DFE Module Specifications
Table A-1 Specifications (continued)
Item
7KR4290-02 Ports
Ports 1 and 2
Processors/Memory
Processor
Dynamic Random Access Memory
(DRAM)
FLASH Memory
Physical
Dimensions
Approximate Weight
7GR4270-12
7GR4202-30
7KR4290-02
Approximate Weight
7GR4280-19
Predicted hours for Mean Time
Between Failures (MTBF) for DFE
modules:
Environmental
Operating Temperature
Storage Temperature
Operating Relative Humidity
A-2 Specifications
Specification
Port interface option slots that support 10GBASE XENPAK
PHYs. Each port can support a full 10 Gbps throughput with a
maximum of 20 Gbps, when both ports are active at the same
time.
IBM 750CXe, 600 MHz processor
256 MB
32 MB
46.43 H x 6.05 W x 29.51 D (cm)
18.28 H x 2.38 W x 11.62 D (in.)
Gross: 5.54 kg (12.0 lb) (shipping carton containing one module)
Net:
4.10 kg (9.0 lb) (one module without packaging)
Gross: 5.0 kg (11.0 lb) (shipping carton containing one module)
Net:
3.86 kg (8.5 lb) (one module without packaging)
Refer to the MTBF web site at this URL:
http://www.enterasys.com/support/mtbf/
5°C to 40°C (41°F to 104°F)
-30°C to 73°C (-22°F to 164°F)
5% to 90% (non-condensing)
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