Package Insertion Specifications; Processor Mass Specification; Processor Materials; Processor Markings - Intel E8200 - Cpu Core 2 Duo 2.66Ghz Fsb1333Mhz 6M Lga775 Tray Datasheet

3.5

Package Insertion Specifications

The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.6

Processor Mass Specification

The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.7

Processor Materials

Table 23
Table 23.

Processor Materials

Integrated Heat Spreader
Substrate Lands
3.8

Processor Markings

Figure 10
identification of the processor.
Figure 10.

Processor Top-Side Markings Example

40
lists some of the package components and associated materials.
Component
(IHS)
Substrate
shows the top-side markings on the processor. This diagram is to aid in the
INTEL
Intel® Core®2 Duo
SLxxx [COO]
3.16GHZ/6M/1333/06
[FPO]
Package Mechanical Specifications
Material
Nickel Plated Copper
Fiber Reinforced Resin
Gold Plated Copper
©'06 E8500
M
e
4
ATPO
S/N
Datasheet