Quectel Smart Module Series Hardware Design page 95

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Smart Module Series
SA800U-WF Hardware Design
The following figure shows the thermal dissipation area:
Figure 33: Thermal Dissipation
NOTE
If a conformal coating is necessary for the module, do NOT use any coating material that may chemically
react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
SA800U-WF_Hardware_Design
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