Manufacturing And Soldering - Quectel QuecOpen AG525R-GL Hardware Design

NOTE
1)
1. This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033.
2. To avoid blistering, layer separation and other soldering issues, it is forbidden to expose the modules
to the air for a long time. It is recommended to start the solder reflow process within 24 hours after the
package is removed if the temperature and moisture do not conform to IPC/JEDEC J-STD-033. And
do not remove the packages of tremendous modules if they are not ready for soldering.
3. Please take the module out of the packaging and put it on high-temperature resistant fixtures before
the baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for baking procedure.

7.2. Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil for the module is recommended to be 0.15–0.18 mm. For more details, see
document [6].
It is suggested that the peak reflow temperature is 238 – 246 ºC, and the absolute maximum reflow
temperature is 246 ºC. To avoid damage to the module caused by repeated heating, it is strongly
recommended that the module should be mounted after reflow soldering for the other side of PCB has
been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below.
Temp. (°C)
246
238
220
200
Soak Zone
150
100
AG525R-GL_QuecOpen_Hardware_Design
A
Max slope: 1~3 °C/s
Figure 44: Recommended Reflow Soldering Thermal Profile
Automotive Module Series
AG525R-GL QuecOpen Hardware Design
Reflow Zone
Max slope:
C
2~3 °C/s
B
D
Cooling down slope:
-1.5 ~ -3 °C/s
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