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Quectel QuecOpen EG915U Series Hardware Design

Quectel QuecOpen EG915U Series Hardware Design

Lte standard module
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EG915U Series
Hardware Design
LTE Standard Module Series
Version: 1.0
Date: 2023-10-09
Status: Released
QuecOpen

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Summary of Contents for Quectel QuecOpen EG915U Series

  • Page 1 EG915U Series QuecOpen Hardware Design LTE Standard Module Series Version: 1.0 Date: 2023-10-09 Status: Released...

  • Page 2: Legal Notices

    LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...

  • Page 3: Third-Party Rights

    Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    LTE Standard Module Series About the Document Revision History Version Date Author Description Len CHEN/ 2022-06-30 Creation of the document Ailsa WANG Anla HUANG/ 2023-10-09 Woping WANG/ First official release Loft XU EG915U_Series_QuecOpen_Hardware_Design 4 / 96...

  • Page 6: Table Of Contents

    LTE Standard Module Series Contents Safety Information ............................3 About the Document ........................... 4 Contents ............................... 5 Table Index ..............................7 Figure Index ..............................9 Introduction ............................11 1.1. Special Marks .......................... 11 Product Overview ..........................12 2.1. Frequency Bands and Functions .................... 12 2.2.
  • Page 7 LTE Standard Module Series 4.4. External Flash Interface ......................46 4.5. SD Card Interface ........................47 4.6. USB Interface .......................... 48 4.7. USB_BOOT Interface ......................50 4.8. (U)SIM Interfaces ........................51 4.9. PCM and I2C Interfaces ......................53 4.10. UART Interfaces ........................55 4.11.
  • Page 8 LTE Standard Module Series Table Index Table 1: Special Marks ..........................11 Table 2: Brief Introduction of the Module ....................12 Table 3: Frequency Bands and Functions ....................12 Table 4: Key Features ..........................13 Table 5: Parameter Definition ........................18 Table 6: Pin Description ..........................
  • Page 9 LTE Standard Module Series Table 42: EG915U-EU RF Output Power....................79 Table 43: EG915U-LA RF Output Power ....................79 Table 44: EG915U-CN Conducted RF Receiver Sensitivity (Unit: dBm) ..........79 Table 45: EG915U-EU Conducted RF Receiver Sensitivity (Unit: dBm) ........... 80 Table 46: EG915U-LA Conducted RF Receiver Sensitivity (Unit: dBm) ............
  • Page 10 LTE Standard Module Series Figure Index Figure 1: Functional Diagram ........................16 Figure 2: Pin Assignment (Top View) ......................17 Figure 3: Module Power Consumption in Sleep Mode ................29 Figure 4: Sleep Mode Application with USB Suspend/Resume Function ..........30 Figure 5: Sleep Mode Application Without USB Suspend Function ............
  • Page 11 LTE Standard Module Series Figure 42: Recommended Reflow Soldering Thermal Profile ..............88 Figure 43: Carrier Tape Dimension Drawing ....................90 Figure 44: Plastic Reel Dimension Drawing ....................91 Figure 45: Mounting Direction ........................91 Figure 46: Packaging Process ........................92 EG915U_Series_QuecOpen_Hardware_Design 10 / 96...

  • Page 12: Introduction

    LTE Standard Module Series Introduction ® QuecOpen is a solution where the module acts as the main processor. Constant transition and evolution of both the communication technology and the market highlight its merits. It can help you to: ⚫ Realize embedded applications’ quick development and shorten product R&D cycle ⚫...

  • Page 13: Product Overview

    EG915U series supports Bluetooth and Wi-Fi Scan functions. Due to the shared antenna interface, the two functions cannot be used simultaneously. Pease contact Quectel Technical Support for details about specific models. Only EG915U-CN supports LTE-TDD. For details, please contact Quectel Technical Support.

  • Page 14: Key Features

    LTE Standard Module Series 2.2. Key Features Table 4: Key Features Feature Description ⚫ Supply voltage: 3.3–4.3 V Power Supply ⚫ Typical supply voltage: 3.8 V EG915U-CN: ⚫ EGSM900: Class 4 (33 dBm ± 2 dB) ⚫ DCS1800: Class 1 (30 dBm ± 2 dB) ⚫...
  • Page 15 LTE Standard Module Series ⚫ SMS storage: (U)SIM card and ME; ME by default ⚫ Supports one analog audio input and two analog audio output channels Audio Features ⚫ HR/FR/EFR/AMR/AMR-WB ⚫ Supports echo cancellation and noise suppression LCM Interface Supports LCM interface in SPI mode ⚫...

  • Page 16: Functional Diagram

    LTE Standard Module Series ⚫ STATUS Indicates the module’s operation status Indication Signals ⚫ NET_STATUS indicates the network activity status ⚫ Main antenna interface (ANT_MAIN) ⚫ Antenna Interfaces Bluetooth and Wi-Fi Scan antenna interface (ANT_BT/WIFI_SCAN) ⚫ 50 Ω characteristic impedance Position Fixing Supports Wi-Fi Scan ⚫...
  • Page 17 LTE Standard Module Series ANT_MAIN ANT_BT/WIFI_SCAN Duplex VBAT_RF VBAT_BB 26 MHz Transceiver DCXO 32 kHz Clock PWRKEY Control RESET_N PMIC Control Baseband ADCs SPI NOR Flash (64 Mb) PSRAM (128 Mb) MIC_P/_N HP_R/_L SPK_P/_N NET_STATUS USB_BOOT VDD_EXT (U)SIM × 2 UARTs Camera STATUS...

  • Page 18: Pin Assignment

    Keep unused and RESERVED pins unconnected, and all GND pins are connected to the ground network. The module supports Dual SIM Single Standby. For details, please contact Quectel Technical Support. When using pins 18, 19, 30, 38, 39, and 110, please note that these pins will have a period of...

  • Page 19: Pin Description

    LTE Standard Module Series variable level state (not controllable by software) after the module is powered on: first high level (3 V) for 2 s and then low level (0 V) for 1.2 s, before they can be configured as 1.8 V input or output.
  • Page 20 LTE Standard Module Series Test points are recommended to be reserved. It must be provided with sufficient current of at least Power supply for the VBAT_RF 52, 53 2.5 A. module’s RF part Test points are recommended to be reserved. Used with a 2.2 μF capacitor and TVS Provides 1.8 V for...
  • Page 21 LTE Standard Module Series Characteristics Vmax = 5.25 V USB connection A test point must be USB_VBUS Vmin = 3.5 V detect reserved. Vnom = 5.0 V USB 2.0 differential USB 2.0 compliant. USB_DP data (+) Requires differential impedance of 90 Ω. USB 2.0 differential Test points must be USB_DM...
  • Page 22 LTE Standard Module Series Vmax = 1.9 V supported and can Vmin = 1.7 V be identified 3.0 V (U)SIM: automatically by the Vmax = 3.05 V module. Vmin = 2.7 V 1.8 V (U)SIM: max = 0.6 V min = 1.26 V max = 0.45 V min = 1.35 V USIM2_DATA...
  • Page 23 LTE Standard Module Series Pin Name Description Comment Characteristics Auxiliary UART max = 0.45 V AUX_TXD 1.8 V power transmit min = 1.35 V domain. min = -0.3 V If unused, keep Auxiliary UART max = 0.6 V them open. AUX_RXD receive min = 1.26 V...
  • Page 24 LTE Standard Module Series 1.8 V power I2C_SCL I2C serial clock domain. They need to be pulled up to 1.8 V I2C_SDA I2C serial data externally. If unused, keep them open. RF Antenna Interface Pin Name Description Comment Characteristics 50 Ω characteristic Main antenna ANT_MAIN interface...
  • Page 25 LTE Standard Module Series LCM Interface Pin Name Description Comment Characteristics min = -0.3 V max = 0.6 V LCD_TE LCD tearing effect min = 1.26 V max = 2.0 V LCD_RST LCD reset LCD_SEL Reserved max = 0.45 V 1.8 V power LCD_CS LCD chip select...
  • Page 26 LTE Standard Module Series CAM_SPI_CLK Camera SPI clock min = -0.3 V CAM_SPI_ max = 0.6 V Camera SPI data bit 0 1.8 V power DATA0 min = 1.26 V domain. max = 2.0 V CAM_SPI_ Camera SPI data bit 1 If unused, keep DATA1 them open.
  • Page 27 LTE Standard Module Series Pin Name Description Comment Characteristics It is recommended ADC0 to reserve a voltage General-purpose Voltage range: divider circuit. ADC interfaces 0 V to VBAT ADC1 If unused, keep them open. SD Card Interface Pin Name Description Comment Characteristics 3.2 V power...

  • Page 28: Evb Kit

    Please evaluate whether the unstable output state on power-up meets your application design requirements based on the specific usage scenario and circuit design. 2.6. EVB Kit Quectel supplies an evaluation board (LTE OPEN EVB) with accessories to develop and test the module. For more details, see document [2]. EG915U_Series_QuecOpen_Hardware_Design...

  • Page 29: Operating Characteristics

    LTE Standard Module Series Operating Characteristics 3.1. Operating Modes The following table briefly outlines the operating modes referred in the following chapters. Table 7: Overview of Operating Modes Mode Details Software is active. The module remains registered on the network Idle Full Functionality and is ready to send and receive data.

  • Page 30: Sleep Mode

    LTE Standard Module Series 3.2. Sleep Mode In sleep mode, the module can reduce power consumption to a low level. The following section describes power saving procedures of the module. DRX OFF ON Run time Figure 3: Module Power Consumption in Sleep Mode NOTE DRX cycle values are transmitted over the wireless network.

  • Page 31: Usb Application Without Usb Suspend Function

    LTE Standard Module Series Figure 4: Sleep Mode Application with USB Suspend/Resume Function You can wake up the module by sending data to it through USB. 3.2.2. USB Application Without USB Suspend Function If the host does not support USB suspend function, disconnect USB_VBUS with an external control circuit to make the module enter sleep mode.

  • Page 32: Airplane Mode

    LTE Standard Module Series NOTE Pay attention to the level match shown in the dotted line between the module and the host. USB suspend is supported on Linux system but not on Windows system. 3.3. Airplane Mode When the module enters airplane mode, the RF function is disabled and all API functions related to it are inaccessible.

  • Page 33: Power Supply

    LTE Standard Module Series 3.5. Power Supply 3.5.1. Power Supply Pins The module provides 4 VBAT pins for connection with an external power supply. ⚫ Two VBAT_RF pins for RF part. ⚫ Two VBAT_BB pins for BB part. Table 9: Pin Definition of Power Supply Pin Name Pin No.

  • Page 34: Voltage Stability Requirements

    LTE Standard Module Series DC_IN VBAT 100K 330R 4.7K 470 μF 100 nF 470 μF 100 nF VBAT_EN Figure 6: Reference Design of Power Supply 3.5.3. Voltage Stability Requirements The power supply range of the module is from 3.3 V to 4.3 V. Please make sure the input voltage never drops below 3.3 V.

  • Page 35: Turn On

    LTE Standard Module Series VBAT VBAT_RF VBAT_BB 100 nF 33 pF 10 pF 100 µ F 100 nF 33 pF 10 pF 100 µ F Module Figure 8: Power Supply in Star Configuration 3.6. Turn On 3.6.1. Turn On with PWPKEY Table 10: Pin Definition of PWRKEY Pin Name Pin No.
  • Page 36 LTE Standard Module Series PWRKEY 4.7K 10 nF Turn-on pulse Figure 9: Turning On the Module Using Driving Circuit Another way to control the PWRKEY is using a button directly. When you are pressing the button, electrostatic strike may be generated from finger. Therefore, you must place a TVS nearby the button for ESD protection.
  • Page 37 LTE Standard Module Series Figure 11: Turning On the Module Automatically The turn-on timing is illustrated in the following figure. NOTE1 VBAT 0.5 V PWRKEY About 1.15 s VDD_EXT RESET_N 5.05 s STATUS (DO) UART I nactive Active 2.23 s I nactive Active Figure 12: Turn-on Timing...

  • Page 38: Turn Off

    LTE Standard Module Series NOTE 1. Ensure the voltage of VBAT is stable for at least 30 ms before driving the PWRKEY low. 2. When pulling down PWRKEY to GND by using a resistor, the module will not boot automatically after being turned off with the API function.

  • Page 39: Turn Off With Ql_Power_Down()

    LTE Standard Module Series 3.7.2. Turn Off with ql_power_down() It is also a safe way to use ql_power_down() to turn off the module, which is similar to turning off the module via the PWRKEY pin. NOTE To avoid corrupting the data in the internal flash, do not switch off the power supply when the module works normally.
  • Page 40 LTE Standard Module Series RESET_N 100 ms 4.7K Reset pulse Figure 14: Reference Circuit of RESET_N by Using Driving Circuit Figure 15: Reference Circuit of RESET_N by Using Button The reset timing is illustrated in the following figure. VBAT 100 ms RESET_N 0.5 V Module...
  • Page 41 LTE Standard Module Series ⚫ NOTE Ensure that there is no large capacitance exceeding 10 nF on PWRKEY and RESET_N pins. It is recommended to use RESET_N only when you fail to turn off the module with the ql_power_down() or PWRKEY pin. EG915U_Series_QuecOpen_Hardware_Design 40 / 96...

  • Page 42: Application Interfaces

    LTE Standard Module Series Application Interfaces 4.1. Analog Audio Interfaces The module provides one analog audio input and two analog audio output channels. The pin definition is shown in the following table. Table 12: Pin Definition of Analog Audio Interfaces Pin Name Pin No.

  • Page 43: Audio Interface Design Considerations

    LTE Standard Module Series 4.1.1. Audio Interface Design Considerations It is recommended to use the electret microphone with dual built-in capacitors (e.g., 10 pF and 33 pF) for filtering out RF interference, thus reducing TDD noise. Note that the resonant frequency point of a capacitor largely depends on the material and production technique.

  • Page 44: Earpiece Interface Design

    LTE Standard Module Series NOTE Microphone channel is sensitive to ESD, so it is not recommended to remove the ESD components. 4.1.3. Earpiece Interface Design The earpiece interface reference circuit is shown in the following figure: Close to E arpiece Differential 33 pF 10 pF...

  • Page 45: Lcm Interface

    LTE Standard Module Series 4.2. LCM Interface The LCM interface of the module supports the LCD display with a maximum resolution of 320 × 240 pixel, DMA transmission, as well as 16-bit RGB565 and YUV formats. Table 13: Pin Definition of LCM Interface Pin Name Pin No.

  • Page 46: Camera Interface

    LTE Standard Module Series 4.3. Camera Interface The module provides one camera interface supporting cameras up to 0.3 MP and supports SPI two-data-line data transmission. Table 14: Pin Definition of Camera Interface Pin Name Pin No. Description Comment Pull each of them up CAM_I2C_SCL Camera I2C clock to 1.8 V power...

  • Page 47: External Flash Interface

    LTE Standard Module Series 4.4. External Flash Interface The module supports connection to an external flash chip, and the external flash interface is multiplexed from other pins. Pin definition is detailed in the figure below. Table 15: Pin Definition of the Multiplexed External Flash Interface Pin Name Multiplex Function Description...

  • Page 48: Sd Card Interface

    LTE Standard Module Series 4.5. SD Card Interface The module provides an SD card interface compliant with SD 2.0 specification. The SD card interface is multiplexed from other pins of the module. Pin definition is detailed in the figure below. Table 16: Pin Definition of the Multiplexed SD Card Interface Multiplex Pin Name...

  • Page 49: Usb Interface

    LTE Standard Module Series ⚫ SD card needs to be powered externally. The voltage range of VDD_3V3 is 2.7–3.6 V and it should provide at least 800 mA current. The recommended voltage of VDD_3V3 is 3.2 V. ⚫ To avoid the jitter of bus, it is necessary to reserve pull-up resistors R7–R11 on the SDIO signal traces.
  • Page 50 LTE Standard Module Series Table 17: Functions of USB Interface Function √ Data transmission √ Software debugging √ Firmware upgrade The following table shows the pin definition of USB interface. Table 18: Pin Definition of USB Interface Pin Name Pin No. Description Comment 3.5 V–5.25 V.

  • Page 51: Usb_Boot Interface

    LTE Standard Module Series A common mode choke L1 is recommended to be added in series between the module and your MCU to suppress EMI spurious transmission. Meanwhile, the 0 Ω resistors (R1 and R2) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default.

  • Page 52: U)Sim Interfaces

    LTE Standard Module Series Module Test points 4.7K USB_BOOT Close to test points Figure 22: Reference Circuit of USB_BOOT Interface 4.8. (U)SIM Interfaces The module provides two (U)SIM interfaces that supports Dual SIM Single Standby. The (U)SIM interfaces circuitry meets ETSI requirement and IMT-2000 specification. Either 1.8 V or 3.0 V (U)SIM card is supported.
  • Page 53 LTE Standard Module Series automatically by the module. USIM2_DATA (U)SIM2 card data USIM2_CLK (U)SIM2 card clock USIM2_RST (U)SIM2 card reset 1.8 V power domain. USIM2_DET (U)SIM2 card hot-plug detect A test point must be reserved for debugging. The module supports (U)SIM card hot-plug via the USIM1_DET and USIM2_DET pins and both high- and low-level detections are supported.

  • Page 54: Pcm And I2C Interfaces

    LTE Standard Module Series 100 nF USIM Card Connector USIM_VDD USIM_RST Module USIM_CLK USIM_DATA 33 pF 33 pF 33 pF array Figure 24: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector To enhance the reliability and availability of the (U)SIM card in applications, follow the criteria below in (U)SIM circuit design: ⚫...
  • Page 55 LTE Standard Module Series PCM interface supports the short frame mode. In short frame mode, PCM_CLK = the number of channels × PCM_SYNC × 16 bit, where the number of channels supports 1–4 channels, but the module will only take the data on the first channel; PCM_SYNC is equal to the audio sampling rate, which supports 8–44.1 kHz.

  • Page 56: Uart Interfaces

    LTE Standard Module Series The following figure shows a reference design of I2C and PCM interfaces with an external codec IC. Figure 25: Reference Circuit of I2C and PCM Application with Audio Codec NOTE 1. It is recommended to reserve a termination resistor and a filter capacitor on the PCM traces (especially on CAM_MCLK and PCM_CLK traces).
  • Page 57 LTE Standard Module Series Table 22: Pin Definition of Main UART Interface Pin Name Pin No. Description Comment Connect to MCU’s CTS. Clear to send signal from the MAIN_CTS 1.8 V power domain. module If unused, keep it open. Connect to MCU’s RTS.
  • Page 58 LTE Standard Module Series VDD_EXT VCCA VCCB VDD_MCU 0.1 μF 0.1 μF 120K MAIN_CTS CTS_MCU Connect to the CTS of MCU Translator MAIN_RTS RTS_MCU Connect to the RTS of MCU MAIN_TXD RXD_MCU Connect to the RXD of MCU MAIN_RXD TXD_MCU Connect to the TXD of MCU Figure 26: Reference Circuit with Voltage-level Translator Please visit http://www.ti.com for more information.

  • Page 59: Adc Interfaces

    2. Do not supply any voltage to ADC pins when VBAT is removed. 3. Considering the difference of ADC voltage range among Quectel modules, when it is necessary to use ADC pins, it is strongly recommended to reserve the voltage divider circuit for better compatibility with other Quectel modules.

  • Page 60: Spi

    LTE Standard Module Series otherwise the measurement accuracy of the ADC will be significantly reduced. When the divider circuit is not used, the ADC pins require 1 kΩ resistors in series. 4.12. SPI The module provides an SPI that only supports master mode. It has a working voltage of 1.8 V and a maximum clock frequency of 25 MHz.
  • Page 61 LTE Standard Module Series Table 29: Pin Definition of Indication Signals Pin Name Pin No. Description Comment 1.8 V power STATUS Indicates the module’s operation status domain. Indicates the module’s network activity If unused, keep NET_STATUS status them open. Table 30: Working States of Indication Pins Pin Name State Network Status...
  • Page 62 LTE Standard Module Series Figure 29: Reference Circuit of STATUS EG915U_Series_QuecOpen_Hardware_Design 61 / 96...

  • Page 63: Antenna Interfaces

    LTE Standard Module Series Antenna Interfaces Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.

  • Page 64: Operating Frequency

    LTE Standard Module Series 5.1.2. Operating Frequency Table 32: Operating Frequency of EG915U-CN (Unit: MHz) Operating Frequency Transmit Receive EGSM900 880–915 925–960 DCS1800 1710–1785 1805–1880 LTE-FDD B1 1920–1980 2110–2170 LTE-FDD B3 1710–1785 1805–1880 LTE-FDD B5 824–849 869–894 LTE-FDD B8 880–915 925–960 LTE-TDD B34 2010–2025...
  • Page 65 LTE Standard Module Series LTE-FDD B7 2500–2570 2620–2690 LTE-FDD B8 880–915 925–960 LTE-FDD B20 832–862 791–821 LTE-FDD B28 703–748 758–803 Table 34: Operating Frequency of EG915U-LA (Unit: MHz) Operating Frequency Transmit Receive GSM850 824–849 869–894 PCS1900 1850–1910 1930–1990 EGSM900 880–915 925–960 DCS1800 1710–1785...

  • Page 66: Reference Design Of Antenna Interfaces

    LTE Standard Module Series 5.1.3. Reference Design of Antenna Interfaces A reference design of ANT_MAIN pin and ANT_BT/WIFI_SACN pin are shown as below. A π-type matching circuit and ESD protection device should be reserved for better RF performance. The capacitors are not mounted by default.
  • Page 67 LTE Standard Module Series Figure 31: Microstrip Design on a 2-layer PCB Figure 32: Coplanar Waveguide Design on a 2-layer PCB Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EG915U_Series_QuecOpen_Hardware_Design 66 / 96...
  • Page 68 LTE Standard Module Series Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.

  • Page 69: Antenna Installation

    LTE Standard Module Series 5.2. Antenna Installation 5.2.1. Antenna Design Requirements Table 35: Antenna Design Requirements Type Requirement VSWR: ≤ 2 Efficiency: > 30 % Max. input power: 50 W Input impedance: 50 Ω GSM/LTE Cable insertion loss: < 1 dB: LB (< 1 GHz) <...
  • Page 70 LTE Standard Module Series Figure 36: Specifications of Mated Plugs The following figure describes the space factor of mated connector. Figure 37: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://hirose.com. EG915U_Series_QuecOpen_Hardware_Design 69 / 96...

  • Page 71: Electrical Characteristics & Reliability

    LTE Standard Module Series Electrical Characteristics & Reliability 6.1. Absolute Maximum Ratings Table 36: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 USB_VBUS -0.3 Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage on Digital Pins -0.3 Voltage at ADC0 VBAT Voltage at ADC1 VBAT...

  • Page 72: Power Consumption

    LTE Standard Module Series USB connection USB_VBUS 5.25 detection 6.3. Power Consumption Table 38: EG915U-CN Current Consumption Description Condition Typ. Unit OFF state Power down µA Minimum Functionality Mode (USB disconnected) Minimum Functionality Mode (USB connected) Airplane Mode (USB disconnected) Airplane Mode (USB connected) EGSM900 @ DRX = 2 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected)
  • Page 73 LTE Standard Module Series LTE-TDD @ PF = 64 (USB disconnected) LTE-TDD @ PF = 64 (USB connected) LTE-TDD @ PF = 128 (USB disconnected) LTE-TDD @ PF = 256 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) 12.6 EGSM900 @ DRX = 5 (USB connected) 28.6 LTE-FDD @ PF = 64 (USB disconnected)
  • Page 74 LTE Standard Module Series DCS1800 1DL/4UL @ 23.94 dBm EGSM900 PCL = 5 @ 32.89 dBm EGSM900 PCL = 12 @ 19.41 dBm EGSM900 PCL = 19 @ 6.33 dBm GSM voice call DCS1800 PCL = 0 @ 29.99 dBm DCS1800 PCL = 7 @ 16.09 dBm DCS1800 PCL = 15 @ 1.26 dBm EGSM900 PCL = 5 @ 32.83 dBm...
  • Page 75 LTE Standard Module Series DCS1800 @ DRX = 5 (USB disconnected) DCS1800 @ DRX = 5 (USB connected) DCS1800 @ DRX = 9 (USB disconnected) LTE-FDD @ PF = 32 (USB disconnected) LTE-FDD @ PF = 64 (USB disconnected) LTE-FDD @ PF = 64 (USB connected) LTE-FDD @ PF = 128 (USB disconnected) LTE-FDD @ PF = 256 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected)
  • Page 76 LTE Standard Module Series EGSM900 2DL/3UL @ 28.37 dBm EGSM900 1DL/4UL @ 26.33 dBm DCS1800 4DL/1UL @ 29.42 dBm DCS1800 3DL/2UL @ 27.95 dBm DCS1800 2DL/3UL @ 25.89 dBm DCS1800 1DL/4UL @ 23.79 dBm PCS1900 4DL/1UL @ 29.89 dBm PCS1900 3DL/2UL @ 27.78 dBm PCS1900 2DL/3UL @ 25.86 dBm PCS1900 1DL/4UL @ 23.70 dBm GSM850 PCL = 5 @ 32.62 dBm...
  • Page 77 LTE Standard Module Series EGSM900 PCL = 5 @ 32.34 dBm 1.72 EGSM900 PCL = 12 @ 19.06 dBm 0.44 EGSM900 PCL = 19 @ 5.39 dBm 0.19 DCS1800 PCL = 0 @ 29.89 dBm 1.13 DCS1800 PCL = 7 @ 15.96 dBm 0.30 DCS1800 PCL = 15 @ 0.95 dBm 0.16...
  • Page 78 LTE Standard Module Series LTE-FDD @ PF = 64 (USB disconnected) 1.80 LTE-FDD @ PF = 64 (USB connected) 3.24 LTE-FDD @ PF = 128 (USB disconnected) 1.41 LTE-FDD @ PF = 256 (USB disconnected) 1.23 EGSM900 @ DRX = 5 (USB disconnected) 12.11 EGSM900 @ DRX = 5 (USB connected) 27.26...

  • Page 79: Tx Power

    LTE Standard Module Series DCS1800 2DL/3UL @ 26.79 dBm DCS1800 1DL/4UL @ 24.79 dBm PCS1900 4DL/1UL @ 29.51 dBm PCS1900 3DL/2UL @ 28.36 dBm PCS1900 2DL/3UL @ 26.30 dBm PCS1900 1DL/4UL @ 24.22 dBm GSM850 PCL = 5 @ 32.82 dBm GSM850 PCL = 12 @ 19.08 dBm GSM850 PCL = 19 @ 6.12 dBm EGSM900 PCL = 5 @ 32.34 dBm...

  • Page 80: Rx Sensitivity

    LTE Standard Module Series LTE-TDD B34/B38/B39/B40/B41 23 dBm ± 2 dB < -39 dBm Table 42: EG915U-EU RF Output Power Frequency Band Max. RF Output Power Min. RF Output Power GSM850/EGSM900 33 dBm ± 2 dB 5 dBm ± 5 dB DCS1800/PCS1900 30 dBm ±...
  • Page 81 LTE Standard Module Series LTE-TDD B34 (10 MHz) -96.3 LTE-TDD B38 (10 MHz) -97.6 -96.3 LTE-TDD B39 (10 MHz) -98.4 -96.3 LTE-TDD B40 (10 MHz) -98.3 -96.3 LTE-TDD B41 (10 MHz) -94.3 Table 45: EG915U-EU Conducted RF Receiver Sensitivity (Unit: dBm) Receiver Sensitivity (Typ.) Frequency 3GPP (SIMO)

  • Page 82: Esd Protection

    LTE Standard Module Series EGSM900 -106.8 -102 DCS1800 -107.5 -102 PCS1900 -107.2 -102 LTE-FDD B2 (10 MHz) -98.1 -94.3 LTE-FDD B3 (10 MHz) -98.2 -93.3 LTE-FDD B4 (10 MHz) -97.5 -96.3 LTE-FDD B5 (10 MHz) -97.4 -94.3 LTE-FDD B7 (10 MHz) -96.1 -94.3 LTE-FDD B8 (10 MHz)

  • Page 83: Operating And Storage Temperatures

    LTE Standard Module Series 6.7. Operating and Storage Temperatures Table 48: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit Operating Temperature Range º C Extended Temperature Range º C Storage Temperature Range º C Within this range, the module’s indicators comply with 3GPP specification requirements. Within this range, the module retains the ability to establish and maintain functions such as voice, SMS, emergency call, etc., without any unrecoverable malfunction.

  • Page 84: Mechanical Information

    LTE Standard Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 38: Module Top and Side Dimensions (Unit: mm) EG915U_Series_QuecOpen_Hardware_Design 83 / 96...
  • Page 85 LTE Standard Module Series Figure 39: Module Bottom Dimensions ⚫ NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. EG915U_Series_QuecOpen_Hardware_Design 84 / 96...

  • Page 86: Recommended Footprint

    LTE Standard Module Series 7.2. Recommended Footprint Figure 40: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. EG915U_Series_QuecOpen_Hardware_Design 85 / 96...

  • Page 87: Top And Bottom Views

    7.3. Top and Bottom Views Figure 41: Top and Bottom Views NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EG915U_Series_QuecOpen_Hardware_Design 86 / 96...

  • Page 88: Storage, Manufacturing & Packaging

    LTE Standard Module Series Storage, Manufacturing & Packaging 8.1. Storage Conditions Module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ± 5 ° C and the relative humidity should be 35–60 %.

  • Page 89: Manufacturing And Soldering

    LTE Standard Module Series NOTE To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.
  • Page 90 Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g., selective soldering, ultrasonic soldering) that is not mentioned in document [11].

  • Page 91: Packaging Specification

    LTE Standard Module Series 8.3. Packaging Specification This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow: 8.3.1.

  • Page 92: Plastic Reel

    LTE Standard Module Series 8.3.2. Plastic Reel Figure 44: Plastic Reel Dimension Drawing Table 51: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 44.5 8.3.3. Mounting Direction Figure 45: Mounting Direction EG915U_Series_QuecOpen_Hardware_Design 91 / 96...

  • Page 93: Packaging Process

    LTE Standard Module Series 8.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules.

  • Page 94: Appendix References

    LTE Standard Module Series Appendix References Table 52: Related Documents Document Name [1] Quectel_EG915U_Series_QuecOpen_GPIO_Configuration [2] Quectel_LTE_OPEN_EVB_User_Guide [3] Quectel_EC200U&EG91xU_Series_QuecOpen(SDK)_Device_Management_API_Reference_ Manual [4] Quectel_EC200U&EG91xU_Series_QuecOpen(SDK)_Low_Power_Consumption_API_Reference_ Manual [5] Quectel_EC200U&EG91xU_Series_QuecOpen(SDK)_PSM_Application_Note [6] Quectel_EC200U&EG91xU_Series_QuecOpen(SDK)_Booting&Shutdown_Development_Guide [7] Quectel_EG915U_Series_QuecOpen_Reference_Design [8] Quectel_EC200U&EG91xU_Series_QuecOpen(SDK)_(U)SIM_API_Reference_Manual [9] Quectel_EC200U&EG91xU_Series_QuecOpen(SDK)_ADC_Development_Guide [10] Quectel_RF_Layout_Application_Note [11] Quectel_Module_SMT_User_Guide Table 53: Terms and Abbreviations Abbreviation Description Analog-to-Digital Converter...
  • Page 95 LTE Standard Module Series Coding Scheme Clear To Send DFOTA Delta Firmware Upgrade Over The Air Downlink Direct Memory Access Discontinuous Reception Diversity Receive Data Terminal Ready Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex GRFC General RF Control High Band Half Rate Input/Output Low Band...
  • Page 96 LTE Standard Module Series Printed Circuit Board Pulse Code Modulation Protocol Data Unit Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying R&D Research and Development Ring Indicator Radio Frequency Receive SIMO Single Input Multiple Output Short Message Service Serial Peripheral Interface Time Division Duplexing Transmit UART...
  • Page 97 LTE Standard Module Series Minimum Low-level Input Voltage Maximum High-level Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Minimum Low-level Output Voltage VSWR Voltage Standing Wave Ratio EG915U_Series_QuecOpen_Hardware_Design 96 / 96...

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