Technical Features Of The Motherboard - Siemens Simatic IPC647C Operating Instructions Manual

Detailed descriptions
16.1 Motherboard
16.1.2

Technical features of the motherboard

Component / interface
Chipset
BIOS
CPU
Memory
Graphics
Hard disk
DVD ROM
DVD ROM/CD RW
Floppy
Keyboard
Mouse
Serial
Parallel
148
Description
Single chipset
Update by means of
software
Intel® Core™ i
2 DIMM module slots,
max. 4 GB per module
Integrated in chipset
Various SATA modes,
4
AHCI, RAID 0, 1 and
RAID 5 can be set
SATA interface
4
4
FD drive interface
4
PS/2 keyboard
interface
PS/2 mouse interface
COM1/9-pin
COM2/9-pin
Standard, bi-directional,
EPP and ECP mode
Parameters
Mobile Intel® 5 chipset QM57 Express

(Platform Controller Hub)
Insyde modified by Siemens

VT and multimedia support

Turbo Boost and AMT, depending on CPU

On Board cache with 3M/4M depending on

CPU
Data width of 64/72 bits (without ECC / with

ECC)
3.3 V

DDR3-SDRAM in accordance with PC3-8500

specification
1 to 2 Gbit chip size on the module

1066MT/sec transfer rate

Variable from 1 GB to 8 GB / DIMM

With and without ECC

Mobile CPU with integrated "Hi-K process

Graphics" Graphics Controller and
Mobile Intel® QM57 Express (Platform Controll

er Hub)
– VGA:
2560x1600/32-bit color depth/120 Hz to
2560x1600 at 60 Hz/32-bit color depth
– DVI-I:
2048x1152/32-bit color depth/60 Hz
Graphics memory:

Up to 1.7 GB, used in system memory, 32 MB
reserved.
Compatible to SATA 150 / 300

Supports NCQ (Native Command Queuing)

Compatible to SATA 150 / 300

1.44 MB

Standard

Standard

V.24

25-pin D-sub

Operating Instructions, 12/2010, A5E02669337-02
SIMATIC IPC647C