methodology
Figure B-3 shows an example using the Dual-Core Intel Xeon Processor 5100 Series CEK Reference Heatsink designed for the Dual-Core Intel Xeon Processor 5100 Series in the 771–land grid array (LGA) package. Note: When optimizing the heatsink pocket depth, the variation of the load cell height should also be taken into account to make sure that all load cells protrude equally from the heatsink base. -
Page 74: B-1 Load Cell Installation In Machined Heatsink Base Pocket -- Bottom View
Figure B-1. Load Cell Installation in Machined Heatsink Base Pocket -- Bottom View Heatsink Base Heatsink Base Pocket Pocket Package IHS Package IHS Diameter ~ Diameter ~ Outline (Top Outline (Top 29 mm 29 mm Surface) Surface) [~1.15”] [~1.15”] Load Load Cells Cells Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 75: Preload Test Configuration
~ height pocket ~ height of selected of selected load cell load cell Figure B-3. Preload Test Configuration Preload Fixture (copper core with milled out pocket) Load Cells (3x) Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 76: Typical Test Equipment
2. Install the test vehicle in the socket. 3. Assemble the heatsink reworked with the load cells to motherboard as shown for the Dual-Core Intel Xeon Processor 5100 Series CEK-reference heatsink example in Figure B-3, and actuate attach mechanism. -
Page 77: Preload Degradation Under Bake Conditions
Sample rate = 0.01 Hz for the remainder of the bake test 5. Remove assembly from thermal chamber and set into room temperature conditions 6. Record continuous load cell data for next 30 minutes at sample rate of 1 Hz. § Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... - Page 78 Heatsink Clip Load Methodology Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide...
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Page 79: C Safety Requirements
UL94V-2 approved. 2. CSA Certification. All mechanical and thermal enabling components must have CSA certification. 3. Heatsink fins must meet the test requirements of UL1439 for sharp edges. § Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... - Page 80 Safety Requirements Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide...
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Page 81: D Quality And Reliability Requirements
Environmental Reliability Testing D.1.2.1 Structural Reliability Testing The Intel reference heatsinks will be tested in an assembled condition, along with the LGA771 Socket. Details of the Environmental Requirements, and associated stress tests, can be found in the LGA771 Socket Mechanical Design Guide. -
Page 82: Use Conditions Environment
BIOS/Processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/Processor/memory test. D.1.2.3 Post-Test Pass Criteria The post-test pass criteria are: 1. No significant physical damage to the heatsink and retention hardware. Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide... -
Page 83: Material And Recycling Requirements
• All enabling components, including socket and thermal solution parts. The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC Diags is an example of software that can be utilized for this test. - Page 84 Quality and Reliability Requirements Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide...
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Page 85: E Enabled Suppliers Information
Information Supplier Information E.1.1 Intel Enabled Suppliers The Intel reference enabling solution for Dual-Core Intel Xeon Processor 5100 Series is preliminary. The Intel reference solutions have not been verified to meet the criteria outlined in Appendix D. Customers can purchase the Intel reference thermal solution... -
Page 86: Additional Enabled Suppliers
D. Customers can purchase the Intel enabled thermal solution components from the suppliers listed in Table E-1. For additional details, please refer to the Dual-Core Intel Xeon Processor 5100 Series thermal mechanical enabling components drawings in Appendix Table E-2. Suppliers of Alternative Thermal Solutions for the Dual-Core Intel Xeon... - Page 87 Enabled Suppliers Information Table E-2. Suppliers of Alternative Thermal Solutions for the Dual-Core Intel Xeon Processor 5100 Series Development Assembly Component Description Supplier Contact Info Suppliers 1U Heatsink Alternative CEK Copper Fin, David Chao Heatsink Copper Base CNDA AP5281 david_chao@avc.com.tw...
- Page 88 Enabled Suppliers Information Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide...
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