Bottom Connector Signals - Nokia NSB-7 Series Service Manual

PAMS Technical Documentation

Bottom Connector Signals

Name Min
XMICP,
XMICN
1.47
2.5
100
XEARP,
XEARN
16
16
HEADDET
An external headset device is connected to the system connector XMIC and XEAR lines,
from which the signals are routed to COBBA MIC3 microphone inputs and HF earphone
outputs.
Issue 1 06/00
Typ Max
2.2
1
1.55
2.9
600
60 350
47
10
300
6.8
1.0
22 626
10
1500
2.8
21
ãNokia Mobile Phones Ltd.
Unit Notes
kΩ Input AC impedance
Vpp Maximum signal level
V Mute (output DC level)
V Unmute (output DC level)
µA Bias current
mV Maximum signal level
W Output AC impedance (ref.GND)
µF
Series output capacitance
W Load AC impedance to GND (Headset)
kΩ Load AC impendance to GND (Accessory)
Vpp Maximum output level (no load)
mV Output signal level
kΩ Load DC resistance to GND (Accessory)
W Load DC resistance to GND (Headset)
V DC voltage (100k pull-up to VBB)
µA
When accessory is not connected
NSB-7
UI Module
Page 7