Heat Dissipation System; Technical Specifications - Huawei USG6000 Series Hardware Manual

HUAWEI USG6000 Series
Hardware Guide
Item
Rated output voltage
Maximum output voltage
range
Maximum output current
Maximum output power

2.2.4.5 Heat Dissipation System

The USG6550/6570 has a built-in fan module for heat dissipation.
The device adopts the automatic fan speed adjustment technology to monitor the temperature
of key components. If the internal device temperature is higher than the specified value, the
fan speed increases; when the temperature falls back to its normal range, the fan speed
decreases. In this way, the fan module enables the device to run in normal temperature,
ensuring device running security and reliability.
Figure 2-65
the hard disk installation slot on the front side, and the air exhaust is on the right side. The
built-in fan module locates at the air exhaust and cannot be removed.
Figure 2-65 System air flow

2.2.4.6 Technical Specifications

This section describes the dimensions, weight, and power and environment specifications of
the USG6550/6570.
Issue 08 (2017-06-30)
illustrates the air flow of the device. The air intake areas include the left side and
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D D
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A S
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Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Description
12 V DC
11.64 V DC to 12.36 V DC
14.2 A
170 W
IN
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2 Hardware Overview
Cool air Hot air
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