Terminology; Processor Terminology Definitions - Intel E8200 - Cpu Core 2 Duo 2.66Ghz Fsb1333Mhz 6M Lga775 Tray Datasheet

1.1

Terminology

A '#' symbol after a signal name refers to an active low signal, indicating a signal is in
the active state when driven to a low level. For example, when RESET# is low, a reset
has been requested. Conversely, when NMI is high, a nonmaskable interrupt has
occurred. In the case of signals where the name does not imply an active state but
describes part of a binary sequence (such as address or data), the '#' symbol implies
that the signal is inverted. For example, D[3:0] = 'HLHL' refers to a hex 'A', and
D[3:0]# = 'LHLH' also refers to a hex 'A' (H= High logic level, L= Low logic level).
"Front Side Bus" refers to the interface between the processor and system core logic
(a.k.a. the chipset components). The FSB is a multiprocessing interface to processors,
memory, and I/O.
1.1.1

Processor Terminology Definitions

Commonly used terms are explained here for clarification:
• Intel
LGA8 package with a 6 MB L2 cache.
• Intel
LGA8 package with a 3 MB L2 cache.
• Processor — For this document, the term processor is the generic form of the
®
Intel
E7000 series.
• Voltage Regulator Design Guide — For this document "Voltage Regulator Design
Guide" may be used in place of:
— Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design
Guidelines For Desktop LGA775 Socket
• Enhanced Intel
architecture-based desktop, mobile and mainstream server multi-core processors.
For additional information refer to:
coremicro/
• Keep-out zone — The area on or near the processor that system design can not
use.
• Processor core — Processor die with integrated L2 cache.
• LGA775 socket — The processors mate with the system board through a surface
mount, 775-land, LGA socket.
• Integrated heat spreader (IHS) —A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
• Retention mechanism (RM) — Since the LGA775 socket does not include any
mechanical features for heatsink attach, a retention mechanism is required.
Component thermal solutions should attach to the processor using a retention
mechanism that is independent of the socket.
• FSB (Front Side Bus) — The electrical interface that connects the processor to
the chipset. Also referred to as the processor system bus or the system bus. All
memory and I/O transactions as well as interrupt messages pass between the
processor and chipset over the FSB.
10
®
Core™2 Duo processor E8000 series — Dual core processor in the FC-
®
Core™2 Duo processor E7000 series — Dual core processor in the FC-
Core™2 Duo processor E8000 series and Intel
® ™
Core microarchitecture — A new foundation for Intel
®
Core™2 Duo processor
http://www.intel.com/technology/architecture/
Introduction
®
Datasheet