Quectel QuecOpen AG521R-NA Hardware Design page 81

NOTES
1. For better performance, the maximum temperature of the internal BB chip should be kept below 105 ° C.
When the maximum temperature of the BB chip reaches or exceeds 105 ° C, the module works normal but
provides reduced performance (such as RF output power and data rate). When the maximum BB chip
temperature reaches or exceeds 118 ° C, the module will disconnect from the network, and it will recover to
network connected state after the maximum temperature falls below 118 ° C. Therefore, the thermal design
should be maximally optimized to make sure the maximum BB chip temperature always maintains below
105 ° C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the
first returned value.
2. For more detailed introduction on thermal design, see document [5].
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