Thermal Consideration - Quectel EG91 Series Hardware Design

Table 51: Electrostatic Discharge Characteristics (Temperature: 25 ºC, Humidity: 45 %)
Tested Interfaces
VBAT, GND
All Antenna Interfaces
Other Interfaces

6.8. Thermal Consideration

In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal consideration:
 On your PCB design, please keep placement of the module away from heating sources, especially
high power components such as ARM processor, audio power amplifier, power supply, etc.
 Do not place components on the opposite side of the PCB area where the module is mounted, in
order to facilitate adding of heatsink when necessary.
 Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as
to ensure better heat dissipation performance.
 The reference ground of the area where the module is mounted should be complete, and add ground
vias as many as possible for better heat dissipation.
Make sure the ground pads of the module and PCB are fully connected.

According to your application demands, the heatsink can be mounted on the top of the module, or the

opposite side of the PCB area where the module is mounted, or both of them.
The heatsink should be designed with as many fins as possible to increase heat dissipation area.

Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and
module/PCB.
The following shows two kinds of heatsink designs for reference and you can choose one or both of them
according to their application structure.
EG91_Series_Hardware_Design
Contact Discharge
±5
±4
±0.5
LTE Standard Module Series
Air Discharge
±10
±8
±1
Unit
kV
kV
kV
89 / 105