Requirements For Installation Environment; Device Position; Humidity, Temperature, And Cleanness - Huawei USG6000 Series Hardware Manual

HUAWEI USG6000 Series
Hardware Guide
Module
Form
Factor
A.3 Requirements for Installation Environment
This section describes the requirements for the USG installation environment, such as the
device position, humidity and temperature, cleanness, antistatic measures, lightning protection
measures, power supply, and anti-magnetic measures.
A.3.1 Device Position
This section describes the USG position requirements to ensure its security.
Table A-16
Table A-16 Device position requirements
Item
Ventilation and heat
dissipation
Stability
Grounding
A.3.2 Humidity, Temperature, and Cleanness
This section describes the requirements for the humidity, temperature, and cleanness of the
equipment room. To ensure the stability and life cycle of the USG and its components, check
that the equipment room meets the requirements.
Ensure that there is no explosive, conductive, magnetic, or corrosive dust or debris in the
equipment room. Dust that settle on the device may cause electrostatic adsorption, resulting in
poor contact of the metal socket connectors and metal contacts. This shortens the life cycle of
the device and causes faults.
In addition to dust and debris, toxic gases, such as SO
the equipment room.
Issue 08 (2017-06-30)
SFP+ SFP+
lists the requirements for the device position.
Requirement
l To ensure good heat dissipation, keep the air vent of the device
at least 150 mm away from other devices.
l Ensure that the ventilation and heat dissipation system is
available at the position where the device is to be installed.
The cabinet or mounting table must be firm enough to support the
weight of the device and its accessories.
Ensure that the chassis or mounting table is properly grounded.
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SFP+ SFP+
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A Appendix
SFP+ SFP+
must be cleaned out of
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