Relation Between Temperature Increases (∆T) And Thermal Resistance (Θja) At A Given Ambient; Temperature - Renesas R-IN32M4-CL2 User Manual

R-IN32M4-CL2 User's Manual: Board design edition
Relation between Temperature Increases (∆t) and Thermal Resistance (θja) at a
7.1.5
Given Ambient Temperature
The thermal resistance (θja) of the R-IN32M4-CL2 depends on the board, casing, and peripheral components. If
respective criteria for the temperature rise (Δt = T
required θja to reach the target Δt. Take these values into consideration in the thermal design of the board.
As an example, the graph also shows the thermal resistance (actually measured) of the boards from Tessera Technology
Inc. and IAR Systems.
Note. The measured values and the result of simulation in the above figure were obtained without a
casing.
R18UZ0046EJ0200
Dec. 28, 2018
- T ) apply to the end product, refer to the graph below that shows the
t a
Note
7. Thermal Design <R>
Δt: Tt – Ta (°C)
Ta: Ambient temperature (°C)
Tt: Package surface temperature (°C)
Δt
Tt
Ta
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