Absolute Maximum Ratings; Thermal Resistance; Esd Caution; Changes To Thermal Resistance Section - Analog Devices AD9776A Manual

ABSOLUTE MAXIMUM RATINGS

Table 5.
Parameter
AVDD33, DVDD33
DVDD18, CVDD18
AGND
DGND
CGND
I120, VREF, IPTAT
OUT1_P, OUT1_N,
OUT2_P, OUT2_N,
AUX1_P, AUX1_N,
AUX2_P, AUX2_N
P1D<15> to P1D<0>,
P2D<15> to P2D<0>
DATACLK, TXENABLE
REFCLK+, REFCLK−
RESET, IRQ, PLL_LOCK,
SYNC_O+, SYNC_O−,
SYNC_I+, SYNC_I−,
CSB, SCLK, SDIO, SDO
Junction Temperature
Storage Temperature
Range
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With Respect To Rating
AGND, DGND, −0.3 V to +3.6 V
CGND
AGND, DGND, −0.3 V to +2.1 V
CGND
DGND, CGND −0.3 V to +0.3 V
AGND, CGND −0.3 V to +0.3 V
AGND, DGND −0.3 V to +0.3 V
AGND −0.3 V to
AVDD33 + 0.3 V
AGND −1.0 V to
AVDD33 + 0.3 V
DGND −0.3 V to
DVDD33 + 0.3 V
DGND −0.3 V to
DVDD33 + 0.3 V
CGND −0.3 V to
CVDD18 + 0.3 V
DGND −0.3 V to
DVDD33 + 0.3 V
+125°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

THERMAL RESISTANCE

For optimal thermal performance, the exposed paddle (EPAD)
should be soldered to the ground plane for the 100-lead,
thermally enhanced TQFP_EP package.
Typical θ and θ
JA JC
Airflow increases heat dissipation effectively reducing θ
Table 6. Thermal Resistance
Package Type
100-Lead TQFP_EP
EPAD Soldered
EPAD Not Soldered

ESD CAUTION

Rev. A | Page 7 of 60
AD9776A/AD9778A/AD9779A
are specified for a 4-layer board in still air.
θ θ
JA JB
19.1 12.4
27.4
.
JA
θ Unit
JC
7.1 °C/W
°C/W