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Board Specifications
Board Dimensions/Form Factor
When the module is mated with ZCU670 RFMC 2.0 connectors (Samtec LPAF-50-03.0-L-08-2-
K-TR), the mated height between the boards will be 4.0 mm. No component is placed on the
bottom side of the module.
• XM755 Dimensions:
Length: 9.85" (250.19 mm)
Width: 4.90" (124.46 mm)
Thickness: 0.065" (1.651 mm)
UG1532 (v1.0) March 30, 2022
ZCU670 Board User Guide
Appendix D: HW-XM650/755 Balun Daughter Cards for RFSoC EVM
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