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Thermal Specifications and Design Considerations—Intel
GHz
5.0
Thermal Specifications and Design Considerations
The Intel
maintain temperatures within operating limits as set forth in
to operate that processor outside these operating limits may result in permanent
damage to the processor and potentially other components in the system.
As processor technology changes, thermal management becomes increasingly crucial
when building computer systems. Maintaining the proper thermal environment is key to
reliable, long-term system operation. A complete thermal solution includes both
component and system level thermal management features. Component level thermal
solutions include active or passive heatsinks or heat exchangers attached to the
processor exposed die. The solution should make firm contact to the die while
maintaining processor mechanical specifications such as pressure. A typical system
level thermal solution may consist of a processor fan. A secondary fan or air from the
processor fan may also be used to cool other platform components or to lower the
internal ambient temperature within the system.
To allow for the optimal operation and long-term reliability of Intel processor-based
systems, the system/processor thermal solution should be designed such that the
processor remains within the minimum and maximum junction temperature (T
specifications at the corresponding thermal design power (TDP) value listed in
for the Intel
to provide this level of thermal capability may affect the long-term reliability of the
processor and system.
Refer to the
for Embedded Applications
cooling approaches.
The maximum junction temperature is defined by an activation of the processor Intel
Thermal Monitor. Refer to
applications are unlikely to cause the processor to consume the theoretical maximum
power dissipation for sustained time periods. Intel recommends that complete thermal
solution designs target the TDP indicated in
is designed to help protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained period of time. For more details on
the usage of this feature, refer to
feature must be enabled for the processor to remain within specification.
Table 16.
Power Specifications for the Intel
(Sheet 1 of 2)
Symbol
TDP
Symbol
P
AH,
P
SGNT
January 2007
Order Number: 315876-002
®
®
Celeron
Processor 1.66 GHz/1.83 GHz requires a thermal solution to
®
®
Celeron
Processor 1.66 GHz/1.83 GHz. Thermal solutions not designed
Intel® Celeron® Processor 1.66 GHz/1.83 GHz Thermal Design Guideline
document for more details on processor and system level
Section 5.1.3
Core Frequency & Voltage
1.66 GHz/1.83 GHz
Parameter
Auto Halt, Stop Grant Power
®
®
Celeron
Processor 1.66 GHz/1.83
for more details. Analysis indicates that real
Table
16. The Intel thermal monitor feature
Section
5.1.3. In all cases the Intel thermal monitor
®
®
Celeron
Processor 1.66 GHz/1.83 GHz
Thermal Design
Power
27
Min
Typ
®
Intel
Celeron
Section
5.1. Any attempt
)
J
Table 16
Unit
Notes
W
1, 4
Max
Unit
Notes
15.0
W
2
®
Processor 1.66 GHz/1.83 GHz
®
DS
61
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