Related Manuals for Congatec COM Express conga-TS175
Summary of Contents for Congatec COM Express conga-TS175
- Page 1 COM Express™ conga-TS175 7th Generation Intel® Core™ i7, i5, i3 and Xeon processor with either QM175, HM175, or CM238 Chipset User’s Guide Revision 1.6...
- Page 2 Added note about the minimum pulse width required for proper button detection in table 24 “Power and System Management Signal Descriptions” • Added information about congatec MLF file to section 11 “BIOS Setup Description”. • Corrected typographic error in section 11.5 “Supported Flash Devices”...
- Page 3 In no event shall congatec AG be liable for any incidental, consequential, special, or exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information...
- Page 4 Trademarks Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.
- Page 5 (c) arising from course of performance, course of dealing, or usage of trade. congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause.
- Page 6 Technical Support congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities and drivers, which have been made available to assist you.
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Page 7: Table Of Contents
Supply Voltage Standard Power ..........14 2.4.1 Electrical Characteristics ............14 Additional Features ..............36 2.4.2 Rise Time ................. 14 congatec Board Controller (cBC) ..........36 Power Consumption ..............15 7.1.1 Board Information ..............36 Supply Voltage Battery Power ..........16 7.1.2 General Purpose Input/Output .......... - Page 8 BIOS Setup Description ............70 11.1 Navigating the BIOS Setup Menu ........... 70 11.2 BIOS Versions................70 11.3 Updating the BIOS ..............71 11.4 Recovering from External Flash ..........71 11.5 Supported Flash Devices ............71 Copyright © 2017 congatec AG TSKLm16 8/71...
- Page 9 General Purpose Serial Interface Signal Descriptions ....64 Table 33 Module Type Definition Signal Description ......64 Table 34 Power and GND Signal Descriptions ........65 Table 35 Boot Strap Signal Descriptions ..........66 Copyright © 2017 congatec AG TSKLm16 9/71...
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Page 10: Introduction
This versatility allows the designer to create a dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™ Copyright © 2017 congatec AG TSKLm16... -
Page 11: Options Information
GFX Base/Max. Dynamic Freq. 350 MHz / 1.1 GHz 350 MHz / 1 GHz Memory (DDR4) 2400 MT/s Dual Channel (ECC) 2400 MT/s Dual Channel (ECC) LVDS DP++ (DP/HDMI/DVI) Processor TDP (cTDP) 45 W (35 W) 25 W (N.A) Copyright © 2017 congatec AG TSKLm16 11/71... -
Page 12: Specifications
2x UART BIOS AMI Aptio ® V UEFI 2.x firmware, 8 or 16 MB serial SPI with congatec Embedded BIOS features Power Management ACPI 5.0 compliant with battery support. Also supports DeepSx and Suspend to RAM (S3) congatec Board Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control, I²C... -
Page 13: Supported Operating Systems
18 mm. If the 8mm (height) carrier board connector is used, then approximate overall height is 21 mm. Heatspreader Module PCB 4.00 13.00 7.00 18.00 5.00 2.00±10% All dimensions in millimeter 4.50 Carrier Board PCB Copyright © 2017 congatec AG TSKLm16 13/71... -
Page 14: Supply Voltage Standard Power
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250V/s. The smooth turn-on requires that, during the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive. Copyright © 2017 congatec AG TSKLm16... -
Page 15: Power Consumption
Power Consumption The power consumption values were measured with the following setup: • Input voltage +12 V • conga-TS175 COM • modified congatec carrier board • conga-TS175 cooling solution • Microsoft Windows 10 (64 bit) Note The CPU was stressed to its maximum workload. -
Page 16: Supply Voltage Battery Power
3. Consider the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com/support/application-notes. 4. We recommend to always have a CMOS battery present when operating the conga-TS175. -
Page 17: Environmental Specifications
Storage: 5% to 95% Caution The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating temperature refers to any measurable spot on the heatspreader’s surface. Humidity specifications are for non-condensing conditions. -
Page 18: Block Diagram
SATA 6G SATA USB 2.0 USB 3.0 Controller SATA Port 0 - 3 LPC Bus SM Bus UART0/1 SER0/1 GPIOs LID#/SLEEP# FAN control I2C Bus Note: Supports only TMDS if VGA is enabled Copyright © 2017 congatec AG TSKLm16 18/71... -
Page 19: Cooling Solutions
1. We recommend a maximum torque of 0.4 Nm for carrier board mounting screws and 0.5 Nm for module mounting screws. 2. The gap pad material used on congatec heatspreaders may contain silicon oil that can seep out over time depending on the environmental conditions it is subjected to. -
Page 20: Csa Dimensions
CSA Dimensions 96.6 14.5 M2.5 x 13 mm threaded standoff for threaded version ø2.7 x 13 mm non-threaded standoff for borehole version Copyright © 2017 congatec AG TSKLm16 20/71... -
Page 21: Csp Dimensions
CSP Dimensions 14.5 M2.5 x 13 mm threaded standoff for threaded version ø2.7 x 13 mm non-threaded standoff for borehole version Copyright © 2017 congatec AG TSKLm16 21/71... -
Page 22: Hsp Dimensions
HSP Dimensions 41.5 M2.5 x 11 mm threaded standoff for threaded version ø2.7 x 11 mm non-threaded standoff for borehole version Copyright © 2017 congatec AG TSKLm16 22/71... -
Page 23: Heatspreader Thermal Imagery
The thermal image below provides a reference to where the heat is being transferred to on the heatspreader surface area. System designers must ensure that the system’s cooling solution is designed to dissipate the heat from the hottest surface spots of the heatspreader. Copyright © 2017 congatec AG TSKLm16 23/71... -
Page 24: Onboard Temperature Sensors
The CPU temperature sensor (T00) is located in the CPU (U1). This sensor measures the CPU temperature and is defined in CGOS API as CGOS_TEMP_CPU. The board temperature sensor (T01) is located in the congatec Board Controller (U22). This sensor measures the board temperature and is defined in CGOS API as CGOS_TEMP_BOARD. - Page 25 The DRAM sensor location is shown below: Optional DRAM Sensor Location (BOM option) Note The optional DRAM sensors are not populated on conga-TS175 standard variants. The sensors are only available as assembly option. Copyright © 2017 congatec AG TSKLm16 25/71...
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Page 26: Connector Rows
• optional configuration to support graphics or non-graphic devices or both • a x1, x2, x4 or x8 PCIe device • up to three devices operating simultaneously on the PEG interface • lane reversal Copyright © 2017 congatec AG TSKLm16 26/71... -
Page 27: Display Interfaces
Display Interfaces The conga-TS175 supports the following: • up to three DP++ (DP/HDMI/DVI) • single- or dual-channel LVDS • VGA • three independent displays Table 8 shows the supported display combinations and resolutions. Copyright © 2017 congatec AG TSKLm16 27/71... -
Page 28: Displayport (Dp)
• audio formats such as linear PCM, Dolby Digital (AC-3), Dolby TrueHD, DTS, DTS-HD Master Audio and up to 8 channels • up to three independent DP displays Note A maximum of two independent DP displays are supported if the VGA interface is enabled. Copyright © 2017 congatec AG TSKLm16 28/71... -
Page 29: Lvds/Edp
The conga-TS175 offers four SATA interfaces (SATA 0-3) on the A–B connector. The interfaces support: • independent DMA operation • data transfer rates up to 6.0 Gb/s • AHCI mode using memory space and RAID mode • Hot-plug detect Copyright © 2017 congatec AG TSKLm16 29/71... -
Page 30: Usb
The conga-TS175 provides an interface that supports the connection of HDA audio codecs. 6.1.8 LPC Bus The conga-TS175 offers the LPC (Low Pin Count) bus through the Intel PCH-LP. For information about the decoded LPC addresses, see section ® 10.1.1. Copyright © 2017 congatec AG TSKLm16 30/71... -
Page 31: I²C Bus
General Purpose Serial Interface The conga-TS175 offers two UART interfaces via the congatec Board Controller. These interfaces support up to 1 Mb/s and can operate in low- speed, full-speed and high-speed modes. The UART interfaces are routed to the A–B connector. They do not support hardware handshake and flow control. - Page 32 Note The module is kept in reset as long as the PWR_OK is driven by carrier board hardware. Copyright © 2017 congatec AG TSKLm16 32/71...
- Page 33 0.8V when the 12V is applied to the module. Actively driving PWR_OK high is compliant to the COM Express specification but this can cause back driving. Therefore, congatec recommends driving the PWR_OK low to keep the module in reset and tri-state PWR_OK when the carrier board hardware is ready to boot.
- Page 34 Do this during the power supply qualification phase to ensure that the above mentioned problem does not occur in the application. For more information, see the “Power Supply Design Guide for Desktop Platform Form Factors” document at www.intel.com. Copyright © 2017 congatec AG TSKLm16...
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Page 35: Power Management
Deep Sx. The Deep Sx on resumption, puts system back into the state it is entered from. In other words, if Deep Sx state was entered from S3 state, then the resume path will place system back into S3. Copyright © 2017 congatec AG TSKLm16... -
Page 36: Additional Features
I²C bus from the x86 core architecture, which results in higher embedded feature performance and more reliability, even when the x86 processor is in a low power mode. It also ensures that the congatec embedded feature set is fully compatible amongst all congatec modules. -
Page 37: Power Loss Control
OEM Default Settings This feature allows system designers to create and store their own BIOS default configuration. Customized BIOS development by congatec for OEM default settings is no longer necessary because customers can easily perform this configuration by themselves using the congatec system utility CGUTIL. -
Page 38: Oem Boot Logo
OEM POST Logo This feature allows system designers to replace the congatec POST logo displayed in the upper left corner of the screen during BIOS POST with their own BIOS POST logo. Use the congatec system utility CGUTIL 1.5.4 or later to replace/add the OEM POST logo. -
Page 39: Congatec Battery Management Interface
The architecture of the CGOS API driver provides the ability to write application software that runs unmodified on all congatec CPU modules. All the hardware related code is contained within the congatec embedded BIOS on the module. See section 1.1 of the CGOS API software developers guide, available on the congatec website. -
Page 40: Conga Tech Notes
3. To ensure that the TCC is active for only short periods of time, thus reducing the impact on processor performance to a minimum, it is necessary to have a properly designed thermal solution. The Intel ® Xeon, Core™ i7/i5/i3 and Celeron ® processor’s respective datasheet can provide you with more information about this subject. Copyright © 2017 congatec AG TSKLm16 40/71... -
Page 41: Intel ® Turbo Boost Technology
(Intel VT-x) added hardware support in the processor to improve the virtualization performance and robustness. ® RTS Real-Time Hypervisor supports Intel VT and is verified on all current congatec x86 hardware. Note congatec supports RTS Hypervisor. Copyright © 2017 congatec AG... -
Page 42: Thermal Management
Processor Performance Control (CPPC2) and is supported by newer operating systems (Win 8.1 or newer). With this feature enabled, the processor autonomously selects performance states based on workload demand and thermal limits while also considering information provided by the OS e.g., the performance limits and workload history. Copyright © 2017 congatec AG TSKLm16 42/71... -
Page 43: Acpi Suspend Modes And Resume Events
The reduction in power consumption due to lower voltage subsequently reduces the heat generated. Note Use memory modules with same specifications, same type and model. Copyright © 2017 congatec AG TSKLm16 43/71... -
Page 44: Signal Descriptions And Pinout Tables
Signal Descriptions and Pinout Tables The following section describes the signals found on COM Express™ Type VI connectors used for congatec AG modules. The pinout of the modules complies with COM Express Type 6 Rev. 2.1. Table 3 describes the terminology used in this section for the Signal Description tables. The PU/PD column indicates if a COM Express™... -
Page 45: Connector Signal Descriptions
VCC_5V_SBY AC/HDA_RST# AC/HDA_SDIN0 GPI3 VCC_5V_SBY GND (FIXED) GND (FIXED) RSVD VCC_5V_SBY AC/HDA_BITCLK SPKR eDP_HPD VCC_5V_SBY AC/HDA_SDOUT I2C_CK PCIE0_CK_REF+ BIOS_DIS1# BIOS_DIS0# I2C_DAT PCIE0_CK_REF- VGA_RED THRMTRIP# THRM# GND (FIXED) GND (FIXED) USB6- USB7- SPI_POWER VGA_GRN Copyright © 2017 congatec AG TSKLm16 45/71... - Page 46 PCIE_RX5- A108 VCC_12V B108 VCC_12V GPI0 GPO1 A109 VCC_12V B109 VCC_12V PCIE_TX4+ PCIE_RX4+ A110 GND (FIXED) B110 GND (FIXED) Note The signals marked with asterisk symbol (*) are not connected on the conga-TS175. Copyright © 2017 congatec AG TSKLm16 46/71...
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Page 47: Table 12 Connector C-D Pinout
PEG_TX10+ GND (FIXED) GND (FIXED) PEG_RX10- PEG_TX10- DDI2_CTRLCLK_AUX+ DDI1_PAIR2+ DDI2_CTRLDATA_AUX- DDI1_PAIR2- PEG_RX11+ PEG_TX11+ DDI2_DDC_AUX_SEL DDI1_DDC_AUX_SEL PEG_RX11- PEG_TX11- RSVD RSVD GND (FIXED) GND (FIXED) DDI3_CTRLCLK_AUX+ DDI1_PAIR3+ PEG_RX12+ PEG_TX12+ DDI3_CTRLDATA_AUX- DDI1_PAIR3- PEG_RX12- PEG_TX12- DDI3_DDC_AUX_SEL RSVD Copyright © 2017 congatec AG TSKLm16 47/71... - Page 48 C108 VCC_12V D108 VCC_12V TYPE0# PEG_LANE_RV# C109 VCC_12V D109 VCC_12V PEG_RX1+ PEG_TX1+ C110 GND (FIXED) D110 GND (FIXED) Note The signals marked with an asterisk symbol (*) are not supported on the conga-TS175. Copyright © 2017 congatec AG TSKLm16 48/71...
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Page 49: Table 13 Pci Express Signal Descriptions (General Purpose)
O PCIE A PCI Express Gen2/3 compliant clock buffer chip must be PCIE_CLK_REF- and PCI Express Graphics Lanes. used on the carrier board if the design involves more than one PCI Express device. Copyright © 2017 congatec AG TSKLm16 49/71... -
Page 50: Table 14 Pci Express Signal Descriptions (X16 Graphics)
PCIE_RX[16-31] + and -. PEG_RX1+ PEG_RX1- PEG_RX2+ PEG_RX2- PEG_RX3+ PEG_RX3- PEG_RX4+ PEG_RX4- PEG_RX5+ PEG_RX5- PEG_RX6+ PEG_RX6- PEG_RX7+ PEG_RX7- PEG_RX8+ PEG_RX8- PEG_RX9+ PEG_RX9- PEG_RX10+ PEG_RX10- PEG_RX11+ PEG_RX11- PEG_RX12+ PEG_RX12- PEG_RX13+ PEG_RX13- PEG_RX14+ PEG_RX14- PEG_RX15+ C101 PEG_RX15- C102 Copyright © 2017 congatec AG TSKLm16 50/71... - Page 51 (see note below) Note Some signals have special functionality during the reset process. They may bootstrap some basic important functions of the module. For more information refer to section 9.2 “Boot Strap Signals”. Copyright © 2017 congatec AG TSKLm16 51/71...
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Page 52: Table 15 Ddi Signal Description
PU 100k 3.3V Boot strap signal (see note below). DP AUX- function if DDI2_DDC_AUX_SEL is no connect. I/O PCIE Enable strap is already populated. HDMI/DVI I2C CTRLDATA if DDI2_DDC_AUX_SEL is pulled high. I/O OD 3.3V Copyright © 2017 congatec AG TSKLm16 52/71... - Page 53 9.2 “Boot Strap Signals”. 2. The Digital Display Interface (DDI) signals are multiplexed with TMDS and DisplayPort (DP). The signals for these interfaces are routed to the DDI interface of the COM Express connector. Copyright © 2017 congatec AG TSKLm16 53/71...
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Page 54: Table 16 Tmds Signal Descriptions
O PCIE TMDS3_DATA2- Multiplexed with DDI3_PAIR0+ and DDI3_PAIR0-. HDMI3_HPD TMDS Hot-plug detect. I PCIE PD 1M Multiplexed with DDI3_HPD. HDMI3_CTRLCLK TMDS I C Control Clock I/O OD 3.3V PD 100K Multiplexed with DDI3_CTRLCLK_AUX+ Copyright © 2017 congatec AG TSKLm16 54/71... -
Page 55: Table 17 Displayport (Dp) Signal Descriptions
Detection of Hot Plug / Unplug and notification of the link layer. I 3.3V PD 1M Multiplexed with DDI2_HPD. DP2_AUX+ Half-duplex bi-directional AUX channel for services such as link configuration or I/O PCIE PD 100k maintenance and EDID access. Copyright © 2017 congatec AG TSKLm16 55/71... -
Page 56: Table 18 Embedded Displayport Signal Descriptions
O 3.3V eDP_AUX+ eDP AUX+ AC coupled off module eDP_AUX- eDP AUX- AC coupled off module eDP_HPD Detection of Hot Plug / Unplug and notification of the link layer I 3.3V Copyright © 2017 congatec AG TSKLm16 56/71... -
Page 57: Table 19 Crt Signal Descriptions
DDC lines used for flat panel detection and control. O 3.3V PU 2k2 3.3V for LVDS support (default) LVDS_I2C_DAT DDC lines used for flat panel detection and control. I/O 3.3V PU 2k2 3.3V for LVDS support (default) Copyright © 2017 congatec AG TSKLm16 57/71... -
Page 58: Table 21 Serial Ata Signal Descriptions
USB 2.0 compliant. Backwards compatible to USB 1.1 USB7+ USB Port 7, data + or D+ USB 2.0 compliant. Backwards compatible to USB 1.1 USB7- USB Port 7, data - or D- USB 2.0 compliant. Backwards compatible to USB 1.1 Copyright © 2017 congatec AG TSKLm16 58/71... -
Page 59: Table 23 Usb 3.0 Signal Descriptions
Additional transmit signal differential pairs for the Superspeed USB data path O USB_SSTX2- USB_SSRX3+ Additional receive signal differential pairs for the Superspeed USB data path USB_SSRX3- USB_SSTX3+ Additional transmit signal differential pairs for the Superspeed USB data path O USB_SSTX3- Copyright © 2017 congatec AG TSKLm16 59/71... -
Page 60: Table 24 Gigabit Ethernet Signal Descriptions
AC’97 codecs are not supported. ® output to the codec(s). This serial output is double-pumped for a bit rate of 48 AC/HDA_SDOUT is a boot strap signal Mb/s for Intel ® High Definition Audio. (see note below) Copyright © 2017 congatec AG TSKLm16 60/71... -
Page 61: Table 26 Expresscard Support Pins Signal Descriptions
Data in to module from carrier board SPI BIOS flash. I 3.3VSB SPI_MOSI Data out from module to carrier board SPI BIOS flash. O 3.3VSB SPI_CLK Clock from module to carrier board SPI BIOS flash. O 3.3VSB Copyright © 2017 congatec AG TSKLm16 61/71... -
Page 62: Table 29 Miscellaneous Signal Descriptions
General purpose output pins. O 3.3V Shared with SD_WP. Output from COM Express, input to SD GPO3 General purpose output pins. O 3.3V Shared with SD_CD. Output from COM Express, input to SD Copyright © 2017 congatec AG TSKLm16 62/71... -
Page 63: Table 31 Power And System Management Signal Descriptions
I 3.3V PU 10k 3.3V THERMTRIP# Active low output indicating that the CPU has entered thermal shutdown. O 3.3V PU 10k 3.3V SMB_CK System Management Bus bidirectional clock line. I/O 3.3VSB PU 2k2 3.3VSB Copyright © 2017 congatec AG TSKLm16 63/71... -
Page 64: Table 32 General Purpose Serial Interface Signal Descriptions
The Carrier Board should implement combinatorial logic that monitors the module TYPE pins and keeps power off (e.g deactivates the ATX_ON signal for an ATX power supply) if an incompatible module pin-out type is detected. The Carrier Board logic may also implement a fault indicator such as an LED. Copyright © 2017 congatec AG TSKLm16 64/71... -
Page 65: Table 34 Power And Gnd Signal Descriptions
C70,C73, C76, C80, C84, C87, C90, C93, C96, C100, C103, C110, D1, D2, D5, D8, D11, D14, D21, D31, D41, D51, D60, D67, D70, D73, D76, D80, D84, D87, D90, D93, D96, D100, D103, D110 Copyright © 2017 congatec AG TSKLm16 65/71... -
Page 66: Boot Strap Signals
2. No external DC loads or external pull-up or pull-down resistors should change the configuration of the signals listed in the above table. External resistors may override the internal strap states and cause the COM Express™ module to malfunction and/or cause irreparable damage to the module. Copyright © 2017 congatec AG TSKLm16 66/71... -
Page 67: System Resources
On the conga-TS175 the PCIExpress Bus acts as the subtractive decoding agent. All I/O cycles that are not positively decoded are forwarded to the PCI Bus not the LPC Bus. Only specified I/O ranges are forwarded to the LPC Bus. In the congatec Embedded BIOS the following I/O address ranges are sent to the LPC Bus: 2Eh –... -
Page 68: Pci Configuration Space Map
PCI Express Root Port 7 PCI to LPC Bridge Power Management Controller Intel High Definition Audio (Intel® HD Audio) ® SMBus Controller GbE Controller 01h (Note3) PEG Port 0 02h (Note3) PEG Port 1 Copyright © 2017 congatec AG TSKLm16 68/71... -
Page 69: Sm Bus
4. Internal PCI devices not connected to the conga-TS175 are not listed. 10.3 There are no onboard resources connected to the I²C bus. Address 16h is reserved for congatec Battery Management solutions. 10.4 SM Bus System Management (SM) bus signals are connected to the Intel ®... -
Page 70: Bios Setup Description
11.1 Navigating the BIOS Setup Menu The BIOS setup menu shows the features and options supported in the congatec BIOS. To access and navigate the BIOS setup menu, press the <DEL> or <F2> key during POST. The right frame displays the key legend. Above the key legend is an area reserved for text messages. These text messages explain the options and the possible impacts when changing the selected option in the left frame. -
Page 71: Updating The Bios
BIOS updates are recommeded to correct platform issues or enhance the feature set of the module. The conga-TS175 features a congatec/AMI AptioEFI firmware on an onboard flash ROM chip. You can update the firmware with the congatec System Utility. The utility has five versions—...
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