Sign In
Upload
Manuals
Brands
INTEL Manuals
Computer Hardware
CORE 2 EXTREME X6800 - UPDATE 3-2008
INTEL CORE 2 EXTREME X6800 - UPDATE 3-2008 Manuals
Manuals and User Guides for INTEL CORE 2 EXTREME X6800 - UPDATE 3-2008. We have
4
INTEL CORE 2 EXTREME X6800 - UPDATE 3-2008 manuals available for free PDF download: Datasheet, Specification
Intel CORE 2 EXTREME X6800 - UPDATE 3-2008 Datasheet (122 pages)
Intel Core 2 Extreme Processor X6800Δ and Intel Core 2 Duo Desktop Processor E6000Δ and E4000Δ Sequences
Brand:
Intel
| Category:
Computer Hardware
| Size: 1.96 MB
Table of Contents
Table of Contents
3
Revision History
7
Introduction
11
Core™2 Duo Desktop Processors
11
Terminology
12
Processor Terminology
12
Core™2 Duo Desktop Processor
12
References
14
Reference Documents
14
Electrical Specifications
15
Power and Ground Lands
15
Decoupling Guidelines
15
VCC Decoupling
15
Vtt Decoupling
15
Voltage Identification
16
FSB Decoupling
16
Voltage Identification Definition
17
Market Segment Identification (MSID)
18
Reserved, Unused, and TESTHI Signals
18
Market Segment Selection Truth Table for MSID[1:0]
18
Voltage and Current Specification
19
Absolute Maximum and Minimum Ratings
19
Absolute Maximum and Minimum Ratings
20
DC Voltage and Current Specification
20
Voltage and Current Specifications
20
VCC Static and Transient Tolerance for Processors with 4 MB L2 Cache
23
CC Static and Transient Tolerance for Processors with 4 MB L2 Cache
23
V Static and Transient Tolerance for Processors with 2 MB L2 Cache
24
VCC Static and Transient Tolerance for Processors with 2 MB L2 Cache
25
VCC
25
CC Static and Transient Tolerance for Processors with 2 MB L2 Cache
25
Signaling Specifications
26
Die Voltage Validation
26
VCC
26
FSB Signal Groups
27
CMOS and Open Drain Signals
28
Signal Characteristics
28
Signal Reference Voltages
28
Processor DC Specifications
29
GTL+ Signal Group DC Specifications
29
Open Drain and TAP Output Signal Group DC Specifications
29
GTL+ Front Side Bus Specifications
30
CMOS Signal Group DC Specifications
30
GTL+ Bus Voltage Definitions
30
Clock Specifications
31
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
31
FSB Frequency Select Signals (BSEL[2:0])
31
Core Frequency to FSB Multiplier Configuration
31
Phase Lock Loop (PLL) and Filter
32
BCLK[1:0] Specifications (CK505 Based Platforms)
32
BSEL[2:0] Frequency Table for BCLK[1:0]
32
Front Side Bus Differential BCLK Specifications
32
Differential Clock Waveform
33
Differential Clock Crosspoint Specification
33
Differential Measurements
33
BCLK[1:0] Specifications (CK410 Based Platforms)
34
Differential Clock Crosspoint Specification
34
Front Side Bus Differential BCLK Specifications
34
PECI DC Specifications
35
PECI DC Electrical Limits
35
Package Mechanical Specifications
37
Package Mechanical Drawing
37
Processor Package Assembly Sketch
37
Processor Package Drawing Sheet 3 of 3
40
Processor Component Keep-Out Zones
41
Package Loading Specifications
41
Package Handling Guidelines
41
Processor Loading Specifications
41
Package Insertion Specifications
42
Processor Mass Specification
42
Processor Materials
42
Processor Markings
42
Processor Top-Side Markings Example for the Intel
42
Processor Top-Side Markings Example for the Intel
43
Processor Land Coordinates
45
Processor Land Coordinates and Quadrants (Top View)
45
Land Listing and Signal Descriptions
47
Processor Land Assignments
47
Land-Out Diagram (Top View - Left Side)
48
Land-Out Diagram (Top View - Right Side)
49
Alphabetical Land Assignments
50
Numerical Land Assignment
60
Alphabetical Signals Reference
70
Signal Description (Sheet 1 of 9)
70
Thermal Specifications and Design Considerations
79
Processor Thermal Specifications
79
Thermal Specifications
79
Processor Thermal Specifications
80
Thermal Profile
81
MB L2 Cache)
82
Thermal Profile
82
Thermal Profile
83
MB L2 Cache)
83
Thermal Profile
84
Thermal Profile
85
Thermal Metrology
86
Processor Thermal Features
86
Thermal Monitor
86
Thermal Monitor 2
87
On-Demand Mode
88
Thermal Monitor 2 Frequency and Voltage Ordering
88
PROCHOT# Signal
89
THERMTRIP# Signal
89
Thermal Diode
90
Thermal "Diode" Parameters Using Diode Model
90
Thermal "Diode" Parameters Using Transistor Model
91
Thermal Diode Interface
91
Platform Environment Control Interface (PECI)
92
Introduction
92
Key Difference with Legacy Diode-Based Thermal Management
92
Conceptual Fan Control on PECI-Based Platforms
93
Conceptual Fan Control on Thermal Diode-Based Platforms
93
PECI Specifications
94
PECI Command Support
94
PECI Device Address
94
PECI Fault Handling Requirements
94
PECI Gettemp0() Error Code Support
94
Gettemp0() Error Codes
94
Features
95
Power-On Configuration Options
95
Clock Control and Low Power States
95
Power-On Configuration Option Signals
95
Normal State
96
HALT and Extended HALT Powerdown States
96
HALT Powerdown State
96
Processor Low Power State Machine
96
Extended HALT Powerdown State
97
Stop Grant and Extended Stop Grant States
97
Stop Grant State
97
Extended HALT Snoop State, Extended Stop Grant Snoop State
98
Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State
98
Extended Stop Grant State
98
HALT Snoop State, Stop Grant Snoop State
98
Enhanced Intel Speedstep Technology
98
Boxed Processor Specifications
101
Mechanical Representation of the Boxed Processor
101
Mechanical Specifications
102
Boxed Processor Cooling Solution Dimensions
102
Space Requirements for the Boxed Processor (Side View)
102
Space Requirements for the Boxed Processor (Top View)
102
Boxed Processor Fan Heatsink Weight
103
Electrical Requirements
103
Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
103
Fan Heatsink Power Supply
103
Space Requirements for the Boxed Processor (Overall View)
103
Boxed Processor Fan Heatsink Power Cable Connector Description
104
Fan Heatsink Power and Signal Specifications
104
Thermal Specifications
105
Boxed Processor Cooling Requirements
105
Baseboard Power Header Placement Relative to Processor Socket
105
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View)
106
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)
106
Fan Speed Control Operation (Intel Core2 Extreme Processor X6800 Only)
107
Fan Speed Control Operation (Intel Core2 Duo Desktop Processor E6000 and E4000 Sequences Only)
107
Boxed Processor Fan Heatsink Set Points
108
Fan Heatsink Power and Signal Specifications
108
Balanced Technology Extended (BTX) Boxed Processor Specifications
111
Mechanical Representation of the Boxed Processor with a Type I TMA
111
Mechanical Specifications
112
Cooling Solution Dimensions
112
Mechanical Representation of the Boxed Processor with a Type II TMA
112
Requirements for the Balanced Technology Extended (BTX) Type I Keep-Out Volumes
113
Boxed Processor Thermal Module Assembly Weight
114
Requirements for the Balanced Technology Extended (BTX) Type II Keep-Out Volume
114
Boxed Processor Support and Retention Module (SRM)
115
Assembly Stack Including the Support and Retention Module
115
Electrical Requirements
116
Thermal Module Assembly Power Supply
116
Boxed Processor TMA Power Cable Connector Description
116
Balanced Technology Extended (BTX) Mainboard Power Header Placement (Hatched Area)
117
TMA Power and Signal Specifications
117
Thermal Specifications
118
Boxed Processor Cooling Requirements
118
Variable Speed Fan
118
Boxed Processor TMA Set Points
119
TMA Set Points for 3-Wire Operation of BTX Type I and Type II Boxed Processors
119
Debug Tools Specifications
121
Logic Analyzer Interface (LAI)
121
Mechanical Considerations
121
Electrical Considerations
121
Advertisement
INTEL CORE 2 EXTREME X6800 - UPDATE 3-2008 Datasheet (118 pages)
Brand:
INTEL
| Category:
Computer Hardware
| Size: 1.81 MB
Table of Contents
Table of Contents
3
Revision History
7
Core™2 Duo Desktop
9
Introduction
11
Terminology
12
Processor Terminology
12
References
14
Reference Documents
14
Electrical Specifications
15
Power and Ground Lands
15
Decoupling Guidelines
15
VCC Decoupling
15
Vtt Decoupling
15
FSB Decoupling
16
Voltage Identification
16
Voltage Identification Definition
17
Market Segment Identification (MSID)
18
Reserved, Unused, and TESTHI Signals
18
Market Segment Selection Truth Table for MSID[1:0]
18
Voltage and Current Specification
19
Absolute Maximum and Minimum Ratings
19
DC Voltage and Current Specification
20
Voltage and Current Specifications
20
VCC Static and Transient Tolerance
23
VCC
23
Die Voltage Validation
24
VCC Overshoot
24
Signaling Specifications
25
FSB Signal Groups
25
Signal Characteristics
26
Signal Reference Voltages
26
CMOS and Open Drain Signals
27
Processor DC Specifications
27
GTL+ Signal Group DC Specifications
27
Open Drain and TAP Output Signal Group DC Specifications
27
GTL+ Front Side Bus Specifications
28
CMOS Signal Group DC Specifications
28
GTL+ Bus Voltage Definitions
28
Clock Specifications
29
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
29
FSB Frequency Select Signals (BSEL[2:0])
29
Core Frequency to FSB Multiplier Configuration
29
Phase Lock Loop (PLL) and Filter
30
BCLK[1:0] Specifications (CK505 Based Platforms)
30
BSEL[2:0] Frequency Table for BCLK[1:0]
30
Front Side Bus Differential BCLK Specifications
30
Differential Clock Waveform
31
Differential Clock Crosspoint Specification
31
Differential Measurements
31
BCLK[1:0] Specifications (CK410 Based Platforms)
32
Differential Clock Crosspoint Specification
32
PECI DC Specifications
33
PECI DC Electrical Limits
33
Package Mechanical Specifications
35
Package Mechanical Drawing
35
Processor Package Assembly Sketch
35
Processor Package Drawing Sheet 1 of 3
36
Processor Package Drawing Sheet 2 of 3
37
Processor Package Drawing Sheet 3 of 3
38
Processor Component Keep-Out Zones
39
Package Loading Specifications
39
Package Handling Guidelines
39
Processor Loading Specifications
39
Package Insertion Specifications
40
Processor Mass Specification
40
Processor Materials
40
Processor Markings
40
Processor Top-Side Markings Example for the Intel
40
Processor E6000 Series with 4 MB L2 Cache with 1333 Mhz FSB
40
Core™2 Duo Desktop
41
Processor Top-Side Markings Example for the Intel
41
Processors E6000 Series with 4 MB L2 Cache with 1066 Mhz FSB
41
Processors E6000 Series with 2 MB L2 Cache
41
Processors E4000 Series with 2 MB L2 Cache
42
Processor Land Coordinates
43
Processor Land Coordinates and Quadrants (Top View)
43
Land Listing and Signal Descriptions
45
Processor Land Assignments
45
Land-Out Diagram (Top View - Left Side)
46
Land-Out Diagram (Top View - Right Side)
47
Alphabetical Land Assignments
48
Numerical Land Assignment
58
VCC CC Static and Transient Tolerance
62
Alphabetical Signals Reference
68
Signal Description (Sheet 1 of 9)
68
Thermal Specifications and Design Considerations
77
Processor Thermal Specifications
77
Thermal Specifications
77
Thermal Profile 1
79
Thermal Profile 2
80
Thermal Profile 4
82
Thermal Profile 5
83
Thermal Metrology
84
Processor Thermal Features
84
Thermal Monitor
84
Thermal Monitor 2
85
On-Demand Mode
86
Thermal Monitor 2 Frequency and Voltage Ordering
86
PROCHOT# Signal
87
THERMTRIP# Signal
87
Thermal Diode
88
Thermal "Diode" Parameters Using Diode Model
88
Thermal "Diode" Parameters Using Transistor Model
89
Thermal Diode Interface
89
Platform Environment Control Interface (PECI)
90
Introduction
90
Key Difference with Legacy Diode-Based Thermal Management
90
Processor PECI Topology
90
Conceptual Fan Control on PECI-Based Platforms
91
Conceptual Fan Control on Thermal Diode-Based Platforms
91
PECI Specifications
92
PECI Command Support
92
PECI Device Address
92
PECI Fault Handling Requirements
92
PECI Gettemp0() Error Code Support
92
Gettemp0() Error Codes
92
Features
93
Power-On Configuration Options
93
Clock Control and Low Power States
93
Power-On Configuration Option Signals
93
Normal State
94
HALT and Extended HALT Powerdown States
94
HALT Powerdown State
94
Processor Low Power State Machine
94
Extended HALT Powerdown State
95
Stop Grant and Extended Stop Grant States
95
Stop Grant State
95
Extended Stop Grant State
96
HALT Snoop State, Stop Grant Snoop State
96
State, and Stop Grant Snoop State
96
Enhanced Intel Speedstep Technology
96
Extended HALT Snoop State, Extended Stop Grant Snoop State
96
Boxed Processor Specifications
99
Mechanical Representation of the Boxed Processor
99
Mechanical Specifications
100
Boxed Processor Cooling Solution Dimensions
100
Space Requirements for the Boxed Processor (Side View)
100
Space Requirements for the Boxed Processor (Top View)
100
Boxed Processor Fan Heatsink Weight
101
Electrical Requirements
101
Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
101
Fan Heatsink Power Supply
101
Space Requirements for the Boxed Processor (Overall View)
101
Boxed Processor Fan Heatsink Power Cable Connector Description
102
Fan Heatsink Power and Signal Specifications
102
Thermal Specifications
103
Boxed Processor Cooling Requirements
103
Baseboard Power Header Placement Relative to Processor Socket
103
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View)
104
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)
104
Fan Speed Control Operation (Intel Core2 Extreme Processor X6800 Only)
105
Fan Speed Control Operation (Intel Core2 Duo Desktop Processor E6000 and E4000 Series Only)
105
Core2 Duo Desktop
105
Boxed Processor Fan Heatsink Set Points
105
Fan Heatsink Power and Signal Specifications
106
Balanced Technology Extended (BTX) Boxed Processor Specifications
107
Mechanical Representation of the Boxed Processor with a Type I TMA
107
Mechanical Specifications
108
Cooling Solution Dimensions
108
Mechanical Representation of the Boxed Processor with a Type II TMA
108
Requirements for the Balanced Technology Extended (BTX) Type I Keep-Out
109
Boxed Processor Thermal Module Assembly Weight
110
Requirements for the Balanced Technology Extended (BTX) Type II Keep-Out
110
Boxed Processor Support and Retention Module (SRM)
111
Assembly Stack Including the Support and Retention Module
111
Electrical Requirements
112
Thermal Module Assembly Power Supply
112
Boxed Processor TMA Power Cable Connector Description
112
Balanced Technology Extended (BTX) Mainboard Power Header Placement (Hatched Area)
113
TMA Power and Signal Specifications
113
Thermal Specifications
114
Boxed Processor Cooling Requirements
114
Variable Speed Fan
114
Boxed Processor TMA Set Points
115
TMA Set Points for 3-Wire Operation of BTX Type I and Type II Boxed Processors
115
Debug Tools Specifications
117
Logic Analyzer Interface (LAI)
117
Mechanical Considerations
117
Electrical Considerations
117
INTEL CORE 2 EXTREME X6800 - UPDATE 3-2008 Specification (72 pages)
Brand:
INTEL
| Category:
Computer Hardware
| Size: 0.53 MB
Table of Contents
Table of Contents
3
Contents
3
Revision History
4
Preface
6
Summary Tables of Changes
8
Identification Information
17
Component Identification Information
20
Errata
23
Specification Changes
70
Specification Clarifications
71
Documentation Changes
72
Advertisement
Intel CORE 2 EXTREME X6800 - UPDATE 3-2008 Specification (71 pages)
Specification Update
Brand:
Intel
| Category:
Computer Hardware
| Size: 0.53 MB
Table of Contents
Table of Contents
3
Contents
3
Revision History
4
Preface
6
Summary Tables of Changes
8
Identification Information
17
Component Identification Information
20
Errata
23
Software Interrupts
49
Specification Changes
69
Specification Clarifications
70
Documentation Changes
71
Advertisement
Related Products
Intel X6800 - Core 2 Extreme 2.9 GHz 4M L2 Cache LGA775 Dual-Core Processor
Intel X520-T2
Intel Xeon LV
Intel X710-2
Intel X550-T2
Intel Xeon 3400 Series
Intel Xeon Phi Processor x200
Intel Xeon X5200 Series
Intel Xeon Series
Intel Quad-Core Xeon X5400 Series
INTEL Categories
Motherboard
Computer Hardware
Server
Server Board
Desktop
More INTEL Manuals
Login
Sign In
OR
Sign in with Facebook
Sign in with Google
Upload manual
Upload from disk
Upload from URL