Design Priorities And Considerations For Pcb Traces; Design Priorities; Design Considerations - Quectel EC2 Series Design Manualline

2.2. Design Priorities and Considerations for PCB Traces

2.2.1. Design Priorities

Design priorities of PCB traces in order:

Antenna traces.

High-speed signal (SGMII, SDIO and USB) traces.

Power supply (VBAT_BB, VBAT_RF, USIM_VDD, SDIO_VDD, VDD_EXT) traces.

Other traces

2.2.2. Design Considerations


The radiation of PCM interface and power supply could affect RF performance, so keep them away
from RF signal traces and components.

Drill as fewer vias as possible for high-speed signal traces (SGMII, SDIO and USB interfaces) since
vias will affect the continuity of the impedance. Route the differential pair traces on the same layer.

To minimize the signal return path, the GND vias for signals such as USB, SDIO, SGMII, PWRKEY
and RESET_N should be close to the vias when the traces change layers.
High-speed
High-speed
signals
signals
(USB
(USB
interface)
interface)
High-speed
High-speed
signals
signals
(SD card
(SD card
interface)
interface)
Figure 2: High-priority Signals to Be Designed (TE-A 1st Layer)
EC2x&EG2x-G_Series_PCB_Design_Guideline
EC2x&EG2x-G Series PCB Design Guideline
Antenna
Antenna
VABT
VABT
Interfaces
Interfaces
VDD_EXT
VDD_EXT
LTE Standard Module Series
Other signals
Other signals
(e.g. WLAN
(e.g. WLAN
interface)
interface)
High-speed
High-speed
signals
signals
(SGMII
(SGMII
USIM_VDD
USIM_VDD interface)
interface)
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