Thermal Characteristics; Table 71. Thermal Characteristics - STMicroelectronics STM32L151QCH6 Manual

STM32L151xC/C-A STM32L152xC/C-A
7.6

Thermal characteristics

The maximum chip-junction temperature, T
using the following equation:
T max = T
J
Where:
• max is the maximum ambient temperature in ° C,
T
A
• Θ
JA
•
P max is the sum of P
D
•
P
INT
internal power.
P max represents the maximum power dissipation on output pins where:
I/O
P
I/O
taking into account the actual V
application.
Symbol
Θ
JA
max + (P max × Θ
A D
is the package junction-to-ambient thermal resistance, in ° C/W,
INT
max is the product of I
max = Σ (V ) + Σ((V
× I
OL OL

Table 71. Thermal characteristics

Thermal resistance junction-ambient
LQFP144 - 20 x 20 mm / 0.5 mm pitch
Thermal resistance junction-ambient
UFBGA132 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
WLCSP64 - 0.400 mm pitch
max, in degrees Celsius, may be calculated
J
)
JA
max and P max (P
I/O
and V , expressed in Watts. This is the maximum chip
DD DD
– V ) × I
DD OH OH
/ I and V / I
OL OL OH OH
Parameter
DocID026119 Rev 5
Package information
max = P max + P
D INT
),
of the I/Os at low and high level in the
Value
40
60
43
46
46
max),
I/O
Unit
°C/W
129/133
132