Temperature Range (Operation/Storage); Heat Dissipation; General Guidelines For Heat Dissipation - Automation Technology C2 Series User Manual

Temperature Range (Operation/Storage)

Housing temperature during operation:
Sensor chip temperature (on-board) during operation:
Humidity during operation:
Storage temperature:
Storage humidity:

Heat Dissipation

The operation of the C2 sensors requires sufficient heat dissipation. Due to the small size of the
camera housing there is not enough cooling surface to dissipate the thermal power loss generated
by the core electronics and sensor chip.
All 3D sensors of the C2 series feature high-speed CMOS sensor chips. A typical property of a CMOS
sensor is that it provides best image quality by low temperatures. High temperatures will lead to an
increase of dark current, noise and hence to a reduction of signal-to-noise ratio (SNR).
To eliminate these effects it is often sufficient to mount the C2 sensor on a heat conductive material,
such as a metal surface.
In case that it is not possible to mount the camera on any heat dissipating carrier, then
it is recommended to use a heat sink with the required specification of AT.

General Guidelines for Heat Dissipation

Mount the 3D sensor to a heat conductive material with an absolute thermal resistance of at

least 6 K / W.
Always monitor the temperature of the sensor (on-board, available over GenICam) and make

sure that the temperature does not exceed 65°C.
Keep in mind that dark current and noise performance for CMOS sensor will degrade at

higher temperature.
The 3D sensor of the C2 series will gradually become warmer during the first hour of

operation. After one hour of operation, the housing temperature as well as the sensor
temperature should be stable and no longer increase.
10 
0°C to +50°C (+32°F to +122°F)
0°C to +65°C (+32°F to +149°F)
20% to 80%, relative, non-condensing
-20°C to +80°C (-4°F to +176°F)
20% to 80%, relative, non-condensing
C2 Series User Manual Rev. 1.9