LTE Standard Module Series
EC2x&EG2x-G Series PCB Design Guideline
GND
GND
PCM_CLK
PCM_SYNC
PCM_OUT
PCM_IN
GND
GND
GND
Figure 19: Overview of PCM Signal Traces (TE-A 3rd Layer)
3.5.2. Codec & Microphone & Speaker
The codec should be kept away from interference sources such as high-power components, power
sources, CPU, DRAM, Flash, PMU, LCD, RF antennas and other high-frequency components, isolated,
and close to one of the edges or corners of the board, and could be shielded if there is sufficient space.
EC2x&EG2x-G_Series_PCB_Design_Guideline
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