Mechanical Specifications; Boxed Processor Cooling Solution Dimensions; Space Requirements For The Boxed Processor (Side View); Space Requirements For The Boxed Processor (Top View) - Intel E8200 - Cpu Core 2 Duo 2.66Ghz Fsb1333Mhz 6M Lga775 Tray Datasheet

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7.2

Mechanical Specifications

7.2.1

Boxed Processor Cooling Solution Dimensions

This section documents the mechanical specifications of the boxed processor. The
boxed processor will be shipped with an unattached fan heatsink.
mechanical representation of the boxed processor.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper
cooling. The physical space requirements and dimensions for the boxed processor with
assembled fan heatsink are shown in
The airspace requirements for the boxed processor fan heatsink must also be
incorporated into new baseboard and system designs. Airspace requirements are
shown in
(marked with alphabetic designations) to clarify relative dimensioning.
Figure 21.

Space Requirements for the Boxed Processor (Side View)

Figure 22.

Space Requirements for the Boxed Processor (Top View)

NOTES:
1.
Diagram does not show the attached hardware for the clip design and is provided only as a
mechanical representation.
94
Figure 26
and
Figure
27. Note that some figures have centerlines shown
81.3
[3.2]
95.0
[3.74]
Figure 21
(Side View), and
95.0
[3.74]
95.0
[3.74]
Boxed Processor Specifications
Figure 20
shows a
Figure 22
(Top View).
10.0
25.0
[0.39]
[0.98]
B
d P
Sid Vi
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