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Intel
Core
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Intel
Pentium
Processor, and Intel
Dual-Core Processor
Thermal and Mechanical Design Guidelines
Supporting the:
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- Intel
Core™2 Duo Processor E6000
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- Intel
Pentium
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- Intel
Celeron
December 2008
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2 Duo Processor,
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Dual Core
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Dual Core Processor E2000
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Dual-Core Processor E1000
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Celeron
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and E4000
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Document Number: 317804-010
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Table of Contents
Related Manuals for Intel E2180 - Pentium Dual-Core 2.00GHz 800MHz 1MB Socket 775 CPU
Summary of Contents for Intel E2180 - Pentium Dual-Core 2.00GHz 800MHz 1MB Socket 775 CPU
- Page 1 ® ™ Intel Core 2 Duo Processor, ® ® Intel Pentium Dual Core ® ® Processor, and Intel Celeron Dual-Core Processor Thermal and Mechanical Design Guidelines Supporting the: Δ Δ ® - Intel Core™2 Duo Processor E6000 and E4000 Series Δ...
- Page 2 Intel provides this information for customer’s convenience only. Use at your own risk. Intel accepts no liability for results if customer chooses at its discretion to implement these methods within its business operations. Intel makes no representations or warranties regarding the accuracy or completeness of the information provided.
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Page 3: Table Of Contents
Contents Introduction ....................11 Document Goals and Scope ..............11 1.1.1 Importance of Thermal Management ..........11 1.1.2 Document Goals..............11 1.1.3 Document Scope ..............12 References ..................13 Definition of Terms ................13 Processor Thermal/Mechanical Information ............15 Mechanical Requirements ..............15 2.1.1 Processor Package..............15 2.1.2 Heatsink Attach ..............17 Thermal Requirements ................18 2.2.1 Processor Case Temperature .............18... - Page 4 Power Cycling .................49 5.2.3 Recommended BIOS/CPU/Memory Test Procedures ......49 Material and Recycling Requirements ............49 Safety Requirements ................50 Geometric Envelope for Intel Reference BTX Thermal Module Assembly ..50 Preload and TMA Stiffness ..............51 5.6.1 Structural Design Strategy............51 5.6.2 TMA Preload versus Stiffness ............51 ATX Thermal/Mechanical Design Information............55...
- Page 5 ..........115 CONTROL Appendix F Balanced Technology Extended (BTX) System Thermal Considerations....121 Appendix G Fan Performance for Reference Design ............. 125 Appendix H Mechanical Drawings ..................128 Appendix I Intel Enabled Reference Solution Information............ 146 Thermal and Mechanical Design Guidelines...
- Page 6 Figure 5-1. Effective TMA Fan Curves with Reference Extrusion......45 Figure 5-2. Random Vibration PSD ..............47 Figure 5-3. Shock Acceleration Curve..............48 Figure 5-4. Intel Type II TMA 65W Reference Design..........50 Figure 5-5. Upward Board Deflection During Shock ..........51 Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly Stiffness ..................52...
- Page 7 Figure 7-58. Reference Fastener - Sheet 2............140 Figure 7-59. Reference Fastener - Sheet 3............141 Figure 7-60. Reference Fastener - Sheet 4............142 ® Figure 7-61. Intel D60188-001 Reference Solution Assembly ......143 ® Figure 7-62. Intel D60188-001 Reference Solution Heatsink ......144 ®...
- Page 8 Tables Table 2-1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions....24 Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions...24 Table 5-1. Balanced Technology Extended (BTX) Type II Reference TMA Performance ...................42 Table 5-2. Acoustic Targets ................43 Table 5-3. VR Airflow Requirements..............46 Table 5-4.
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Page 9: Revision History
• Added Intel ® Celeron ® Dual-Core processor E1000 Δ series January 2008 • Updated reference design Intel P/N, supplier P/N and heatsink drawing • Updated Intel ® Boxed Processor Thermal Solutions inlet ambient temperature assumption -008 • Added Intel ®... - Page 10 Thermal and Mechanical Design Guidelines...
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Page 11: Introduction
The concepts given in this document are applicable to any system form factor. Specific examples used will be the Intel enabled reference solution for ATX/uATX systems. See the applicable BTX form factor reference documents to design a thermal solution for that form factor. -
Page 12: Document Scope
Chapter 4 addresses the benefits of the processor’s integrated thermal management logic for thermal design. Chapter 5 gives information on the Intel reference thermal solution for the processor in BTX platform. Chapter 6 gives information on the Intel reference thermal solution for the processor in ATX platform. -
Page 13: References
Material and concepts available in the following documents may be beneficial when reading this document. Document Location ® ® Intel Core™2 Extreme Processor X6800 and Intel Core™2 Duo http://intel.com Desktop Processor E6000 and E4000 Series Datasheet /design/processor/datashts/3132 78.htm Intel ®... - Page 14 Introduction Term Description Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as Ψ – T ) / Total Package Power. Ψ Note: Heat source must be specified for measurements. Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power.
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Page 15: Processor Thermal/Mechanical Information
Processor Thermal/Mechanical Information Processor Thermal/Mechanical Information Mechanical Requirements 2.1.1 Processor Package The processors covered in the document are packaged in a 775-Land LGA package that interfaces with the motherboard via a LGA775 socket. Refer to the datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid array (LGA) surface mount socket. - Page 16 Processor Thermal/Mechanical Information The primary function of the IHS is to transfer the non-uniform heat distribution from the die to the top of the IHS, out of which the heat flux is more uniform and spread over a larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the package to an attached cooling device.
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Page 17: Heatsink Attach
Processor Thermal/Mechanical Information 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines There are no features on the LGA775 socket to directly attach a heatsink: a mechanism must be designed to attach the heatsink directly to the motherboard. In addition to holding the heatsink in place on top of the IHS, this mechanism plays a significant role in the robustness of the system in which it is implemented, in particular: •... -
Page 18: Thermal Requirements
Processor Thermal/Mechanical Information 2.1.2.3 Additional Guidelines In addition to the general guidelines given above, the heatsink attach mechanism for the processor should be designed to the following guidelines: • Holds the heatsink in place under mechanical shock and vibration events and applies force to the heatsink base to maintain desired pressure on the thermal interface material. -
Page 19: Thermal Profile
Chapter 6) should be designed to manage the processor TDP at an inlet temperature of 35 °C + 5 °C = 40 °C. For BTX platforms, a front-to-back cooling design equivalent to Intel BTX TMA Type II reference design (see the Chapter 5) should be designed to manage the processor TDP at an inlet temperature of 35 °C + 0.5 °C = 35.5 °C. -
Page 20: Figure 2-3. Example Thermal Profile
0 via the digital thermal sensor. As a result the T value will always be a negative number. See Chapter 4 for the CONTROL ® discussion the thermal management logic and features and Chapter 7 on Intel Quiet ® System Technology (Intel QST). -
Page 21: Heatsink Design Considerations
This is achieved in part by using the Ψ vs. RPM and RPM vs. Acoustics (dBA) performance curves from the Intel enabled thermal solution. A thermal solution designed to meet the thermal profile would be expected to provide similar acoustic performance of different parts with potentially different T values. -
Page 22: Heatsink Size
Processor Thermal/Mechanical Information Passive heatsink solutions require in-depth knowledge of the airflow in the chassis. Typically, passive heatsinks see lower air speed. These heatsinks are therefore typically larger (and heavier) than active heatsinks due to the increase in fin surface required to meet a required performance. -
Page 23: Package Ihs Flatness
The attach mechanism (clip, fasteners, etc.) are not included. The mass limit for BTX heatsinks that use Intel reference design structural ingredients is 900 grams. The BTX structural reference component strategy and design is reviewed in depth in the latest version of the Balanced Technology Extended (BTX) System Design Guide. -
Page 24: System Thermal Solution Considerations
40 °C 35.5 °C Temperature NOTE: Intel reference designs (D60188-001 and E18764-001) are assumed be used in the chassis where expected the temperature rise is 5 °C. Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions ® ™... -
Page 25: Summary
Of particular interest for package and heatsink installation and removal is the System Assembly module. A video covering system integration is also available. Contact your Intel field sales representative for further information. Thermal and Mechanical Design Guidelines... - Page 26 Processor Thermal/Mechanical Information § Thermal and Mechanical Design Guidelines...
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Page 27: Thermal Metrology
Thermal Metrology Thermal Metrology This chapter discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, the thermal engineer must measure power dissipation and temperature to validate a thermal solution. To define the performance of a thermal solution the “thermal characterization parameter”, Ψ (“psi”) will be used. Characterizing Cooling Performance Requirements The idea of a “thermal characterization parameter”, Ψ... -
Page 28: Example
The following provides an illustration of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any specific Intel processor thermal specifications, and are for illustrative purposes only. Thermal and Mechanical Design Guidelines... -
Page 29: Processor Thermal Solution Performance Assessment
Assessment Thermal performance of a heatsink should be assessed using a thermal test vehicle (TTV) provided by Intel. The TTV is a stable heat source that the user can make accurate power measurement, whereas processors can introduce additional factors that can impact test results. In particular, the power level from actual processors varies significantly, even when running the maximum power application provided by Intel, due to variances in the manufacturing process. - Page 30 Thermal Metrology For active heatsinks, it is important to avoid taking measurement in the dead flow zone that usually develops above the fan hub and hub spokes. Measurements should be taken at four different locations uniformly placed at the center of the annulus formed by the fan hub and the fan housing to evaluate the uniformity of the air temperature at the fan inlet.
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Page 31: Figure 3-2. Locations For Measuring Local Ambient Temperature, Active Atx
Thermal Metrology Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink Note: Drawing Not to Scale Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink Note: Drawing Not to Scale Thermal and Mechanical Design Guidelines... -
Page 32: Processor Case Temperature Measurement Guidelines
Thermal Metrology Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the processor is specified for proper operation when T is maintained at or below the thermal profile as listed in the datasheet. The measurement location for T is the geometric center of the IHS. Figure 2-2 shows the location for T measurement. -
Page 33: Thermal Management Logic And Thermal Monitor Feature
Fortunately, there are numerous ways to reduce the power consumption of a processor, and Intel is aggressively pursuing low power design techniques. For example, decreasing the operating voltage, reducing unnecessary transistor activity, and using more power efficient circuits can significantly reduce processor power consumption. -
Page 34: Prochot# Signal
Thermal Management Logic and Thermal Monitor Feature 4.2.1 PROCHOT# Signal The primary function of the PROCHOT# signal is to provide an external indication the processor has reached the TCC activation temperature. While PROCHOT# is asserted, the TCC will be active. Assertion of the PROCHOT# signal is independent of any register settings within the processor. -
Page 35: Thermal Monitor 2
Thermal Management Logic and Thermal Monitor Feature Figure 4-1. Thermal Monitor Control PROCHOT# Normal clock Internal clock Duty cycle control Resultant internal clock 4.2.3 Thermal Monitor 2 The second method of power reduction is TM2. TM2 provides an efficient means of reducing the power consumption within the processor and limiting the processor temperature. -
Page 36: Operation And Configuration
Thermal Management Logic and Thermal Monitor Feature Once the processor has sufficiently cooled, and a minimum activation time has expired, the operating frequency and voltage transition back to the normal system operating point. Transition of the VID code will occur first, in order to insure proper operation once the processor reaches its normal operating frequency. -
Page 37: On-Demand Mode
4.2.6 System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for all processors. The thermal control circuit is intended to protect against short term thermal excursions that exceed the capability of a well designed processor thermal solution. -
Page 38: Operating System And Application Software Considerations
Thermal Management Logic and Thermal Monitor Feature A system designed to meet the thermal profile specification published in the processor datasheet greatly reduces the probability of real applications causing the thermal control circuit to activate under normal operating conditions. Systems that do not meet these specifications could be subject to more frequent activation of the thermal control circuit depending upon ambient air temperature and application power profile. -
Page 39: Platform Environmental Control Interface (Peci)
Set Overview. For additional information on the PECI, see the datasheet. The PECI bus is available on pin G5 of the LGA 775 socket. Intel chipsets beginning with the ICH8 have included PECI host controller. The PECI interface and the ®... - Page 40 QST), see Chapter 7 and the Intel Quiet System Technology Configuration and Tuning Manual. Intel has worked with many vendors that provide fan speed control devices to provide PECI host controllers. Please consult the local representative for your preferred vendor for their product plans and availability.
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Page 41: Balanced Technology Extended (Btx) Thermal/Mechanical Design Information
Section 5.2. The table also includes a T assumption of 35.5 °C for the Intel reference thermal solution at the processor fan heatsink inlet discussed Section 3.3. The analysis assumes a uniform external ambient temperature to the chassis of 35 °C across the fan inlet, resulting in a temperature rise, T , of 0.5 °C. -
Page 42: Acoustics
BTX Type II reference TMA is the higher thermal solution performance of the Intel ™ ® ™ Core 2 Duo processor with 4 MB / 2 MB cache at Tc-max of 72.0 °C, Intel Core 2 Duo ® ® processor with 2 MB cache at Tc-max of 73.3 °C, Intel... -
Page 43: Table 5-2. Acoustic Targets
4 Wire PWM Controlled to implement fan speed control capability based the digital thermal sensor. Refer to Chapter 7 for further details. Note: Appendix G gives detailed fan performance for the Intel reference thermal solutions with 4 Wire PWM Controlled fan. -
Page 44: Effective Fan Curve
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.1.3 Effective Fan Curve The TMA must fulfill the processor cooling requirements shown in Table 5-1 when it is installed in a functional BTX system. When installed in a system, the TMA must operate against the backpressure created by the chassis impedance (due to vents, bezel, peripherals, etc…) and will operate at lower net airflow than if it were tested outside of the system on a bench top or open air environment. -
Page 45: Voltage Regulator Thermal Management
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Figure 5-1. Effective TMA Fan Curves with Reference Extrusion 0.400 Reference TMA @ 5300 RPM 0.350 Reference TMA @ 2500 RPM 0.300 Reference TMA @ 1200 RPM 0.250 0.200 0.150 0.100 0.050 0.000 10.0 15.0 20.0... -
Page 46: Altitude
VR power is not at a maximum or if the external ambient temperature is less than 35 ºC. ® This recommended airflow rate is based on the requirements for the Intel 965 Express Chipset Family. -
Page 47: Figure 5-2. Random Vibration Psd
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.2.1.1 Random Vibration Test Procedure Recommended performance requirement for a system: • Duration: 10 min/axis, 3 axes • Frequency Range: 5 Hz to 500 Hz 5 Hz @ .001 g2/Hz to 20 Hz @ 0.01 g2/Hz (slope up) 20 Hz to 500 Hz @ 0.01 g2/Hz (flat) •... -
Page 48: Figure 5-3. Shock Acceleration Curve
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Figure 5-3. Shock Acceleration Curve 5.2.1.2.1 Recommended Test Sequence Each test sequence should start with components (i.e., motherboard, heatsink assembly, etc.) that have never been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to Section 6.3.3). -
Page 49: Power Cycling
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.2.2 Power Cycling Thermal performance degradation due to TIM degradation is evaluated using power cycling testing. The test is defined by 7500 cycles for the case temperature from room temperature (~23 ºC) to the maximum case temperature defined by the thermal profile at TDP. -
Page 50: Safety Requirements
BTX Interface Specification for Zone A, found at http://www.formfactors.org. Figure 5-4. Intel Type II TMA 65 W Reference Design Development vendor information for the Intel Type II TMA Reference Solution is provided in Appendix I. Thermal and Mechanical Design Guidelines... -
Page 51: Preload And Tma Stiffness
5.6.1 Structural Design Strategy Structural design strategy for the Intel Type II TMA is to minimize upward board deflection during shock to help protect the LGA775 socket. BTX thermal solutions utilize the SRM and TMA that together resists local board curvature under the socket and minimize, board deflection (Figure 5-5). -
Page 52: Figure 5-6. Minimum Required Processor Preload To Thermal Module Assembly
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Table 5-4, then the Thermal Module should be re-designed to have a preload that lies within the range given in Table 5-4, allowing for preload tolerances. Table 5-4. Processor Preload Limits Parameter Minimum Required Maximum Notes Allowed... -
Page 53: Figure 5-7. Thermal Module Attach Pointes And Duct-To-Srm Interface Features
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information mounting hole position for TMA attach, the required preload is approximately 10-15N greater than the values stipulated in Figure 5-6; however, Intel has not conducted any validation testing with this TMA mounting scheme. - Page 54 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines...
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Page 55: Atx Thermal/Mechanical Design Information
™ ® Intel Core 2 Duo processor with 2 MB cache at Tc-max of 61.4 °C and Intel ® Pentium Dual Core processor E2000 series at Tc-max of 61.4 °C require a thermal solution equivalent to the D60188-001 reference design, see Figure 6-1 for an exploded view of this reference design. -
Page 56: Figure 6-1. D60188-001Reference Design - Exploded View
2 Duo processor with 4 MB / 2 MB cache at Tc-max of ® ™ ® 72.0 °C, Intel Core 2 Duo processor with 2 MB cache at Tc-max of 73.3 °C, Intel ® ® ® Pentium Dual Core processor E2000 series at Tc-max of 73.3 °C, and Intel Celeron Dual-Core processor E1000 series at Tc-max of 73.3 °C require a thermal solution... -
Page 57: Figure 6-2. E18764-001 Reference Design - Exploded View
ATX Thermal/Mechanical Design Information Figure 6-2. E18764-001 Reference Design – Exploded View Figure 6-3. Bottom View of Copper Core Applied by TC-1996 Grease The ATX motherboard keep-out and the height recommendations defined Section 6.6 remain the same for a thermal solution for the processor in the 775-Land LGA package. -
Page 58: Validation Results For Reference Design
Table 6-1 provides the D60188-001 heatsink performance for the processors of Intel ™ ® ™ Core 2 Duo processor with 4 MB cache at Tc-max of 60.1 °C, Intel Core 2 Duo ® ® processor with 2 MB cache at Tc-max of 61.4 °C, and Intel... -
Page 59: Acoustics
Speed Set Point ™ 3900 High 5.0 BA • 0.49 °C/W (Intel Core 2 Duo processor, 4 MB / = 40 °C 2 MB at Tc-max of 72.0 °C) ™ • 0.51 °C/W (Intel Core 2 Duo processor, 2 MB at Tc-max of 73.3 °C) -
Page 60: Altitude
4 Wire PWM Controlled to implement fan speed control capability based digital thermal sensor temperature. Refer to Chapter 7 for further details. Note: Appendix G gives detailed fan performance for the Intel reference thermal solutions with 4 Wire PWM Controlled fan. -
Page 61: Environmental Reliability Testing
ATX Thermal/Mechanical Design Information Environmental Reliability Testing 6.3.1 Structural Reliability Testing Structural reliability tests consist of unpackaged, board-level vibration and shock tests of a given thermal solution in the assembled state. The thermal solution should meet the specified thermal performance targets after these tests are conducted; however, the test conditions outlined here may differ from your own system requirements. -
Page 62: Figure 6-5. Shock Acceleration Curve
ATX Thermal/Mechanical Design Information Figure 6-5. Shock Acceleration Curve Time (m illiseconds) 6.3.1.2.1 Recommended Test Sequence Each test sequence should start with components (i.e., motherboard, heatsink assembly, etc.) that have never been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to Section 6.3.3). -
Page 63: Power Cycling
ATX Thermal/Mechanical Design Information 6.3.2 Power Cycling Thermal performance degradation due to TIM degradation is evaluated using power cycling testing. The test is defined by 7500 cycles for the case temperature from room temperature (~23 ºC) to the maximum case temperature defined by the thermal profile at TDP. -
Page 64: Safety Requirements
• If the International Accessibility Probe specified in IEC 950 can access the moving parts of the fan, consider adding safety feature so that there is no risk of personal injury. Geometric Envelope for Intel Reference ATX Thermal Mechanical Design Figure 7-47, Figure 7-48 and Figure 7-49 in Appendix H gives detailed reference ATX/μATX motherboard keep-out information for the reference thermal/mechanical... -
Page 65: Reference Attach Mechanism
191.3 N ± 44.5 N [43 lb ± 10 lb]. Note: Intel reserves the right to make changes and modifications to the design as necessary to the reference design, in particular the clip and fastener. -
Page 66: Mechanical Interface To The Reference Attach Mechanism
ATX Thermal/Mechanical Design Information 6.7.2 Mechanical Interface to the Reference Attach Mechanism The attach mechanism component from the reference design can be used by other 3 party cooling solutions. The attach mechanism consists of: • A metal attach clip that interfaces with the heatsink core, see Appendix H, Figure 7-55 and Figure 7-56 for the component drawings. -
Page 67: Figure 6-8. Critical Parameters For Interfacing To Reference Clip
ATX Thermal/Mechanical Design Information Figure 6-8. Critical Parameters for Interfacing to Reference Clip Fin Array Fin Array Core Core See Detail A See Detail A Clip Clip Fin Array Fin Array Fin Array Fin Array Fin Array Fin Array 1.6 mm 1.6 mm 1.6 mm 1.6 mm... - Page 68 ATX Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines...
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Page 69: Intel Quiet System Technology (Intel Qst)
The ME provides integrated fan speed control in lieu of the mechanisms available in a SIO or a stand-alone ASIC. The Intel QST is time based as compared to the linear or state control used by the current generation of FSC devices. -
Page 70: Output Weighting Matrix
7.1.1 Output Weighting Matrix Intel QST provides an Output Weighting Matrix that provides a means for a single thermal sensor to affect the speed of multiple fans. An example of how the matrix could be used is if a sensor located next to the memory is sensitive to changes in both the processor heatsink fan and a 2 fan in the system. -
Page 71: Figure 7-2. Pid Controller Fundamentals
Intel® Quiet System Technology (Intel® QST) target temperature. As a result of its operation, the PID control algorithm can enable an acoustic-friendly platform. Figure 7-2. PID Controller Fundamentals Integral (time averaged) Integral (time averaged) Integral (time averaged) Integral (time averaged) -
Page 72: Board And System Implementation Of Intel
To implement the board must be configured as shown in Figure 7-3 and listed below: • ME system (S0-S1) with Controller Link connected and powered ® • DRAM with Channel A DIMM 0 installed and 2MB reserved for Intel QST FW execution ®... -
Page 73: Figure 7-4. Example Acoustic Fan Speed Control Implementation
Figure 7-4. Example Acoustic Fan Speed Control Implementation Intel has engaged with a number of major manufacturers of thermal / voltage sensors to provide devices for the SST bus. Contact your Intel Field Sales representative for the current list of manufacturers and visit their web sites or local sales representatives for a part suitable for your design. -
Page 74: Intel ® Qst Configuration And Tuning
® Fan Hub Thermistor and Intel There is no closed loop control between Intel QST and the thermistor, but they can work in tandem to provide the maximum fan speed reduction. The BTX reference design includes a thermistor on the fan hub. This Variable Speed Fan curve will determine the maximum fan speed as a function of the inlet ambient temperature and by design provides a Ψ... -
Page 75: Appendix Alga775 Socket Heatsink Loading
Mechanical shock and vibration and TIM performance AND LGA775 socket protection against fatigue failure. Metric for Heatsink Preload for ATX/uATX ® Designs Non-Compliant with Intel Reference Design A.2.1 Heatsink Preload Requirement Limitations Heatsink preload by itself is not an appropriate metric for solder joint force across... -
Page 76: Motherboard Deflection Metric Definition
LGA775 Socket Heatsink Loading Simulation shows that the solder joint force (F ) is proportional to the board axial deflection measured along the socket diagonal. The matching of F required to axial protect the LGA775 socket solder joint in temperature cycling is equivalent to matching a target MB deflection. -
Page 77: Board Deflection Limits
LGA775 Socket Heatsink Loading Figure 7-6. Board Deflection Definition d’1 d’2 A.2.3 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL - d_ref≥ 0.09 mm d_EOL - d_ref ≥ 0.15 mm d’_BOL – d’_ref≥ 0.09 mm d_EOL’ – d_ref’ ≥ 0.15 mm NOTES: The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. -
Page 78: Board Deflection Metric Implementation Example
LGA775 Socket Heatsink Loading A.2.4 Board Deflection Metric Implementation Example This section is for illustration only, and relies on the following assumptions: • 72 mm x 72 mm hole pattern of the reference design • Board stiffness = 900 lb/in at BOL, with degradation that simulates board creep over time ⎯... -
Page 79: Additional Considerations
Figure 7-7. Example: Defining Heatsink Preload Meeting Board Deflection Limit A.2.5 Additional Considerations Intel recommends to design to {d_BOL - d_ref = 0.15mm} at BOL when EOL conditions are not known or difficult to assess. The following information is given for illustration only. It is based on the reference keep-out, assuming there is no fixture that changes board stiffness: d_ref is expected to be 0.18 mm on average, and be as high as 0.22 mm... -
Page 80: Heatsink Selection Guidelines
• The Boxed Processor • The reference design (D60188-001 and E18764-001) Intel will collaborate with vendors participating in its third party test house program to ® ™ evaluate third party solutions. Vendor information now is available in Intel... -
Page 81: Appendix B Heatsink Clip Load Metrology
• Heatsink preload for the LGA775 socket • Quantify preload degradation under bake conditions. Note: This document reflects the current metrology used by Intel. Intel is continuously exploring new ways to improve metrology. Updates will be provided later as this document is revised as appropriate. -
Page 82: Figure 7-8. Load Cell Installation In Machined Heatsink Base Pocket - Bottom View
Heatsink Clip Load Metrology Remarks: Alternate Heatsink Sample Preparation As mentioned above, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results. An alternate method to make sure that the test setup will measure loads representative of the non-modified design •... -
Page 83: Figure 7-9. Load Cell Installation In Machined Heatsink Base Pocket - Side View
Heatsink Clip Load Metrology Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket – Side View Wax to maintain load cell in position during heatsink installation Height of pocket ~ height of selected load cell Load cell protrusion (Note: to be optimized depending on assembly stiffness) Figure 7-10. -
Page 84: Typical Test Equipment
Heatsink Clip Load Metrology B.2.2 Typical Test Equipment For the heatsink clip load measurement, use equivalent test equipment to the one listed Table 7-2. Table 7-2. Typical Test Equipment Part Number Item Description (Model) Load cell Honeywell*-Sensotec* Model 13 subminiature AL322BL load cells, compression only Notes: 1, 5... -
Page 85: Time-Zero, Room Temperature Preload Measurement
Heatsink Clip Load Metrology B.3.1 Time-Zero, Room Temperature Preload Measurement 1. Pre-assemble mechanical components on the board as needed prior to mounting the motherboard on an appropriate support fixture that replicate the board attach to a target chassis • For example: standard ATX board should sit on ATX compliant stand-offs. If the attach mechanism includes fixtures on the back side of the board, those must be included, as the goal of the test is to measure the load provided by the actual heatsink mechanism. - Page 86 Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines...
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Page 87: Appendix C Thermal Interface Management
Thermal Interface Management Appendix C Thermal Interface Management To optimize a heatsink design, it is important to understand the impact of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area and interface material thermal conductivity should be managed to realize the most effective thermal solution. - Page 88 Thermal Interface Management Thermal and Mechanical Design Guidelines...
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Page 89: Case Temperature Reference Metrology
The following supplier can do machining the groove and attaching a thermocouple to the IHS followed by the reference procedure. The supplier is listed the following table as a convenience to Intel’s general customers and the list may be subject to change without notice. -
Page 90: Figure 7-11. Omega Thermocouple
Case Temperature Reference Metrology Item Description Part Number Miscellaneous Hardware Solder Indium Corp. of America 52124 Alloy 57BI / 42SN / 1AG 0.010 Diameter Flux Indium Corp. of America 5RMA Loctite* 498 Super glue w/thermal characteristics 49850 Adhesive Adhesive Loctite* 7452 for fast glue curing 18490 Accelerator Kapton* Tape... -
Page 91: Thermal Calibration And Controls
It is recommended to follow company standard procedures and wear safety items like glasses for cutting the IHS and gloves for chemical handling. Please ask your Intel field sales representative if you need assistance to groove and/or install a thermocouple according to the reference process. -
Page 94: Figure 7-14. Ihs Groove At 6 O'clock Exit On The 775-Land Lga Package
Case Temperature Reference Metrology The orientation of the groove at 6 o’clock exit relative to the package pin 1 indicator (gold triangle in one corner of the package) is shown in Figure 7-14 for the 775-Land LGA package IHS. Figure 7-14. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package IHS Groove Pin1 indicator When the processor is installed in the LGA775 socket, the groove is parallel to the... -
Page 95: Thermocouple Attach Procedure
Case Temperature Reference Metrology Thermocouple Attach Procedure The procedure to attach a thermocouple with solder takes about 15 minutes to complete. Before proceeding turn on the solder block heater, as it can take up to 30 minutes to reach the target temperature of 153 – 155 °C. Note: To avoid damage to the processor ensure the IHS temperature does not exceed 155 °C. -
Page 96: Thermocouple Attachment To The Ihs
Case Temperature Reference Metrology Figure 7-17. Bending the Tip of the Thermocouple D.5.2 Thermocouple Attachment to the IHS 12. Clean groove and IHS with Isopropyl Alcohol (IPA) and a lint free cloth removing all residues prior to thermocouple attachment. 13. Place the thermocouple wire inside the groove; letting the exposed wire and bead extend about 1.5 mm [0.030 inch] past the end of groove. -
Page 97: Figure 7-19. Thermocouple Bead Placement
Case Temperature Reference Metrology Figure 7-19. Thermocouple Bead Placement 16. Place the package under the microscope to continue with process. It is also recommended to use a fixture (like processor tray or a plate) to help holding the unit in place for the rest of the attach process. 17. -
Page 98: Figure 7-20. Position Bead On The Groove Step
Case Temperature Reference Metrology Figure 7-20. Position Bead on the Groove Step Wire section Kapton* into the tape groove to prepare for final bead placement Figure 7-21. Detailed Thermocouple Bead Placement TC Bead TC Wire with Insulation IHS with Groove Figure 7-22. -
Page 99: Figure 7-23. Measuring Resistance Between Thermocouple And Ihs
Case Temperature Reference Metrology 18. Place a 3 piece of tape at the end of the step in the groove as shown in Figure 7-22. This tape will create a solder dam to prevent solder from flowing into the larger IHS groove section during the melting process. 19. -
Page 100: Figure 7-24. Applying Flux To The Thermocouple Bead
Case Temperature Reference Metrology Figure 7-24. Applying Flux to the Thermocouple Bead 21. Cut two small pieces of solder 1/16 inch (0.065 inch / 1.5 mm) from the roll using tweezers to hold the solder while cutting with a fine blade(see Figure 7-25) Figure 7-25. -
Page 101: Solder Process
Case Temperature Reference Metrology Figure 7-26. Positioning Solder on IHS 23. Measure the resistance from the thermocouple end wires again using the DMM (refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the IHS. D.5.3 Solder Process 24. -
Page 102: Figure 7-27. Solder Station Setup
Case Temperature Reference Metrology Figure 7-27. Solder Station Setup 27. Remove the land side protective cover and place the device to be soldered in the solder station. Make sure the thermocouple wire for the device being soldered is exiting the heater toward you. Note: Do not touch the copper heater block at any time as this is very hot. -
Page 103: Figure 7-28. View Through Lens At Solder Station
Case Temperature Reference Metrology Figure 7-28. View Through Lens at Solder Station Figure 7-29. Moving Solder back onto Thermocouple Bead Thermal and Mechanical Design Guidelines... -
Page 104: Figure 7-30. Removing Excess Solder
Case Temperature Reference Metrology 31. Lift the heater block and magnified lens, using tweezers quickly rotate the device 90 degrees clockwise. Using the back of the tweezers press down on the solder this will force out the excess solder Figure 7-30. Removing Excess Solder 32. -
Page 105: Cleaning And Completion Of Thermocouple Installation
Case Temperature Reference Metrology D.5.4 Cleaning and Completion of Thermocouple Installation 33. Remove the device from the solder station and continue to monitor IHS Temperature with a handheld meter. Place the device under the microscope and remove the three pieces of Kapton* tape with Tweezers, keeping the longest for re-use. -
Page 106: Figure 7-33. Filling Groove With Adhesive
Case Temperature Reference Metrology 36. Clean the surface of the IHS with Alcohol and use compressed air to remove any remaining contaminants. 37. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope that the thermocouple wire is below the surface along the entire length of the IHS groove (see Figure 7-33). -
Page 107: Figure 7-35. Removing Excess Adhesive From Ihs
Case Temperature Reference Metrology Figure 7-35. Removing Excess Adhesive from IHS 39. Using a blade, carefully shave any adhesive that is above the IHS surface (see Figure 7-35). The preferred method is to shave from the edge to the center of the IHS. -
Page 108: Thermocouple Wire Management
Case Temperature Reference Metrology 45. Place the device in a tray or bag until it is ready to be used for thermal testing use. Thermocouple Wire Management When installing the processor into the socket, the thermocouple wire should route under the socket lid, as shown in Figure 7-37. This will keep the wire from getting damaged or pinched when removing and installing the heatsink. -
Page 109: Appendix E Legacy Fan Speed Control
Legacy Fan Speed Control Appendix E Legacy Fan Speed Control A motherboard design may opt to use a SIO or ASIC based fan speed control device that uses the existing look up or state based fan speed control. The fan speed control implementations consist of the following items •... -
Page 110: Minimum Fan Speed Set Point
Legacy Fan Speed Control The benefit of this upper limit will become more apparent when the fan speed controller is responding to the on-die thermal sensor. Figure 7-38. Thermistor Set Points Variable Speed Fan (VSF) Curve Variable Speed Fan (VSF) Curve Full Full Speed... -
Page 111: Board And System Implementation
PWM signal. These components can be a discrete device or a super IO (SIO) with the functionality embedded. Intel has engaged with a number of major manufacturers of FSC components to provide devices that have a PECI host controller. -
Page 112: Figure 7-40. Fan Speed Control
Legacy Fan Speed Control These are the minimum parameters required to implement acoustic fan speed control. See Figure 7-40 for an example. There may be vendor specific options that offer enhanced functionality. See the appropriate vendor datasheet on how to implement those features. -
Page 113: Figure 7-41. Temperature Range = 5 °C
Legacy Fan Speed Control Figure 7-41. Temperature Range = 5 °C Fan RPM Tdiode Tcontrol Tlow 3500 3000 2500 2000 1500 1000 Time (s) An alternate would be to consider a slightly larger value such as T = 10 °C. In RANGE this case the design is trading off the acoustic margin for thermal margin. -
Page 114: Figure 7-42. Temperature Range = 10 °C
Legacy Fan Speed Control Figure 7-42. Temperature Range = 10 °C Fan RPM Tdiode Tcontrol Tlow 3500 3000 2500 2000 1500 1000 Time (s) It should be noted that having T above T is expected for workloads near SENSOR CONTROL TDP power levels and high system ambient. -
Page 115: Combining Thermistor And On-Die Thermal Sensor Control
Thermal Profile. The minimum requirement for thermal compliance is to ensure the thermal solution, by design, meets the thermal profile. If the system design will incorporate acoustic speed fan control, Intel requires monitoring the on-die thermal sensor to implement acoustic fan speed control. The value of the on-die thermal sensor temperature determines which specification must be met. -
Page 116: Table 7-3. Fsc Definitions
Legacy Fan Speed Control To use all of the features in the Intel reference heatsink design or the Boxed Processor, system integrators should verify the following functionality is present in the board design. Please refer to the Fan Specification for 4 wire PWM Controlled Fans and Chapter 6 for complete details on the Intel enabled thermal solution. -
Page 117: Figure 7-44. Fsc Definition Example
Legacy Fan Speed Control Figure 7-44. FSC Definition Example Requirements Classification • Required – an essential part of the design necessary to meet specifications. Should be considered a pass or fail in selection of a board. • Suggested – highly desired for consistency among designs. May be specified or expanded by the system integrator. -
Page 118: Table 7-4. Atx Fsc Settings
Correction Factor NOTES: ® A PWM frequency of 25 kHz is the design target for the reference and for the Intel Boxed Processor and the reference design. Use the lowest time available in this range for the device selected. To ensure compliance with the thermal specification, thermal profile and usage of the for fan speed control these setting should not be user configurable. -
Page 119: Table 7-5. Balanced Technology Extended (Btx) Fan Speed Control Settings
Correction Factor NOTES: ® A PWM frequency of 25 kHz is the design target for the reference and for the Intel Boxed Processor and BTX reference design. Use the lowest time available in this range for the device selected. = represents the amount of delay time before responding to the temperature... - Page 120 Legacy Fan Speed Control Thermal and Mechanical Design Guidelines...
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Page 121: Appendix F Balanced Technology Extended (Btx) System Thermal Considerations
Thermal sensor be elevated above the board. The thermal sensor location and elevation are reflected in the Flotherm thermal model airflow illustration and pictures (see Figure 7-45 and Figure 7-46).The Intel Boxed Boards in BTX form factor have implemented a System Monitor thermal sensor. The... -
Page 122: Figure 7-45. System Airflow Illustration With System Monitor Point Area Identified
Balanced Technology Extended (BTX) System Thermal Considerations Part Number: C83274-002 Part Number: 68801-0170 BizLink USA Technology, Inc. Molex Incorporated 44911 Industrial Drive 2222 Wellington Ct. Fremont, CA 94538 USA Lisle, IL 60532 (510)252-0786 phone 1-800-78MOLEX phone (510)252-1178 fax 1-630-969-1352 fax sales@bizlinktech.com amerinfo@molex.com Figure 7-45. -
Page 123: Figure 7-46. Thermal Sensor Location Illustration
Balanced Technology Extended (BTX) System Thermal Considerations Figure 7-46. Thermal sensor Location Illustration Thermal Sensor MCH Heatsink § Thermal and Mechanical Design Guidelines... - Page 124 Balanced Technology Extended (BTX) System Thermal Considerations Thermal and Mechanical Design Guidelines...
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Page 125: Appendix G Fan Performance For Reference Design
Fan Performance for Reference Design Appendix G Fan Performance for Reference Design The fan power requirements for proper operation are given Table 7-6. Table 7-6. Fan Electrical Performance Requirements Requirement Value Maximum Average fan current draw 1.5 A Fan start-up current draw 2.2 A Fan start-up current draw maximum 1.0 second... - Page 126 Fan Performance for Reference Design § Thermal and Mechanical Design Guidelines...
- Page 127 Fan Performance for Reference Design Thermal and Mechanical Design Guidelines...
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Page 128: Appendix H Mechanical Drawings
The following table lists the mechanical drawings included in this appendix. These drawings refer to the reference thermal mechanical enabling components for the processor. Note: Intel reserves the right to make changes and modifications to the design as necessary. Drawing Description... - Page 129 47.50 45.26 40.00 39.01 36.78 36.00 32.51 27.81 27.51 23.47 7.30 2 0.00 5.90 ) 16.87 23.47 27.00 27.51 32.51 36.49 33.00 36.78 36.00 40.00 39.01 44.00 45.26 47.50...
- Page 145 DWG. NO. REV.
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Page 146: Appendix I Intel Enabled Reference Solution Information
The following tables list suppliers that produce Intel enabled reference components. The part numbers listed in the tables identify these reference components. End-users are responsible for the verification of the Intel enabled component offerings with the supplier. OEMs and System Integrators are responsible for thermal, mechanical, and environmental validation of these solutions. -
Page 147: Table 7-9. E18764-001 Reference Thermal Solution Providers
Intel Enabled Reference Solution Information Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice. -
Page 148: Table 7-10. Balanced Technology Extended (Btx) Reference Thermal Solution
The user should note that for the 2004 Type I Intel reference Thermal Module Assembly: also meets 2005 Performance (130 W) and Mainstream (84 W) as well as the 2004 Performance 775_VR_CONFIG_04 (115 W).