Hardware Specifications - Nexcom DNA 1170 Series User Manual

Chapter 1: Product Introduction

Hardware Specifications

Main Board
▪ Intel Atom
C5000 processor w/ QAT
®
– Intel Atom ® processor C5315, BGA type, 4 cores/2.4 GHz for DNA
1170
– Intel Atom processor C5325, BGA type, 8 cores/2.4 GHz for DNA
®
1170A
– Intel Atom processor C5325, BGA type, 8 cores/2.4 GHz for DNA
®
1170W
Main Memory
▪ 2GB2 x DDR4 2933 SODIMM, up to 16GB
Storage
▪ 1 x M.2 Key M 2242 for SATA 3.0
▪ 2 x 2.5" SSD SATA 3.0 (DNA 1170W)
Interface External
▪ Button: power and reset
▪ LED: status/MGMT/HA/PWR1/PWR2/SSD/LAN
▪ LED (optional): bypass/5G LTE/Wi-Fi
▪ 1 x RJ45 console port
▪ 3 x USB 3.0 connector
▪ 1 x Nano SIM slot (DNA 1170W)
▪ 1 x 1G RJ45 management port
▪ 8 x 1GbE RJ45 ports
– 4 x 1GbE RJ45 ports with 2 x bypass pairs
▪ 4 x SFP+ ports
▪ 1 x Fixed smart fan
Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved.
▪ 2 x Power inlets
▪ 6 x Antenna holes (4 x antennas for 5G LTE, 2 x antennas for Wi-Fi 6E)
(DNA 1170W)
Interface Internal
▪ 1 x mini-PCIe slot for Wi-Fi module (DNA 1170W)
▪ 1 x M.2 3042 Key B for 5G/LTE module (DNA 1170W)
▪ 1 x TPM header
Power
▪ 2 x 65W 19V AC power adapters
Dimension and Weight
▪ Chassis dimension (mm): 340 x 250 x 44 (W x D x H)
▪ Package dimension(mm): 436 x 346 x 198 (W x D x H)
▪ Without packing: 2.9kg
▪ With packing: 4.3kg
Environment
▪ Operating temperature: 0°C~40°C
▪ Storage temperature: -20°C~80°C
▪ Relative humidity: 10%~90%, non-condensing
Certifications
▪ CE
▪ FCC Class B
2
DNA 1170 Series User Manual