Alinx ZYNQ7000 FPGA User Manual page 10

ZYNQ FPGA Development Platform AX7015 User Manual
BAN34 and BANK35 on the PL side, the level of IO of BANK35 can be modified by
replacing the LDO chip on the core board to meet the requirements of users with
different level interfaces. For users who need a lot of IOs, this core board will be a
good choice. Moreover, the IOs connection part, the routing between the ZYNQ
FPGA chip and the interface is equal length and differential processing. The core
board size is only 60*60 (mm), which is very suitable for secondary development.
Figure 2-1-1: AC7015 Core board Front
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