Table Of Contents - Texas Instruments SimpleLink CC3200MOD Manual

www.ti.com
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1 Module Overview
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1.1 Features
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1.2 Applications
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1.3 Description
1.4 Functional Block Diagram
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2 Revision History
3 Terminal Configuration and Functions
3.1 CC3200MOD Pin Diagram
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3.2 Pin Attributes
3.3 Pin Attributes and Pin Multiplexing
3.4 Recommended Pin Multiplexing Configurations
3.5 Drive Strength and Reset States for Analog-Digital
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Multiplexed Pins
3.6 Pad State After Application of Power To Chip But
Prior To Reset Release
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4 Specifications
4.1 Absolute Maximum Ratings
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4.2 Handling Ratings
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4.3 Power-On Hours
4.4 Recommended Operating Conditions
4.5 Brown-Out and Black-Out
4.6 Electrical Characteristics (3.3 V, 25°C)
4.7 Thermal Resistance Characteristics for MOB
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Package
4.8 Reset Requirement
4.9 Current Consumption
4.10 WLAN RF Characteristics
4.11 Timing Characteristics
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5 Detailed Description
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5.1 Overview
5.2 Functional Block Diagram
Copyright © 2014, Texas Instruments Incorporated

Table of Contents

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5.3 ARM Cortex-M4 Processor Core Subsystem
1 5.4 CC3200 Device Encryption
2 5.5 Wi-Fi Network Processor Subsystem
2 5.6 Power-Management Subsystem
3 5.7 Low-Power Operating Mode
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5.8 Memory
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5.9 Boot Modes
6 Applications, Implementation, and Layout
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8 6.1 Reference Schematics
10 6.2 Bill of Materials
19 6.3 Layout Recommendations
7 Environmental Requirements and
22
Specifications
7.1 Temperature
22
7.2 Handling Environment
23
7.3 Storage Condition
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7.4 Baking Conditions
23
7.5 Soldering and Reflow Condition
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8 Product and Documentation Support
23
8.1 Development Support
24
8.2 Device Nomenclature
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8.3 Community Resources
8.4 Trademarks
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8.5 Electrostatic Discharge Caution
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8.6 Export Control Notice
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8.7 Glossary
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9 Mechanical Packaging and Orderable
31
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Information
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9.1 Mechanical Drawing
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9.2 Package Option
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CC3200MOD
SWRS166 - DECEMBER 2014
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