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1.3 System Features
The following table provides you with an overview of the main features of the 2029P-DN2R24L.
Please refer to Appendix C for additional specifications.
Motherboard
X11DSN-TS
Chassis
SC227TS-R2K05P3
CPU
The X11DSN-TS motherboard supports dual
Intel Xeon 81xx/61xx/51xx/41xx/31xx and 82xx/62xx/52xx/42xx/32xx series (Socket P) processors which offer
three Intel® UltraPath Interconnect (UPI) of up to 10.4 GT/s.
Note: Both CPUs need to be installed for full access to the PCI-E slots, DIMM slots, and onboard controllers.
Refer to the block diagram on page 18 to determine which slots or devices may be affected.
Socket Type
Socket P
Memory
The integrated memory controller embedded in the processor supports up to 3 TB of 3DS Load Reduced
DIMM (3DS LRDIMM), 3DS Registered DIMM (3DS RDIMM) and NV-DIMM DDR4 (288-pin) ECC memory
2933/2666/2400/2133 Mhz speed modules in up to 12 slots per node.
Chipset
Intel C624 chipset
Expansion Slots
Supports the following expansion slots (per node):
Two PCI-E 3.0 x16 slots
One M.2 slot/connector
One SIOM slot
Internal Node-to-Node Connectivity
One NTB (Non-Transparent Bridge) by PLX PCI-E x8
Two 10G private Ethernet
Hard Drives
Up to 24 2.5" dual port hot-swap NVMe drives mounted in the chassis front
Power
Dual 2000 Watt, Titanium Level, redundant power supplies
Cooling
Up to five 8-cm mid-mounted cooling fans and four 4-cm exhaust fans
Dimensions
(WxHxD) 17.2" x 3.5" x 25.6" (437mm x 89mm x 650mm)
System Features
9
Chapter 1: Introduction
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