A 1U Alternative Heatsink Thermal/Mechanical Design; Component Overview; Isometric View Of The 1U Alternative Heatsink; A.1 Component Overview - Intel 5400 Series Design Manuallines

Quad-core processor thermal/mechanical design guidelines

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1U Alternative Heatsink Thermal/Mechanical Design

1U Alternative Heatsink

Thermal/Mechanical Design

Intel has also developed an 1U alternative reference heatsink design for the

volumetrically constrained form factor and targeted for the rack-optimized and ultra

dense SKUs. This alternative heatsink design meets the thermal profile specifications of

the Quad-Core Intel® Xeon® Processor E5400 Series and offers the advantages of

weight reduction and cost savings in using this alternative 1U heatsink.

This section describes the alternative heatsink thermal performance and adherence to

Quad-Core Intel® Xeon® Processor E5400 Series thermal profile specifications.

A.1

The alternative 1U reference heatsink is an extruded aluminum heatsink and shares the

same volumetric footprint as the 1U CEK heatsink. It reuses Intel 1U CEK Captive

standoff/screws, Thermal Interface Material (TIM) and Spring.

Figure A-1

Figure A-1. Isometric View of the 1U Alternative Heatsink

Note:

Refer to

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

shows the isometric view of the 1U alternative heatsink.

Appendix B

for more detailed mechanical drawings of the heatsink.

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