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(5) Lead inspection (Gray processing using a brightness filter)
Based on positional information obtained from the gray scale search function,
Purpose
inspect the condition of the IC leads and connector pins. (No. of lead pins that can
be detected in one image: Max. 128.)
Application Inspect the IC leads and connector pins.
Inspect the layout of the IC leads and connector pins
Lead measurement
limit line
Example
Reference line
- Inspection procedure
1 Determine the measurement points (K0 to K3) from the mid points of the leads
and the reference line.
2 Calculate the distances between the leads (D0 to D2) using the measurement
points.
3 Calculate the lead lengths (L0 to L3) from the measurement points (K0 to K3)
toward the lead measurement limit line.
(6) BGA/CSP inspection (Gray processing using a brightness filter)
Measure the center of gravity, area of each object, number of objects, and fillet
Purpose
diameter using a color that was emphasized by the color filter function.
Application
Inspecting BGA/CSP solder balls.
Measurement of 6 balls
Example
- Inspection procedure
Image
capture
Area of each
Distance between centers
of gravity for pairs of balls
D0
Lead
K0
K1
W0
W1
Object 0
Object 1
Object 3
Object 4
Binary
conversion
Ball size
object
1-11
[Lead inspection]
D1
D2
- Number of leads K
- D0 to D2: Distance
K2
K3
- W0 to W3: Lead
- L0 to L3:
W2
W3
Object 2
[Measurement results]
- Number of objects: K
- Area of each object: R0 to R127
- Distance between centers of
gravity:
(DX0, DY0) to (DX127, DY127)
- Fillet diameters: FX, FY
Object 5
Object identification
(numbering)
Distance between balls
Number of balls
Outline
between
leads
width
Lead
length
Measure centers
of gravity
Fillet diameters
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