Interface Design; Power Supply; Dc-Dc Converter - Quectel EC2 Series Design Manualline

3

Interface Design

3.1. Power Supply

3.1.1. DC-DC Converter


DC-DC converter should be away from the sensitive signal traces such as SDIO, USB, SGMII, audio
and RF. If possible, shield DC-DC converter with shielding cover and reserve spacing for shielding
frame.

Place the capacitor and inductor for the DC-DC converter as close as possible to the corresponding
pins of the DC-DC converter to minimize the loop area.

Place output capacitors near input capacitors to share common ground area on outer layers.

Provide adequate thermal relief area at the gound area on outer layers along with any additional
inner ground planes.
DC-DC
DC-DC
Converter
Converter
Figure 3: DC-DC Converter (EVB 4th Layer) and Module Interfaces On TE-A (EVB 1st Layer)
EC2x&EG2x-G_Series_PCB_Design_Guideline
LTE Standard Module Series
EC2x&EG2x-G Series PCB Design Guideline
TE-A Interfaces
TE-A Interfaces
10 / 37