Intel Core i7-800 Specifications page 5

Figures
2-1 Processor Package Assembly Sketch ........................................................................ 11
2-2 Package View ....................................................................................................... 12
2-3 Processor Top-Side Markings .................................................................................. 14
2-4 Processor Package Lands Coordinates ...................................................................... 15
3-1 LGA1156 Socket with Pick and Place Cover ............................................................... 17
3-2 LGA1156 Socket Contact Numbering (Top View of Socket) .......................................... 18
3-3 LGA1156 Socket Land Pattern (Top View of Board) .................................................... 19
3-4 Attachment to Motherboard .................................................................................... 20
3-5 Pick and Place Cover.............................................................................................. 22
3-6 Package Installation / Removal Features................................................................... 23
4-1 ILM Cover Assembly .............................................................................................. 26
4-2 Back Plate ............................................................................................................ 26
4-3 Shoulder Screw..................................................................................................... 27
4-4 ILM Assembly ....................................................................................................... 28
4-5 Pin 1 and ILM Lever ............................................................................................... 29
5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology .............................. 34
6-1 Thermal Test Vehicle Thermal Profile for Intel
Processor Series.................................................................................................... 37
6-2 TTV Case Temperature (TCASE) Measurement Location .............................................. 40
6-3 Frequency and Voltage Ordering.............................................................................. 42
6-4 Temperature Sensor Data Format............................................................................ 45
7-1 Comparison of Case Temperature versus Sensor Based Specification............................ 48
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7-2 Intel Core™ i7-800 and i5-700 Desktop Processor Series Thermal Profile .................... 49
7-3 Thermal solution Performance ................................................................................. 50
7-4 Required YCA for Various T
7-5 Thermal Solution Performance versus Fan Speed ....................................................... 53
7-6 Fan Response Without T
7-7 Fan Response with T
8-1 ATX Heatsink Reference Design Assembly................................................................. 59
8-2 ATX KOZ 3-D Model Primary (Top) Side.................................................................... 60
10-1 Boxed Processor Fan Heatsink................................................................................. 65
10-2 Space Requirements for the Boxed Processor (side view)............................................ 66
10-3 Space Requirements for the Boxed Processor (top view) ............................................. 67
10-4 Space Requirements for the Boxed Processor (overall view) ........................................ 67
10-5 Boxed Processor Fan Heatsink Power Cable Connector Description ............................... 68
10-6 Baseboard Power Header Placement Relative to Processor Socket ................................ 69
10-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) .................... 70
10-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view) ................... 70
10-9 Boxed Processor Fan Heatsink Set Points.................................................................. 71
B-1 Socket / Heatsink / ILM Keepout Zone Primary Side (Top) .......................................... 76
B-2 Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom) ................................. 77
B-3 Socket / Processor / ILM Keepout Zone Primary Side (Top) ......................................... 78
B-4 Socket / Processor / ILM Keepout Zone Secondary Side (Bottom) ................................ 79
B-5 Reference Design Heatsink Assembly ....................................................................... 80
B-6 Reference Fastener (Sheet 1 of 4) ........................................................................... 81
B-7 Reference Fastener (Sheet 2 of 4) ........................................................................... 82
B-8 Reference Fastener (Sheet 3 of 4) ........................................................................... 83
B-9 Reference Fastener (Sheet 4 of 4) ........................................................................... 84
B-10 Reference Clip (Sheet 1 of 2) .................................................................................. 85
B-11 Reference Clip (Sheet 2 of 2) .................................................................................. 86
B-12 Thermocouple Attach Drawing................................................................................. 87
C-1 Socket Mechanical Drawing (Sheet 1 of 4) ................................................................ 90
Thermal/Mechanical Specifications and Design Guidelines
Conditions ........................................................... 52
AMBIENT
Data ....................................................................... 55
AMBIENT
Aware FSC.................................................................... 56
AMBIENT
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Core™ i7-800 and i5-700 Desktop
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