Table of Contents
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Contents
1
Introduction .............................................................................................................. 9
1.1
Processor Feature Details ................................................................................... 11
1.1.1
Supported Technologies .......................................................................... 11
1.2
Interfaces ........................................................................................................ 11
1.2.1
System Memory Support ......................................................................... 11
1.2.2
PCI Express* ......................................................................................... 12
1.2.3
Direct Media Interface (DMI).................................................................... 13
1.2.4
Platform Environment Control Interface (PECI) ........................................... 14
1.3
Power Management Support ............................................................................... 14
1.3.1
Processor Core....................................................................................... 14
1.3.2
System ................................................................................................. 14
1.3.3
Memory Controller.................................................................................. 14
1.3.4
PCI Express* ......................................................................................... 14
1.4
Thermal Management Support ............................................................................ 15
1.5
Package ........................................................................................................... 15
1.6
Terminology ..................................................................................................... 15
1.7
Related Documents ........................................................................................... 17
2
Interfaces................................................................................................................ 19
2.1
System Memory Interface .................................................................................. 19
2.1.1
System Memory Technology Supported ..................................................... 19
2.1.2
System Memory Timing Support............................................................... 21
2.1.3
System Memory Organization Modes......................................................... 21
2.1.3.1
2.1.3.2
2.1.4
Rules for Populating Memory Slots ............................................................ 23
2.1.5
Technology Enhancements of Intel
2.1.5.1
2.1.5.2
2.1.5.3
2.1.6
System Memory Pre-Charge Power Down Support Details ............................ 24
2.2
PCI Express* Interface....................................................................................... 25
2.2.1
PCI Express* Architecture ....................................................................... 25
2.2.1.1
2.2.1.2
2.2.1.3
2.2.2
PCI Express* Configuration Mechanism ..................................................... 27
2.2.3
PCI Express* Ports and Bifurcation ........................................................... 28
2.2.3.1
2.3
Direct Media Interface (DMI)............................................................................... 28
2.3.1
DMI Error Flow....................................................................................... 28
2.3.2
Processor/PCH Compatibility Assumptions.................................................. 28
2.3.3
DMI Link Down ...................................................................................... 28
2.4
Platform Environment Control Interface (PECI) ...................................................... 29
2.5
Interface Clocking ............................................................................................. 29
2.5.1
Internal Clocking Requirements................................................................ 29
3
Technologies ........................................................................................................... 31
®
3.1
Virtualization Technology .......................................................................... 31
3.1.1
3.1.2
Datasheet, Volume 1
Single-Channel Mode................................................................. 21
Just-in-Time Command Scheduling.............................................. 24
Command Overlap .................................................................... 24
Out-of-Order Scheduling ............................................................ 24
Transaction Layer ..................................................................... 26
Data Link Layer ........................................................................ 26
Physical Layer .......................................................................... 26
PCI Express* Bifurcated Mode .................................................... 28
®
VT-x Objectives ............................................................................ 31
®
VT-x Features .............................................................................. 31
®
Flex Memory Technology Mode ............ 22
®
Fast Memory Access (Intel
®
FMA).......... 24
3
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