BS83B24C/BS83C40C
Touch Flash MCU
Memory Characteristics
Symbol
Parameter
V
V
fo� Read / W�ite
RW
DD
Flash Program Memory / Data EEPROM Memory
E�ase / W�ite C�cle Time – �lash
P�og�am Memo��
t
DEW
W�ite C�cle Time – Data EEPROM
Memo��
I
P�og�amming / E�ase C���ent on V
DDPGM
E
Cell End��ance
P
t
ROM Data Retention Time
RETD
RAM Data Memory
V
RAM Data Retention Voltage
DR
LVR Electrical Characteristics
Symbol
Parameter
V
Low Voltage Reset Voltage
LVR
I
Ope�ating C���ent
LVRBG
t
Minim�m Low Voltage Width to Reset
LVR
I
Additional C���ent fo� LVR Ena�le
LVR
Power-on Reset Characteristics
Symbol
Parameter
V
V
Sta�t Voltage to Ens��e Powe�-on Reset
POR
DD
RR
V
Rising Rate to Ens��e Powe�-on Reset
POR
DD
Minim�m Time fo� V
DD
t
POR
Powe�-on Reset
Rev. 1.00
Test Conditions
V
DD
—
—
—
—
DD
—
—
Ta=�5°C
—
Device in SLEEP Mode
Test Conditions
V
DD
—
LVR ena�le� voltage select �.10V
—
LVR ena�le� voltage select �.55V
—
LVR ena�le� voltage select 3.15V
—
LVR ena�le� voltage select 3.�0V
3V
LVR ena�le� VBGEN=0
5V
3V
LVR ena�le� VBGEN=1
5V
—
—
VBGEN=0
V
DD
—
—
Sta�s at V
to Ens��e
POR
—
V
DD
t
POR
�3
Min.
Conditions
—
V
DDmin
—
—
—
—
—
—
—
100K
—
1.0
Ta=-40°C~�5°C� �nless othe�wise specif�
Min.
Conditions
- 5%
—
—
—
—
—
1�0
—
Test Conditions
Min.
Conditions
—
—
—
0.035
—
1
RR
POR
V
POR
Time
Ta=-40°C~�5°C
Typ.
Max.
Unit
—
V
V
DDmax
�
3
ms
4
6
—
5.0
mA
—
—
E/W
40
—
Yea�
—
—
V
Typ.
Max.
Unit
�.10
�.55
+ 5%
V
3.15
3.�0
—
1�
�0
�5
μA
—
150
1�0
�00
�40
4�0
μs
—
�4
μA
Ta=�5°C
Typ. Max. Unit
—
100
mV
—
—
V/ms
—
—
ms
�e���a�� 0�� �01�
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