Intel 5148LV - Xeon Dual Core Active H Datasheet page 74

Thermal Specifications
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applications. Refer to the Dual-Core Intel Xeon Processor 5100 Series Thermal/
Mechanical Design Guidelines for details on system thermal solution design, thermal
profiles and environmental considerations.
Intel has developed thermal profiles specific to enable the Dual-Core Intel® Xeon®
Processor LV 5138, to be used in environments compliant with NEBS* Level 3 ambient
operating temperature requirements. At a minimum, NEBS Level 3 requires a nominal
ambient operating temperature of 40°C, with short-term excursions to 55°C. "Short-
term" is defined as a maximum of 96 hours per instance, for a total maximum of 360
hours per year, and a maximum of 15 instances per year.
To comply with these ambient operating temperature requirements, Intel has
developed a corresponding Nominal Thermal Profile and Short-Term Thermal Profile.
For normal operation, the processor must remain within the minimum and maximum
case temperature (T ) specifications as defined by the Nominal Thermal Profile. For
CASE
short-term operating conditions (maximum 96 hours per instance, maximum 360 hours
per year, maximum of 15 instances per year), the processor may remain within the
minimum and maximum T , as defined by the Short-Term Thermal Profile. For
CASE
environments that do not require NEBS Level 3 compliance, the processor must always
remain within the minimum and maximum case temperature (T ) specifications as
CASE
defined by the Nominal Thermal Profile.
To provide greater flexibility in environmental conditions and thermal solution design,
the Nominal Thermal Profile and the Short-Term Thermal Profile are each specified 5°C
above the NEBS Level 3 ambient operating temperature requirements of 40°C nominal
and 55°C short-term. The Nominal Thermal Profile is defined at an ambient operating
temperature of 45°C, and the Short-Term Thermal Profile is defined at an ambient
operating temperature of 60°C.
Both of these thermal profiles ensure adherence to Intel reliability requirements. It is
expected that the Thermal Control Circuit (TCC) would only be activated for very brief
periods of time when running the most power intensive applications. Utilization of a
thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the
Short-Term Thermal Profile for a duration longer than the specified limits will violate the
thermal specifications and may result in permanent damage to the processor. Refer to
the Dual-Core Intel® Xeon® Processor LV 5138 in Embedded Applications Thermal/
Mechanical Design Guidelines for details on system thermal solution design, thermal
profiles and environmental considerations.
The Dual-Core Intel® Xeon® Processor 5160 has two thermal profiles, either of which
can be implemented. Both ensure adherence to Intel reliability requirements. Thermal
Profile A (see Figure 6-4; Table 6-9) is representative of a volumetrically unconstrained
thermal solution (that is, industry enabled 2U heatsink). In this scenario, it is expected
that the Thermal Control Circuit (TCC) would only be activated for very brief periods of
time when running the most power intensive applications. Thermal Profile B (see
Figure 6-4, Table 6-10) is indicative of a constrained thermal environment (that is, 1U
form factor). Because of the reduced cooling capability represented by this thermal
solution, the probability of TCC activation and performance loss is increased.
Additionally, utilization of a thermal solution that does not meet Thermal Profile B will
violate the thermal specifications and may result in permanent damage to the
processor. Intel has developed these thermal profiles to allow customers to choose the
thermal solution and environmental parameters that best suit their platform
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implementation. Refer to the Dual-Core Intel Xeon Processor 5100 Series Thermal/
Mechanical Design Guidelines for details on system thermal solution design, thermal
profiles and environmental considerations.
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74 Dual-Core Intel Xeon Processor 5100 Series Datasheet