Intel 5148LV - Xeon Dual Core Active H Datasheet page 5

6-2 Dual-Core Intel® Xeon® Processor LV 5138
Nominal & Short-Term Thermal Profiles ................................................................ 77
6-3 Dual-Core Intel® Xeon® Processor LV 5148 and
Dual-Core Intel® Xeon® Processor LV 5128 Thermal Profile ................................... 79
6-4 Dual-Core Intel® Xeon® Processor 5160 Thermal Profiles A and B .......................... 80
6-5 Case Temperature (TCASE) Measurement Location ................................................ 82
6-6 Thermal Monitor 2 Frequency and Voltage Ordering ............................................... 84
6-7 PECI Topology .................................................................................................. 87
6-8 Temperature Data Format Comparison: Thermal Diode vs. PECI Digital
Thermal Sensor................................................................................................. 88
7-1 Stop Clock State Machine ................................................................................... 94
8-1 Boxed Dual-Core Intel
1U Passive/3U+ Active Combination Heat Sink (With Removable Fan) ...................... 97
8-2 Boxed Dual-Core Intel
8-3 2U Passive Dual-Core Intel
Thermal Solution (Exploded View) ....................................................................... 98
8-4 Top Side Board Keepout Zones (Part 1) .............................................................. 100
8-5 Top Side Board Keepout Zones (Part 2) .............................................................. 101
8-6 Bottom Side Board Keepout Zones..................................................................... 102
8-7 Board Mounting-Hole Keepout Zones ................................................................. 103
8-8 Volumetric Height Keep-Ins .............................................................................. 104
8-9 4-Pin Fan Cable Connector (For Active CEK Heat Sink) ......................................... 105
8-10 4-Pin Base Board Fan Header (For Active CEK Heat Sink)...................................... 106
8-11 Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution ....................... 108
Table
1-1 Dual-Core Intel
2-1 Core Frequency to FSB Multiplier Configuration ..................................................... 19
2-2 BSEL[2:0] Frequency Table ................................................................................ 19
2-3 Voltage Identification Definition........................................................................... 21
2-4 Voltage Identification Definition........................................................................... 22
2-5 Loadline Selection Truth Table for LL_ID[1:0] ....................................................... 23
2-6 Market Segment Selection Truth Table for MS_ID[1:0] ........................................... 23
2-7 FSB Signal Groups............................................................................................. 24
2-8 AGTL+ Signal Description Table........................................................................... 25
2-9 Non AGTL+ Signal Description Table .................................................................... 25
2-10 Signal Reference Voltages .................................................................................. 25
2-11 PECI DC Electrical Limits .................................................................................... 26
2-12 Processor Absolute Maximum Ratings................................................................... 28
2-13 Voltage and Current Specifications....................................................................... 29
2-14 VCC Static and Transient Tolerance ..................................................................... 32
2-15 AGTL+ Signal Group DC Specifications ................................................................. 34
2-16 CMOS Signal Group and TAP Signal Group DC Specifications ................................... 34
2-17 Open Drain Signal Group DC Specifications ........................................................... 35
2-18 VCC Overshoot Specifications.............................................................................. 35
3-1 Package Loading Specifications ........................................................................... 41
3-2 Package Handling Guidelines............................................................................... 42
3-3 Processor Materials............................................................................................ 43
4-1 Land Listing by Land Name ................................................................................. 45
4-2 Land Listing by Land Number .............................................................................. 55
5-1 Signal Definitions .............................................................................................. 65
® ®
Dual-Core Intel Xeon Processor 5100 Series Datasheet
® ®
Xeon Processor 5100 Series
® ®
Xeon Processor 5100 Series 2U Passive Heat Sink.............. 98
® ®
Xeon Processor 5100 Series
® ®
Xeon Processor 5100 Series...................................................... 12
5