Quectel QuecOpen AG521R-NA Hardware Design page 80

⚫
Do not place components on the opposite side of the PCB area where the module is mounted, in order to
facilitate adding of heatsink when necessary.
⚫
Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure
better heat dissipation performance.
⚫
The reference ground of the area where the module is mounted should be complete, and add ground vias as
many as possible for better heat dissipation. Through-holes will create better heat dissipation performance.
⚫
Make sure the ground pads of the module and PCB are fully connected.
⚫ According to customers' application demands, the heatsink can be mounted on the top of the module, or the
opposite side of the PCB area where the module is mounted, or both of them.
⚫
The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a
thermal pad with high thermal conductivity should be used between the heatsink and module/PCB.
The following shows two kinds of heatsink designs for reference and customers can choose one or both of them
according to their application structure.
AG525R-GL QuecOpen
Application Board
Figure 37: Referenced Heatsink Design (Heatsink at the Top of the Module)
AG525R-GL QuecOpen
Application Board
Figure 38: Referenced Heatsink Design (Heatsink at the Backside of Customers' PCB)
AG521R-NA_QuecOpen_Hardware_Design
Module
Heatsink
Thermal Pad
Shielding Cover
Thermal Pad
Module
Heatsink
Shielding Cover
Automotive Module Series
AG521R-NA QuecOpen Hardware Design
Heatsink
Application Board
Thermal Pad
Heatsink
Application Board
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