Hardware Specifications - Nexcom DTA1376 Series User Manual

Chapter 1: Product Introduction

Hardware Specifications

Main Board
▪ NXP
Layerscape LS1046A SoC processor, BGA type, 4 Cortex-A72
® ®
cores, 1.8GHz
▪ Supports DPAA
Main Memory
▪ 1 x DDR4 2133 SO-DIMM ECC socket, up to 16GB
Storage Device
▪ 1 x SPI NOR Flash 64MB for U-Boot
▪ 1 x M.2 2242 Key M, supports NVMe SSD with PCIe Gen3 x2
▪ 1 x Micro SD slot (optional)
LAN Features
▪ 7 x 1GbE RJ45 ports
Interface External
▪ SW1/SW2/SW3/power LEDs
▪ Ethernet LED: active/link speed
▪ 2 x USB 3.0
▪ 1 x Nano sim slot
▪ 1 x DC-in 12VDC
▪ 1 x Power button
▪ 1 x RJ45 console port
▪ 1 x Reset button
▪ 6 x SMA connectors (sides: 4 x for 4G LTE/5G antennas, back: 2 x forWi-Fi
5 antennas)
▪ 7 x 1GbE RJ45 ports
Copyright © 2022 NEXCOM International Co., Ltd. All Rights Reserved.
Interface Internal
▪ 1x mini-PCIe for Wi-Fi 5 module
▪ 1x M.2 3042/3052 for 4G LTE/5G FR1 module
▪ 1x M.2 2242 Key M for NVMe SSD
▪ 1x Micro SD slot (optional)
Power Input
▪ 1 x 40W 12V AC power adapter
Dimension and Weight
▪ Chassis dimension (mm): 225mm x 150mm x 44mm (W x D x H)
▪ Package dimension(mm): 343 x 258 x 212 (W x D x H)
▪ Without packing: 1.5kg
▪ With packing: 2.5kg
Environment
▪ Operating temperature: 0°C~40°C
▪ Storage temperature: -20°C~80°C
▪ Relative humidity: 10%~90% non-condensing
Certifications
▪ CE/FCC Class B
▪ LVD
Software Development Kit
▪ NXP
® Layerscape ® SDK 20.04-NEXCOM DTA1376 revision
2
DTA1376 Series User Manual