Intel 5148LV - Xeon Dual Core Active H Datasheet page 30

Table 2-13. Voltage and Current Specifications (Sheet 2 of 2)
Symbol
I
TT
I
CC_TDC
I
CC_TDC
I
CC_TDC
I
CC_VTT_OUT
I
CC_GTLREF
I
CC_VCCPLL
I
TCC
I
TCC
I
TCC
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processors and are based on estimates
and simulations, not empirical data. These specifications will be updated with characterized data from
silicon measurements at a later date.
2. These voltages are targets only. A variable voltage source should exist on systems in the event that a
different voltage is required. See
3. The voltage specification requirements are measured across the VCC_DIE_SENSE and VSS_DIE_SENSE
lands and across the VCC_DIE_SENSE2 and VSS_DIE_SENSE2 lands with an oscilloscope set to 100 MHz
bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of
ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled
in the scope probe.
4. The processor must not be subjected to any static V
particular current. Failure to adhere to this specification can shorten processor lifetime.
5. I
CC_MAX
to 10 ms.
6. I
CC_RESET
7. This specification represents the total current for GTLREF_DATA and GTLREF_ADD.
8. V must be provided via a separate voltage source and must not be connected to V
TT
measured at the land.
9. Minimum VCC and maximum ICC are specified at the maximum processor case temperature (TCASE)
shown in
10. This specification refers to the total reduction of the load line due to VID transitions below the specified
VID.
11. Individual processor VID values may be calibrated during manufacturing such that two devices at the same
frequency may have different VID settings.
12. This specification applies to the VCCPLL land.
13. Baseboard bandwidth is limited to 20 MHz.
30
Parameter
I for V supply before V
CC TT CC
stable
I for V supply after V
CC TT CC
stable
Thermal Design Current
(TDC) Dual-Core Intel®
Xeon® Processor LV 5148/
5138/5128
Thermal Design Current
®
(TDC) Dual-Core Intel
®
Xeon Processor 5100
Series
Thermal Design Current
(TDC) Dual-Core Intel®
Xeon® Processor 5160
DC current that may be
drawn from V per land
TT_OUT
I for
CC
GTLREF_DATA and
GTLREF_ADD
I for PLL supply
CC
I for Dual-Core Intel®
CC
Xeon® Processor LV 5148/
5138/5128 during active
thermal control circuit (TCC)
®
I for Dual-Core Intel
CC
®
Xeon Processor 5100
Series during active thermal
control circuit (TCC)
I for Dual-Core Intel®
CC
Xeon® Processor 5160
during active thermal control
circuit (TCC)
Section 2.5
specification is based on maximum V
is specified while PWRGOOD and RESET# are asserted.
Figure 6-1.
Min Typ Max
4.5
4.6
35
60
70
580
200
130
45
65
90
for more information.
level that exceeds the V
CC
loadline The processor is capable of drawing I
CC
® ®
Dual-Core Intel Xeon Processor 5100 Series Datasheet
Electrical Specifications
Notes
Unit
1,13
A 16
A 6,15
A 6,15
A 6,15
mA 17
µA 8
mA 13
A
A
A
associated with any
CC_MAX
for up
CC_MAX
. This specification is
CC