Features - AMD Xilinx ZCU670 User Manual

Tile
DAC
Note: For ZCU670-specific mapping, see XM755 to ZCU670 Signal Mapping (XTP719).

Features

The XM755 balun add-on card uses the 8 x 50 x 2 female LPAM-50-01.0-L-08-2-K-TR
connectors and pinout as defined in
CoreHC2 connectors and cable assemblies are used. Digital I/O and I2C are supported on
headers.
The XM755 module features are:
• 16 ADC differential signals to 4 male Carlisle CoreHC2 connector pads
• 16 DACs differential signals to 4 male Carlisle CoreHC2 connector pads
• 2 ADC inputs – compression mount SMAs through low frequency baluns – Minicircuits
TCM2-33WX+
UG1532 (v1.0) March 30, 2022
ZCU670 Board User Guide
Appendix D: HW-XM650/755 Balun Daughter Cards for RFSoC EVM
Figure 28: DAC: Eight Transmitter Signal Lanes
Channel
0 1
2 3
0 1
2 3
XM650/755 Connector
JHC2
DAC_T0_CH0
DAC_T0_CH1
DAC_T0_CH2
DAC_T0_CH3
DAC_T1_CH0
DAC_T1_CH1
DAC_T1_CH2
DAC_T1_CH3
JHC4
Pinouts. For signal break-out Carlisle
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JHC1
JHC3
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