2
Specifications
2.1
Feature List
Table 3 Feature Summary
Form Factor
Processor
Memory
Chipset
Audio
Ethernet
Graphics Options
Peripheral Interfaces
BIOS
Power Management
congatec Board
Controller
Security
Note
Some features are optional.
Copyright © 2017 congatec AG
Based on COM Express™ standard pinout Type 6 Rev. 2.1 (Basic size 125 x 95 mm)
®
7th Generation Intel
Core i7,i5,i3, Celeron and Xeon mobile processors
Two memory sockets (located on the top and bottom side of the conga-TS175). Supports
SO-DIMM non-ECC DDR4 modules
-
Data rates up to 2400 MT/s
-
Maximum 32 GB capacity (16 GB each)
-
NOTE: Variants that feature the Intel CM238 chipset support ECC memory
®
Mobile Intel
100 Series Chipset QM175, HM175 and CM238 PCH
High definition audio interface with support for multiple codecs
Gigabit Ethernet (Intel
®
i219-LM controller) with AMT 11.6 support
Next Generation Intel
HD (610/620). Supports:
®
API (DirectX 12, OpenGL 4.4, OpenCL 2.1)
-
Intel
QuickSync & Clear Video Technology HD (hardware accelerated video decode/encode/processing/transcode)
®
-
Switchable/Hybrid graphics
-
Up to 3 independent displays
-
3x DP++ (DP/HDMI/DVI)
1x LVDS
1x VGA
1x PEG x16 port (Gen 3)
Resolutions up to 4K
USB Interfaces:
Up to 8x USB 2.0
-
Up to 4x USB 3.0
-
4x SATA
®
(6 Gb/s with RAID 0/1/5 support)
8x PCI Express
Gen. 3 lanes
®
*1
2x UART
AMI Aptio
®
V UEFI 2.x firmware, 8 or 16 MB serial SPI with congatec Embedded BIOS features
ACPI 5.0 compliant with battery support. Also supports DeepSx and Suspend to RAM (S3)
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control, I²C
bus, power loss control
Optional discrete Trusted Platform Module "TPM 1.2/2.0"; AES Instructions
1x Optional eDP 1.4 (assembly option)
NOTE:
The conga-TS175 does not natively support TMDS. A DP++ to TMDS
converter (e.g. PTN3360D) needs to be implemented.
GPIOs
LPC
I
C (fast mode, multi-master)
2
SMB
SPI
TSKLm16
12/71
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