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Texas Instruments SimpleLink CC3200MOD Manual page 57

Wi-fi and internet-of-things module solution, a single-chip wireless mcu
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CC3200MOD
www.ti.com
SWRS166 – DECEMBER 2014
Figure 7-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component
(at Solder Joint)
Environmental Requirements and Specifications
57
Copyright © 2014, Texas Instruments Incorporated
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