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3.
Leave a small keepout area for the RF traces on the top layer to reduce parasitic effects. Keep the
traces as short as possible. Avoid right-angle routing for RF traces and 135 degrees is recommended
when traces turn corner.
4.
Keep a certain distance between signal pad and ground when packaging the component. If the signal
pad is SMD type, pour the copper on the corresponding signal pad.
5.
Make sure that reference ground planes corresponding to RF traces are complete. Increase the
number of GND vias for current reflow of RF signal, and the spacing between GND vias and RF
traces should be more than two times of trace width. Keep the ground plane area for RF traces within
the same layer be as large as possible and the reference ground plane in the other layer complete as
well. Besides, the number of through vias for those two ground planes should be sufficient.
6.
The pads for PI type matching circuit consisting of a resistor and two capacitors should be near the
module's antenna pins.
Figure 37: Overview of RF Traces (EVB 1st and 2nd Layers)
EC2x&EG2x-G_Series_PCB_Design_Guideline
Figure 36: Overview of RF Traces (EVB 1st Layer)
LTE Standard Module Series
EC2x&EG2x-G Series PCB Design Guideline
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