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5 SETUP AND PROCEDURES BEFORE OPERATION
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(1) Main body
• The main body case is made of plastic. Take care not to drop or apply strong
impacts onto the case.
• Do not remove the QD70D PCB from the case. Failure to observe this could
lead to faults.
(2) Cable
• Do not press on the cable with a sharp object.
• Do not twist the cable with force.
• Do not forcibly pull on the cable.
• Do not step on the cable.
• Do not place objects on the cable.
• Do not damage the cable sheath.
(3) Installation environment
Do not install the module in the following type of environment.
• Where the ambient temperature exceeds the 0 to 55°C range.
• Where the ambient humidity exceeds the 5 to 95%RH range.
• Where there is sudden temperature changes, or where dew condenses.
• Where there is corrosive gas or flammable gas.
• Where there are high levels of dust, conductive powder, such as iron chips, oil
mist, salt or organic solvents.
• Where the module will be subject to direct sunlight.
• Where there are strong electric fields or magnetic fields.
• Where vibration or impact could be directly applied onto the main body.
MELSEC-Q
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